公开(公告)号：US5681757A

公开(公告)日：1997-10-28

申请号：US639435

申请日：1996-04-29

申请人： Donald J. Hayes

发明人： Donald J. Hayes

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/68

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L21/6715 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  Y10T29/41

摘要： The present invention relates to the process of die bonding semiconductor integrated circuit microchips with adhesive deposited from microjets in a precise pattern. Print-head technology equivalent to that used in inkjet printers is used to apply the adhesive substance (most commonly an epoxy). The use of microjets in an "array printhead" to deposit an adhesive pattern provides advantages in the ability to control the location and size of the adhesive droplets with a high degree of precision. The method also provides for individual actuation of the microjets providing the ability to rapidly change from pattern to pattern without the need to change and clean heads and equipment or to provide multiple heads. The method has application in standard die bonding as well as "flip-chip" processes using "bumped dies." The high degree of precision available allows adhesive to be printed in between the solder bumps of a "bumped die" providing stronger bonding and an underfill without interfering with the electrical connection created by the solder bumps. Also disclosed is a novel method for accomplishing a "flip-chip" process in which the array printhead is used to print conductive epoxy directly on the interconnect pads of the die, replacing the solder bumps of a standard "bumped die." The die is then aligned and placed onto a substrate, with the conductive epoxy serving as both the conductive path and a strong adhesive bonding agent.

摘要翻译： 本发明涉及以精确图案从微型喷枪沉积的粘合剂的半导体集成电路微芯片的芯片接合工艺。 使用与喷墨打印机相同的打印头技术来应用粘合剂物质（最常见的是环氧树脂）。 在“阵列打印头”中使用微喷射器沉积粘合剂图案提供了以高精度控制粘合剂液滴的位置和尺寸的能力的优点。 该方法还提供了微型喷嘴的单独致动，其提供了从图案快速变化到图案的能力，而不需要改变和清洁头部和设备或提供多个头部。 该方法在标准芯片焊接以及使用“凸模”的“倒装芯片”工艺中都有应用。 高精度的可用性允许将粘合剂印刷在“凸起的芯片”的焊料凸块之间，从而提供更强的粘结和底部填充，而不会妨碍由焊料凸块产生的电连接。 还公开了一种用于实现“倒装芯片”工艺的新方法，其中使用阵列打印头直接在芯片的互连焊盘上打印导电环氧树脂，以代替标准“凸模”的焊料凸块。 然后将模具对准并放置在基板上，导电环氧树脂既用作导电路径又具有强粘合剂。

公开(公告)号：US5622897A

公开(公告)日：1997-04-22

申请号：US272145

申请日：1994-07-08

申请人： Donald J. Hayes

发明人： Donald J. Hayes

IPC分类号： B41J2/045 ,  B41J2/14 ,  B41J2/16 ,  H01L35/28 ,  B41J2/175 ,  H01L21/68

CPC分类号： B41J2/1623 ,  B41J2/04528 ,  B41J2/04563 ,  B41J2/04581 ,  B41J2/14209 ,  B41J2/1609 ,  B41J2/1632 ,  B41J2002/14403 ,  B41J2202/08

摘要： A process for manufacturing a drop-on-demand ink jet printhead having thermoelectric temperature control apparatus incorporated therewith for the selective heating or cooling thereof and a method of manufacturing the same. The ink jet printhead includes a channel array constructed of a thermally conductive material, a spaced series of internal ink-carrying channels which extend rearwardly from a front side surface and a piezoelectric actuator acoustically coupled to each of the ink-carrying channels for selectively imparting pressure pulses thereto. N-type and p-type thermoelectric carriers are mounted to a top side surface of the channel array and then serially connected to a temperature controller. By applying electrical power to the n-type and p-type thermoelectric carriers, heat will be transferred between the channel array and a cover plate mounted to top side surfaces of the n-type and p-type thermoelectric carriers. In this manner, the channel array may be selectively heated or cooled.

摘要翻译： 一种用于制造按需喷墨打印头的方法，其具有并入其中的用于选择性加热或冷却的热电温度控制装置及其制造方法。 喷墨打印头包括由导热材料构成的通道阵列，从前侧表面向后延伸的间隔的一系列内部墨水承载通道和声耦合到每个墨水输送通道的压电致动器，用于选择性地施加压力 脉冲。 N型和p型热电载体安装到通道阵列的顶侧表面，然后串联连接到温度控制器。 通过对n型和p型热电载体施加电力，将在通道阵列和安装在n型和p型热电载体的顶侧表面的盖板之间传递热量。 以这种方式，可以选择性地加热或冷却通道阵列。

公开(公告)号：US5581286A

公开(公告)日：1996-12-03

申请号：US371888

申请日：1995-01-12

申请人： Donald J. Hayes ,  David B. Wallace

发明人： Donald J. Hayes ,  David B. Wallace

IPC分类号： B23K26/38 ,  B41J2/045 ,  B41J2/14 ,  B41J2/16 ,  B41J2/21 ,  B41J2/205

CPC分类号： B41J2/04581 ,  B23K26/389 ,  B23K26/40 ,  B41J2/0458 ,  B41J2/04593 ,  B41J2/14209 ,  B41J2/1433 ,  B41J2/2128 ,  B23K2203/52 ,  B41J2002/14379

摘要： A spot size modulatable, drop-on-demand type ink jet printhead and associated methods for ejecting volume modulatable droplets of ink therefrom. The ink jet printhead includes a main body portion having first and second ink carrying channels longitudinally extending therethrough and a cover plate fixedly mounted thereto. Formed in the cover plate is a tapered orifice which extends from first and second openings along a back side surface to a third opening along a front side surface thereof. The cover plate is mounted to the main body portion such that the first opening is in communication with the first ink carrying channel and the second opening is in communication with the second ink carrying channel. The ink jet printhead further includes first and second actuators coupled with the first and second ink carrying channels, respectively. Volume modulatable droplets of ink may be ejected from the ink jet printhead by simultaneously applying a voltage pulse having a selected magnitude to the first ink carrying channel and a voltage pulse having a magnitude ranging between zero and the selected magnitude to the second ink carrying channel. Alternately, volume modulatable droplets of ink may be ejected from the ink jet printhead by sequentially applying a voltage pulse having a selected time duration to the first ink carrying channel and a voltage pulse having a time duration ranging between zero and the selected time duration to the second ink carrying channel.

摘要翻译： 点尺寸可调节的按需喷墨打印头和用于从其中排出墨水的体积可调节液滴的相关方法。 喷墨打印头包括主体部分，其具有纵向延伸穿过其中的第一和第二墨水输送通道和固定地安装在其上的盖板。 在盖板中形成有锥形孔，其从第一和第二开口沿着背侧表面沿着其前侧表面延伸到第三开口。 盖板安装到主体部分，使得第一开口与第一墨水输送通道连通，第二开口与第二墨水输送通道连通。 喷墨打印头还包括分别与第一和第二墨水输送通道耦合的第一和第二致动器。 可以通过将具有选定幅度的电压脉冲同时施加到第一墨水承载通道和具有在零和所选大小之间的幅度范围的电压脉冲到第二墨水承载通道而从墨水喷射打印头喷射体积可调节墨水的墨滴。 或者，可以通过将具有选定持续时间的电压脉冲顺序地施加到第一墨水携带通道和具有从0到所选择的持续时间之间的持续时间范围的电压脉冲，从墨喷射打印头喷射体积可调节的墨水滴 第二墨水通道。

公开(公告)号：US5481285A

公开(公告)日：1996-01-02

申请号：US232695

申请日：1994-04-25

申请人： John R. Pies ,  Donald J. Hayes

发明人： John R. Pies ,  Donald J. Hayes

IPC分类号： B41J2/045 ,  B05C11/08 ,  B05D1/00 ,  B05D1/40 ,  B41J2/055 ,  B41J2/16

CPC分类号： B05C11/08 ,  B05D1/005 ,  Y10T428/24777 ,  Y10T428/24793 ,  Y10T428/24802 ,  Y10T428/265 ,  Y10T428/31504

摘要： A method for film coated passivation of individual grooves or channels in an array of closely spaced grooves or channels of a workpiece, for example, ink channels in a printhead employed in an ink jet printer device; includes the steps of placing the workpiece on a rotation plate having a rotational center, securing the workpiece to the rotation plate with the grooves directed radially outward from the rotational center of the rotation plate, placing resin upon the workpiece in the vicinity of the grooves, and spinning the rotation plate to cause the resin to migrate along the surfaces of the grooves and thereby coating them.

摘要翻译： 用于在喷墨打印机装置中使用的打印头中的油墨通道的工件的紧密间隔的凹槽或通道的阵列中的单个凹槽或通道的薄膜涂覆钝化的方法; 包括将工件放置在具有旋转中心的旋转板上的步骤，将工件固定到旋转板上，其中凹槽从旋转板的旋转中心径向向外指向，将树脂放置在工件附近的凹槽中， 并旋转旋转板以使树脂沿着凹槽的表面迁移并由此涂覆。

公开(公告)号：US5433809A

公开(公告)日：1995-07-18

申请号：US149717

申请日：1993-11-09

申请人： John R. Pies ,  David B. Wallace ,  Donald J. Hayes

发明人： John R. Pies ,  David B. Wallace ,  Donald J. Hayes

IPC分类号： B41J2/045 ,  B41J2/055 ,  B41J2/14 ,  B41J2/16 ,  B32B31/18

CPC分类号： B41J2/1623 ,  B41J2/14209 ,  B41J2/1609 ,  B41J2/1618 ,  B41J2/1632 ,  B41J2002/14379 ,  Y10T156/1064 ,  Y10T156/1082 ,  Y10T29/42 ,  Y10T29/49401

摘要： Method for manufacturing a sidewall actuatable, high density channel array for an ink jet printhead. A first surface of a main body portion formed from an active material is conductively bonded to a first surface of a first intermediate body portion formed from an active material. A plurality of parallel grooves are then machined through the first intermediate body portion and part of the main body portion to form a plurality of channels separated by a corresponding plurality of sidewall actuators comprised of a first sidewall section formed from an active material and a second sidewall section formed from an active material. A top body portion is then conductively mounted to the intermediate body portion.

摘要翻译： 制造用于喷墨打印头的可侧壁致动的高密度通道阵列的方法。 由活性材料形成的主体部分的第一表面与由活性材料形成的第一中间体部分的第一表面导电地结合。 然后通过第一中间体部分和主体部分的一部分加工多个平行的凹槽，以形成由相应的多个侧壁致动器隔开的多个通道，该侧壁致动器包括由活性材料形成的第一侧壁部分和第二侧壁 由活性物质形成。 然后将顶部主体部分导电地安装到中间体部分。

公开(公告)号：US5411602A

公开(公告)日：1995-05-02

申请号：US197750

申请日：1994-02-17

申请人： Donald J. Hayes

发明人： Donald J. Hayes

IPC分类号： B22F1/00 ,  B22F9/08 ,  B23K35/02 ,  H05K3/34 ,  B23K35/34

CPC分类号： H05K3/3484 ,  B22F1/0048 ,  B22F9/08 ,  B23K35/025 ,  B22F2999/00 ,  H05K2201/0266

摘要： Spherical solder drops having precise and accurate shape are formed by an ejection device and solidified to form solder balls for making solder pastes. The diameters of the solidified solder balls are determined by an excitation signal applied to the ejection device and changes in the diameter of the orifice in the ejection device. A solder paste is produced by mixing solidified solder balls of a single diameter or a combination of several different diameters with a carrier.

摘要翻译： 通过喷射装置形成具有精确和精确形状的球形焊料滴，并固化以形成用于制造焊膏的焊球。 凝固的焊球的直径由施加到喷射装置的激发信号和喷射装置中的孔的直径的变化来确定。 通过将单个直径的固化焊球或几个不同直径的组合与载体混合来制造焊膏。

公开(公告)号：US5235352A

公开(公告)日：1993-08-10

申请号：US748220

申请日：1991-08-16

申请人： John R. Pies ,  David B. Wallace ,  Donald J. Hayes

发明人： John R. Pies ,  David B. Wallace ,  Donald J. Hayes

IPC分类号： B41J2/045 ,  B41J2/055 ,  B41J2/14 ,  B41J2/15 ,  B41J2/155 ,  B41J2/16 ,  B41J2/21

CPC分类号： B41J2/1623 ,  B41J2/14209 ,  B41J2/15 ,  B41J2/155 ,  B41J2/1609 ,  B41J2/1618 ,  B41J2/1632 ,  B41J2/2103 ,  B41J2002/14379

摘要： An ink jet printhead for a drop-on-demand type ink jet printing system. The printhead includes a base section having a series of generally parallel spaced projections extending longitudinally therealong, a series of intermediate sections conductively mounted on a top side of a corresponding one of the series of base section projections and a top section conductively mounted to a top side of each of the series of intermediate sections.

公开(公告)号：US5229016A

公开(公告)日：1993-07-20

申请号：US742362

申请日：1991-08-08

申请人： Donald J. Hayes ,  Michael T. Boldman ,  David B. Wallace

发明人： Donald J. Hayes ,  Michael T. Boldman ,  David B. Wallace

IPC分类号： B23K3/06 ,  H05K3/34

CPC分类号： B23K3/0623 ,  B23K2201/42 ,  H05K3/3457

摘要： A method and apparatus for producing solidified solder balls and for ejecting generally spherical-shaped drops of liquid solder through a controlled atmosphere to impact on a surface to be wetted is disclosed. The apparatus comprises a preload reservoir to hold and maintain solder in a liquid state, an ejection chamber to hold and maintain the solder in a liquid state, a connection between the preload reservoir and the ejection chamber to allow liquid solder in the preload reservoir to be transferred to the ejection chamber while maintaining the oxides in the preload reservoir, a device to pressurize the ejection chamber with an inert gas and an ejection device operatively connected to receive liquid solder from the ejection chamber and to eject generally spherical-shaped drops of liquid solder to a specific location on a surface to be wetted. Structure is included to provide an atmosphere of inert gas between the ejection device and the specific location on a surface to be wetted.The method includes the steps of maintaining solder in a liquid state in a reservoir, transferring solder in the liquid state from the reservoir to an ejection chamber, maintaining the transferred solder in a liquid state in the ejection chamber, pressurizing the ejection chamber with an inert gas, transferring solder in the liquid state from the ejection chamber to an ejection device, ejecting generally spherical-shaped drops of liquid solder from said ejection device to a specific location on a surface to be wetted. An atmosphere of inert gas is provided between the ejection device and the specific location on a surface to be wetted.

摘要翻译： 公开了一种用于生产固化的焊球并通过可控气氛喷射大致球形的液体焊料滴以冲击待润湿的表面的方法和装置。 该装置包括用于保持和保持处于液态的焊料的预载储存器，用于保持和保持焊料处于液态的喷射室，预负载储存器和喷射室之间的连接，以允许预负载储存器中的液体焊料为 转移到喷射室，同时保持预压储存器中的氧化物，用惰性气体对喷射室加压的装置和可操作地连接以从喷射室接收液体焊料并喷射大致球形的液体焊料滴的装置 到要润湿的表面上的特定位置。 包括结构以在喷射装置和待润湿的表面上的特定位置之间提供惰性气体的气氛。 该方法包括以下步骤：在储存器中保持处于液态的焊料，将液态的焊料从贮存器转移到喷射室，将转移的焊料保持在喷射室中的液态，并以惰性的方式对喷射室加压 气体，将液体状态的焊料从喷射室传送到喷射装置，将大致球形的液体焊料液滴从所述喷射装置喷射到待润湿的表面上的特定位置。 在喷射装置和待润湿表面上的特定位置之间设置惰性气体气氛。

公开(公告)号：US4853317A

公开(公告)日：1989-08-01

申请号：US177131

申请日：1988-04-04

申请人： Donald J. Hayes

发明人： Donald J. Hayes

IPC分类号： G03F1/00 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06

CPC分类号： G03F7/2018 ,  H05K1/0266 ,  H05K3/0082 ,  H05K1/0393 ,  H05K2201/09781 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2203/013 ,  H05K2203/0551 ,  H05K3/064

摘要： A method and apparatus for providing serialization of printed circuit boards and flex circuits during the normal process of manufacture of the boards and circuits is disclosed and includes a print module which prints the serializing information on the surface of the photoresist material with a fluid, which blocks the passage of ultraviolet radiation, before the photoresist material is exposed to ultraviolet radiation through the photomask. If a negative-acting photoresist material is used, the serializing information is reverse printed on the surface of the negative-acting photoresist material. If a positive-acting photoresist material is used, the serializing information is printed on the surface of the positive-acting photoresist material.

摘要翻译： 公开了一种用于在板和电路的正常制造过程中提供印刷电路板和柔性电路串联化的方法和装置，其包括印刷模块，该印刷模块用流体将光致抗蚀剂材料的表面上的串行化信息打印， 在光致抗蚀剂材料通过光掩模暴露于紫外线辐射之前紫外线辐射的通过。 如果使用负性光致抗蚀剂材料，则在负性光致抗蚀剂材料的表面上反向印刷串行化信息。 如果使用正性光致抗蚀剂材料，则将序列化信息印刷在正性光致抗蚀剂材料的表面上。

公开(公告)号：US06390453B1

公开(公告)日：2002-05-21

申请号：US09845714

申请日：2001-04-30

申请人： Christopher J. Frederickson ,  Donald J. Hayes ,  David B. Wallace ,  David W. Taylor ,  Matthew D. Hayes

发明人： Christopher J. Frederickson ,  Donald J. Hayes ,  David B. Wallace ,  David W. Taylor ,  Matthew D. Hayes

IPC分类号： B01F304

CPC分类号： B01F3/04049 ,  A61M11/001 ,  A61M11/042 ,  A61M15/02 ,  A61M15/025 ,  A61M2205/8206 ,  B01F3/022 ,  B01F15/0255 ,  F24F2003/1689 ,  Y10S261/65 ,  Y10S261/88

摘要： A method and apparatus is disclosed which employs a pulse-controlled microdroplet fluid delivery system for precisely dispensing fragrances and other odor producing vapors. The pulse-controlled fluid delivery device is capable of ejecting microdroplets of fluid with a diameter less than 350 micrometers at a controlled ejection rate based upon ink-jet printing technology. The pulse-controlled fluid delivery system includes mechanisms for vaporizing the fluids and delivery of the vapors to the nose, which is controlled by a programmable system controller capable of real time data-driven dispensing with a multi-fluid capability. Synthesis of custom fragrances is made possible by a multijet programmed control system which adjusts dispensing rates of components. Calibration of a prior art “electronic nose” is disclosed. A precise calibration gas is produced in real-time to counteract the effect of drifting.

摘要翻译： 公开了一种采用脉冲控制微滴流体输送系统来精确地分配香料和其它产生气味的蒸气的方法和装置。 脉冲控制流体输送装置能够以基于喷墨打印技术的受控喷射速率喷射直径小于350微米的流体微滴。 脉冲控制流体输送系统包括用于蒸发流体和将蒸气输送到鼻子的机构，其由可实时数据驱动分配多流体能力的可编程系统控制器控制。 通过调整组件的分配速率的多喷射编程控制系统可以实现定制香料的合成。 公开了现有技术的“电子鼻”的校准。 实时精确校准气体，以抵消漂移的影响。