公开(公告)号：US20070126800A1

公开(公告)日：2007-06-07

申请号：US11471490

申请日：2006-06-21

申请人： Dong-sik Shim ,  Hyung Choi ,  Min-soo Kim

发明人： Dong-sik Shim ,  Hyung Choi ,  Min-soo Kim

IPC分类号： B41J2/05

CPC分类号： B41J2/14129 ,  B41J2/1412

摘要： A heater to control an ink bubble, and an inkjet printhead having the heater. The heater has different resistances according to portions thereof.

摘要翻译： 用于控制墨水泡的加热器和具有加热器的喷墨打印头。 加热器根据其部分具有不同的电阻。

公开(公告)号：US20050151269A1

公开(公告)日：2005-07-14

申请号：US11012294

申请日：2004-12-16

申请人： Hoon Song ,  Dong-sik Shim

发明人： Hoon Song ,  Dong-sik Shim

IPC分类号： H01L21/60 ,  H01L23/13 ,  H01L23/485 ,  H01L29/06 ,  H05K1/11 ,  H05K3/34 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L23/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05557 ,  H01L2224/05559 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05578 ,  H01L2224/05599 ,  H01L2224/10145 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/81365 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/381 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/05552 ,  H01L2924/00

摘要： A flip-chip package for implementing a fine solder ball, and a flip-chip packaging method using the same. The flip-chip package includes a first wafer having a first electrode and a first under bump metal (UBM) formed on the first electrode and electrically connected to the first electrode; and second wafer opposing the first wafer and having a second electrode located in a position corresponding to the first electrode, and a second UBM formed on the second electrode and electrically connected to the second electrode. The first wafer has a depression formed on one or more areas adjacent to the first UBM, which depression partly receives a solder ball that connects the first and the second UBMs upon flip-chip bonding of the first and second wafers. Since the UBM is formed as an embossing pattern, a fine solder ball can be implemented. Additionally, the reliability of the package can be improved.

摘要翻译： 一种用于实现精细焊球的倒装芯片封装以及使用其的倒装芯片封装方法。 倒装芯片封装包括具有形成在第一电极上并电连接到第一电极的第一电极和第一下凸块金属（UBM）的第一晶片; 以及与所述第一晶片相对并且具有位于对应于所述第一电极的位置的第二电极的第二晶片，以及形成在所述第二电极上并电连接到所述第二电极的第二UBM。 第一晶片具有形成在与第一UBM相邻的一个或多个区域上的凹陷部，该凹陷部分地接收在第一和第二晶片倒装芯片接合时连接第一和第二UBM的焊球。 由于UBM形成为压花图案，因此可以实现精细的焊球。 此外，可以提高包装的可靠性。

公开(公告)号：US07810911B2

公开(公告)日：2010-10-12

申请号：US11742816

申请日：2007-05-01

申请人： Dong-sik Shim ,  Yong-seop Yoon ,  Moon-chul Lee ,  Yong-won Jeong ,  Hyung Choi

发明人： Dong-sik Shim ,  Yong-seop Yoon ,  Moon-chul Lee ,  Yong-won Jeong ,  Hyung Choi

IPC分类号： B41J2/05

CPC分类号： B41J2/14129 ,  B41J2/14072

摘要： A thermal inkjet printhead includes a plurality of bonding pads to which an external voltage is applied, a plurality of common wires connected to the each of the bonding pads, respectively, a plurality of individual wires connected to each of the common wires, respectively, and heaters connected to each of the individual wires, respectively, to generate ink bubbles by heating ink, wherein each of the common wires includes a first metal layer and a first metal bump which are formed on the first metal layer.

摘要翻译： 热喷墨打印头包括分别施加有外部电压的多个接合焊盘，分别连接到每个接合焊盘的多个公共电线，分别连接到每个公共电线的多个单独电线，以及 加热器分别连接到各个电线，以通过加热墨水来产生墨水气泡，其中每个公共电线包括形成在第一金属层上的第一金属层和第一金属凸块。

公开(公告)号：US20080297564A1

公开(公告)日：2008-12-04

申请号：US11935539

申请日：2007-11-06

申请人： Yong-won Jeong ,  Hyung Choi ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim

发明人： Yong-won Jeong ,  Hyung Choi ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim

IPC分类号： B41J2/14 ,  B41J2/04

CPC分类号： B41J2/17563 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2002/14403

摘要： An inkjet printhead includes a substrate in which an ink feed hole is formed, a plurality of ejection devices formed on the substrate at sides of the ink feed hole, a chamber layer stacked on the substrate and in which a plurality of ink chambers, which correspond to the ejection devices and in which ink supplied from the ink feed hole is filled, are formed, and a nozzle layer in which a plurality of nozzles corresponding to the ink chambers are formed, wherein the ink feed hole includes a plurality of through holes formed through the substrate in the thickness direction thereof.

摘要翻译： 喷墨打印头包括其中形成有供墨孔的基板，在供墨孔的侧面形成在基板上的多个喷射装置，堆叠在基板上的室层，其中对应于多个墨室 形成喷墨装置并且从供墨孔供应的油墨被填充，并且形成有与油墨室相对应的多个喷嘴的喷嘴层，其中所述供墨孔包括形成的多个通孔 通过基板的厚度方向。

公开(公告)号：US07416675B2

公开(公告)日：2008-08-26

申请号：US11453012

申请日：2006-06-15

申请人： Dong-sik Shim ,  Hyung Choi ,  Yong-seop Yoon

发明人： Dong-sik Shim ,  Hyung Choi ,  Yong-seop Yoon

IPC分类号： G01D15/00

CPC分类号： B41J2/1603 ,  B41J2/1626 ,  B41J2/1635 ,  B41J2/1639 ,  B41J2/1643

摘要： A method of fabricating inkjet print heads usable in an ink jet printer. The method of fabricating ink jet print heads includes preparing a plurality of ink jet print heads on a wafer while forming sub sidewalls around the ink jet print heads when the ink jet print heads are being prepared, attaching protection films onto the sub sidewalls of the wafer and the ink jet print heads, and dicing the ink jet print heads and detaching the individual ink jet print heads from the wafer. In the method, the ink jet print heads are diced in a wafer unit. Particularly, connect pads of the ink jet print heads can be prevented from being contaminated by the protection films.

摘要翻译： 一种制造可用于喷墨打印机的喷墨打印头的方法。 制造喷墨打印头的方法包括：当准备喷墨打印头时，在晶片上准备多个喷墨打印头，同时在喷墨打印头周围形成副侧壁，将保护膜附着在晶片的子侧壁上 和喷墨打印头，并且对喷墨打印头进行切割并将各个喷墨打印头从晶片上分离出来。 在该方法中，喷墨打印头在晶片单元中切割。 特别地，可以防止喷墨打印头的连接垫被保护膜污染。

公开(公告)号：US20070279458A1

公开(公告)日：2007-12-06

申请号：US11653371

申请日：2007-01-16

申请人： Moon-chul Lee ,  Dong-sik Shim ,  Hyung Choi ,  Yong-seop Yoon

发明人： Moon-chul Lee ,  Dong-sik Shim ,  Hyung Choi ,  Yong-seop Yoon

IPC分类号： B41J2/05

CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1632 ,  B41J2/1639

摘要： An inkjet printhead and a method of manufacturing the inkjet printhead. The inkjet printhead includes a substrate including a trench formed to a predetermined depth in an upper portion of the substrate and an ink feed hole formed through a bottom surface of the trench to supply ink, an etch stop layer formed of a metal and formed on an inner surface of the trench, a plurality of heaters, to create bubbles by heating ink, formed on the substrate, a plurality of electrodes, to apply a current to the plurality of heaters, formed on the substrate, a chamber layer stacked on the substrate and including a plurality of ink chambers formed above respective heaters to receive ink from the ink feed hole via the trench, and a nozzle layer stacked on the chamber layer and including a plurality of nozzles to eject ink from the plurality of ink chambers.

摘要翻译： 喷墨打印头和制造喷墨打印头的方法。 喷墨打印头包括基板，该基板包括在基板的上部形成为预定深度的沟槽，以及通过沟槽的底表面形成供墨的供墨孔，由金属形成的蚀刻停止层， 沟槽的内表面，多个加热器，通过加热形成在基板上的油墨产生气泡，多个电极，以形成在基板上的多个加热器施加电流，堆叠在基板上的室层 并且包括形成在各个加热器上方的多个墨室，以经由所述沟槽从所述供墨孔接收墨;以及喷嘴层，其堆叠在所述腔室层上并且包括多个喷嘴以从所述多个墨室喷射墨。

公开(公告)号：US20070131648A1

公开(公告)日：2007-06-14

申请号：US11423982

申请日：2006-06-14

申请人： Dong-sik Shim ,  Hyung Choi

发明人： Dong-sik Shim ,  Hyung Choi

IPC分类号： G01D15/00 ,  G11B5/127

CPC分类号： B41J2/14129 ,  B41J2/14137 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1643 ,  Y10T29/49083 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49401

摘要： A method of fabricating an inkjet printhead. The method of fabricating an inkjet printhead includes sequentially forming an insulating layer, a heater, and an electrode on a substrate and forming a passivation layer on the insulating layer to cover the heater and the electrode; forming a trench that exposes the substrate by sequentially etching the passivation layer and the insulating layer; forming a sacrificial layer to form an ink chamber on the passivation layer to fill the trench; forming a seed layer to provide a plating on the sacrificial layer and the passivation layer; forming a nozzle mold on the seed layer positioned over the heater; forming a plating layer on the seed layer to a predetermined thickness; forming an ink feed hole by etching a rear surface of the substrate to expose the sacrificial layer which is filled in the trench; forming a nozzle by sequentially removing the nozzle mold and the seed layer positioned under the nozzle mold; and forming the ink chamber by removing the sacrificial layer which is exposed by the nozzle and the ink feed hole.

摘要翻译： 一种制造喷墨打印头的方法。 制造喷墨打印头的方法包括在基板上依次形成绝缘层，加热器和电极，并在绝缘层上形成钝化层以覆盖加热器和电极; 形成通过依次蚀刻钝化层和绝缘层而使衬底暴露的沟槽; 形成牺牲层以在所述钝化层上形成墨水腔以填充所述沟槽; 形成种子层以在所述牺牲层和所述钝化层上提供电镀; 在位于加热器上方的种子层上形成喷嘴模具; 在种子层上形成预定厚度的镀层; 通过蚀刻所述衬底的后表面以暴露所述沟槽中填充的所述牺牲层来形成供墨孔; 通过依次去除位于喷嘴模具下方的喷嘴模具和籽晶层形成喷嘴; 以及通过去除由喷嘴和供墨孔暴露的牺牲层来形成墨室。

公开(公告)号：US07309924B2

公开(公告)日：2007-12-18

申请号：US11012294

申请日：2004-12-16

申请人： Hoon Song ,  Dong-sik Shim

发明人： Hoon Song ,  Dong-sik Shim

IPC分类号： H01L23/48

CPC分类号： H01L24/13 ,  H01L23/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05557 ,  H01L2224/05559 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05578 ,  H01L2224/05599 ,  H01L2224/10145 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/81365 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/381 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/05552 ,  H01L2924/00

摘要： A flip-chip package for implementing a fine solder ball, and a flip-chip packaging method using the same. The flip-chip package includes a first wafer having a first electrode and a first under bump metal (UBM) formed on the first electrode and electrically connected to the first electrode; and second wafer opposing the first wafer and having a second electrode located in a position corresponding to the first electrode, and a second UBM formed on the second electrode and electrically connected to the second electrode. The first wafer has a depression formed on one or more areas adjacent to the first UBM, which depression partly receives a solder ball that connects the first and the second UBMs upon flip-chip bonding of the first and second wafers. Since the UBM is formed as an embossing pattern, a fine solder ball can be implemented. Additionally, the reliability of the package can be improved.

摘要翻译： 一种用于实现精细焊球的倒装芯片封装以及使用其的倒装芯片封装方法。 倒装芯片封装包括具有形成在第一电极上并电连接到第一电极的第一电极和第一下凸块金属（UBM）的第一晶片; 以及与所述第一晶片相对并且具有位于对应于所述第一电极的位置的第二电极的第二晶片，以及形成在所述第二电极上并电连接到所述第二电极的第二UBM。 第一晶片具有形成在与第一UBM相邻的一个或多个区域上的凹陷部，该凹陷部分地接收在第一和第二晶片倒装芯片接合时连接第一和第二UBM的焊球。 由于UBM形成为压花图案，因此可以实现精细的焊球。 此外，可以提高包装的可靠性。

公开(公告)号：US08349199B2

公开(公告)日：2013-01-08

申请号：US12544422

申请日：2009-08-20

申请人： Yong-won Jeong ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim ,  Jong-seok Kim

发明人： Yong-won Jeong ,  Yong-seop Yoon ,  Moon-chul Lee ,  Dong-sik Shim ,  Jong-seok Kim

IPC分类号： B41J2/14 ,  B44C1/22

CPC分类号： B41J2/14129 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631

摘要： An ink feedhole of an inkjet printhead and a method of forming the same includes an ink feedhole that penetrates a substrate and has a width that narrows in an upper direction of the substrate, wherein at least one internal wall of the ink feedhole has a plurality of steps and inclines with respect to a surface of the substrate.

摘要翻译： 喷墨打印头的供墨孔及其形成方法包括穿透基板并具有在基板的上方向上变窄的宽度的供墨孔，其中，墨供给孔的至少一个内壁具有多个 相对于基板的表面的台阶和倾斜。

公开(公告)号：US08114578B2

公开(公告)日：2012-02-14

申请号：US11968809

申请日：2008-01-03

申请人： Moon-chul Lee ,  Yong-seop Yoon ,  Min-soo Kim ,  Yong-won Jeong ,  Dong-sik Shim

发明人： Moon-chul Lee ,  Yong-seop Yoon ,  Min-soo Kim ,  Yong-won Jeong ,  Dong-sik Shim

IPC分类号： B41J2/16

CPC分类号： G03F7/203 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2002/14475

摘要： Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation.

摘要翻译： 提供了使用光刻工艺制造光敏环氧树脂结构的方法，以及使用制造光敏环氧树脂结构的方法制造喷墨打印头的方法。 制造感光环氧树脂结构的方法包括形成由光敏环氧树脂形成的环氧树脂材料层; 通过进行第一曝光操作在环氧树脂材料层中形成第一曝光图案; 通过进行第二曝光操作在所述环氧树脂材料层的未曝光部分中形成第二曝光图案; 以及显影环氧材料层，其中在第一曝光操作中使用的第一UV能量的量与在第二曝光操作中使用的第二UV能量的量不同。