ETCHING METHOD, ETCHING SOLUTION USED IN SAME, ETCHING SOLUTION KIT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE PRODUCT
    23.
    发明申请
    ETCHING METHOD, ETCHING SOLUTION USED IN SAME, ETCHING SOLUTION KIT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE PRODUCT 审中-公开
    蚀刻方法,其中使用的蚀刻溶液,蚀刻溶液工具包以及制造半导体衬底产品的方法

    公开(公告)号:US20160118264A1

    公开(公告)日:2016-04-28

    申请号:US14927700

    申请日:2014-05-01

    Abstract: There is provided an etching method of a semiconductor substrate that includes a first layer containing germanium (Ge) and a second layer containing at least one specific metal element selected from nickel platinum (NiPt), titanium (Ti), nickel (Ni), and cobalt (Co), the method including: bringing an etching solution which contains an alkali compound into contact with the second layer and selectively removing the second layer.

    Abstract translation: 提供了一种半导体衬底的蚀刻方法,其包括含有锗(Ge)的第一层和包含选自镍铂(NiPt),钛(Ti),镍(Ni))和至少一种特定金属元素的第二层 钴(Co),该方法包括:使包含碱性化合物的蚀刻溶液与第二层接触并选择性地除去第二层。

    METHOD FOR INSPECTING TREATMENT LIQUID AND METHOD FOR PRODUCING TREATMENT LIQUID

    公开(公告)号:US20240219359A1

    公开(公告)日:2024-07-04

    申请号:US18603775

    申请日:2024-03-13

    CPC classification number: G01N30/7206 G03F7/32 G01N2030/025

    Abstract: An object of the present invention is to provide a method for inspecting a treatment liquid to determine whether the treatment liquid, when used as a developer or a rinsing liquid, allows formation of a resist pattern with reduced variation in line width. Another object of the present invention is to provide a method for producing a treatment liquid.
    The method for inspecting a treatment liquid according to the present invention is a method for inspecting a treatment liquid including an aliphatic hydrocarbon solvent and has a step A1 of acquiring measurement data of a content of an acid component in the treatment liquid, the acid component being at least one selected from the group consisting of carboxylic acids having a hydrocarbon group having 1 to 3 carbon atoms and formic acid, and a step A2 of determining whether the measurement data acquired in the step A1 falls within a preset allowable range.

    RINSING LIQUID AND PATTERN FORMING METHOD

    公开(公告)号:US20230132693A1

    公开(公告)日:2023-05-04

    申请号:US18062021

    申请日:2022-12-06

    Abstract: An object of the present invention is to provide a rinsing liquid that has excellent resolution and excellent film thickness loss suppressiveness in a case where the rinsing liquid is used to rinse a resist film and a pattern forming method that uses the rinsing liquid. The rinsing liquid according to an embodiment of the present invention is a rinsing liquid for resist film patterning for a resist film obtained from an actinic ray-sensitive or radiation-sensitive composition, and contains at least a first ester-based solvent having 7 carbon atoms other than an acetate.

    CHEMICAL LIQUID AND CHEMICAL LIQUID STORAGE BODY

    公开(公告)号:US20210222092A1

    公开(公告)日:2021-07-22

    申请号:US17219818

    申请日:2021-03-31

    Abstract: An object of the present invention is to provide a chemical liquid and a chemical liquid storage body having excellent performance of inhibiting metal impurity-containing defects. The chemical liquid according to an embodiment of the present invention contains an organic solvent, organic impurities, and metal impurities, in which the organic impurities contain a phosphoric acid ester and an adipic acid ester, and a mass ratio of a content of the phosphoric acid ester to a content of the adipic acid ester is equal to or higher than 1.

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