ETCHING METHOD, ETCHING SOLUTION USED IN SAME, ETCHING SOLUTION KIT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE PRODUCT
    2.
    发明申请
    ETCHING METHOD, ETCHING SOLUTION USED IN SAME, ETCHING SOLUTION KIT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE PRODUCT 审中-公开
    蚀刻方法,其中使用的蚀刻溶液,蚀刻溶液工具包以及制造半导体衬底产品的方法

    公开(公告)号:US20160118264A1

    公开(公告)日:2016-04-28

    申请号:US14927700

    申请日:2014-05-01

    Abstract: There is provided an etching method of a semiconductor substrate that includes a first layer containing germanium (Ge) and a second layer containing at least one specific metal element selected from nickel platinum (NiPt), titanium (Ti), nickel (Ni), and cobalt (Co), the method including: bringing an etching solution which contains an alkali compound into contact with the second layer and selectively removing the second layer.

    Abstract translation: 提供了一种半导体衬底的蚀刻方法,其包括含有锗(Ge)的第一层和包含选自镍铂(NiPt),钛(Ti),镍(Ni))和至少一种特定金属元素的第二层 钴(Co),该方法包括:使包含碱性化合物的蚀刻溶液与第二层接触并选择性地除去第二层。

    TREATMENT LIQUID AND METHOD FOR TREATING OBJECT TO BE TREATED

    公开(公告)号:US20220282182A1

    公开(公告)日:2022-09-08

    申请号:US17683241

    申请日:2022-02-28

    Inventor: Yasuo SUGISHIMA

    Abstract: The present invention provides a treatment liquid that exhibits excellent washing properties and improves the smoothness of an object to be treated in a case where the treatment liquid is used for treating an object to be treated containing a cobalt-containing substance. The present invention also provides a method for treating an object to be treated. The treatment liquid according to an embodiment of the present invention contains water, hydroxylamine, and three kinds of first anions consisting of Cl−, NO2−, and NO3−, in which a total content of the first anions is 0.0001 to 30 parts by mass with respect to 100 parts by mass of the hydroxylamine.

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