公开(公告)号：US20220186077A1

公开(公告)日：2022-06-16

申请号：US17441587

申请日：2020-01-30

Applicant: FUJIMI INCORPORATED

Inventor： Kohsuke TSUCHIYA ,  Maki ASADA ,  Satoshi MOMOTA

IPC: C09G1/02 ,  H01L21/306

Abstract: The present invention provides means capable of achieving both a reduction in the number of defects and a reduction in haze in an object to be polished after polishing at a high level in a method of polishing the object to be polished containing a material having a silicon-silicon bond. The present invention relates to a method of polishing an object to be polished containing a material having a silicon-silicon bond, and the polishing method includes a final polishing step Pf. In this polishing method, the final polishing step Pf has a plurality of polishing sub-steps, the plurality of polishing sub-steps are continuously performed on the same polishing platen, a final polishing sub-step in the plurality of polishing sub-steps is a polishing sub-step Pff of polishing using a polishing composition Sff, a polishing sub-step provided before the polishing sub-step Pff in the plurality of polishing sub-steps is a polishing sub-step Pfp of polishing using a polishing composition Sfp, and the polishing composition Sff satisfies at least one of the following condition (A) or the following condition (B): condition (A): a value of a haze parameter of the polishing composition Sff obtained in a standard test 1 is smaller than a value of the haze parameter of the polishing composition Sfp obtained in the standard test 1, and condition (B): the polishing composition Sff contains an abrasive Aff, a basic compound Bff, and hydroxyethyl cellulose.

公开(公告)号：US20220162477A1

公开(公告)日：2022-05-26

申请号：US17442105

申请日：2020-03-23

Applicant: FUJIMI INCORPORATED

Inventor： Yoshiko YAMAGUCHI ,  Osamu GOTO ,  Kohsuke TSUCHIYA ,  Taiki ICHITSUBO

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/02 ,  H01L21/304

Abstract: The polishing composition provided by the present invention contains an abrasive, a polyvinyl alcohol polymer as a water-soluble polymer, a basic compound, and water, and further contains a trivalent or higher polyvalent organic acid (salt).

公开(公告)号：US20160215189A1

公开(公告)日：2016-07-28

申请号：US14917734

申请日：2014-09-22

Applicant: FUJIMI INCORPORATED

Inventor： Kohsuke TSUCHIYA ,  Yoshio MORI

IPC: C09K3/14 ,  B24B37/04

CPC classification number: C09K3/1463 ,  B24B37/00 ,  B24B37/044 ,  C09G1/02 ,  C09G1/04 ,  C09K3/1436 ,  H01L21/02024 ,  H01L21/02052

Abstract: Provided is a polishing composition with which surface defects can be efficiently reduced. This invention provides a polishing composition comprising a water-soluble polymer MC-end. The main chain of the water-soluble polymer MC-end is formed with a non-cationic region as its main structural part and a cationic region located at least at one end of the main chain. The cationic region has at least one cationic group.

Abstract translation: 提供了能够有效地降低表面缺陷的研磨用组合物。 本发明提供一种包含水溶性聚合物MC-末端的抛光组合物。 水溶性聚合物MC-末端的主链以非阳离子区域为主要结构部分，至少位于主链的一端形成阳离子区域。 阳离子区域具有至少一个阳离子基团。

公开(公告)号：US20160215188A1

公开(公告)日：2016-07-28

申请号：US14917728

申请日：2014-09-22

Applicant: FUJIMI INCORPORATED

Inventor： Kohsuke TSUCHIYA ,  Yoshio MORI

IPC: C09K3/14 ,  B24B37/04

CPC classification number: C09K3/1463 ,  B24B37/00 ,  B24B37/044 ,  C09G1/02 ,  C09G1/04 ,  C09K3/1436 ,  H01L21/02024 ,  H01L21/02052

Abstract: Provided is a polishing composition with which haze and surface defects can be reduced. This invention provides a polishing composition comprising a synthetic water-soluble polymer ML-end that has a hydrophobic region at least at one end of its main chain. The hydrophobic region has at least one hydrophobic group derived from a polymerization initiator.

Abstract translation: 提供了可以降低雾度和表面缺陷的抛光组合物。 本发明提供一种抛光组合物，其包括合成的水溶性聚合物ML-末端，其至少在其主链的一端具有疏水区域。 疏水区域具有至少一个衍生自聚合引发剂的疏水基团。

公开(公告)号：US20150376464A1

公开(公告)日：2015-12-31

申请号：US14767494

申请日：2014-02-10

Applicant: FUJIMI INCORPORATED

Inventor： Kohsuke TSUCHIYA ,  Hisanori TANSHO ,  Maki ASADA ,  Yusuke SUGA

IPC: C09G1/02

CPC classification number: C09G1/02 ,  B24B37/044 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/02024 ,  H01L21/02052

Abstract: The present invention provides a polishing composition comprising an abrasive, a water-soluble polymer and water. The polishing composition has a volume average particle diameter DA of grains in the polishing composition of 20 nm to 60 nm measured by dynamic light scattering at a concentration equivalent to 0.2% abrasive content by mass.

Abstract translation: 本发明提供一种抛光组合物，其包括研磨剂，水溶性聚合物和水。 抛光组合物的研磨用组合物中的粒径的体积平均粒径DA为20nm〜60nm，通过动态光散射测定，其浓度等于0.2质量％的磨料含量。