公开(公告)号：US09326373B2

公开(公告)日：2016-04-26

申请号：US14680719

申请日：2015-04-07

Applicant: Finisar Corporation

Inventor： Henry Meyer Daghighian ,  Steven C. Bird

IPC: G02B6/12 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  G02B6/132 ,  G02B6/124 ,  G02B6/122

CPC classification number: H05K1/0274 ,  G02B6/12007 ,  G02B6/122 ,  G02B6/1221 ,  G02B6/124 ,  G02B6/132 ,  G02B6/136 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4269 ,  G02B2006/12035 ,  G02B2006/121 ,  G02B2006/12104 ,  G02B2006/12107 ,  G02B2006/12164 ,  H01P3/081 ,  H05K1/0201 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/024 ,  H05K1/028 ,  H05K1/032 ,  H05K1/09 ,  H05K1/115 ,  H05K3/323 ,  H05K3/4605 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4638 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/09918

Abstract: A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.

Abstract translation: 印刷电路板可以包括包含AIN薄膜和作为AIN薄膜的载体衬底的高频聚合物层的氮化铝（AlN）衬底。 AIN衬底形成印刷电路板的第一层。 AIN衬底包括散热器，其横向散布来自印刷电路板上的散热器的热量，以形成与印刷电路板上的信号路径平行的散热路径。 印刷电路板可以包括与AIN衬底对准并与其结合的主衬底。 主衬底可以包括印刷电路板的一个或多个附加层。

公开(公告)号：US09103725B2

公开(公告)日：2015-08-11

申请号：US13761328

申请日：2013-02-07

Applicant: FINISAR CORPORATION

Inventor： Henry Meyer Daghighian ,  The'Linh Nguyen ,  Chris Kocot

IPC: G01J1/44 ,  G01R29/08 ,  G01R31/00 ,  H04B15/00 ,  H04B15/04 ,  G02B6/42

CPC classification number: G01J1/44 ,  G01R29/08 ,  G01R31/001 ,  G02B6/4277 ,  H04B15/00 ,  H04B15/04

Abstract: A method of compensating for electromagnetic radiation. The method may include measuring electromagnetic radiation emanating from circuitry at a first frequency and adjusting at least one of the electrical settings of the circuitry based on the measurement of the electromagnetic radiation to reduce the electromagnetic radiation at the first frequency emanating from the circuitry.

Abstract translation: 补偿电磁辐射的方法。 该方法可以包括测量从第一频率的电路发出的电磁辐射，并且基于电磁辐射的测量来调整电路的电气设置中的至少一个，以减少从电路发出的第一频率处的电磁辐射。

公开(公告)号：US20150136468A1

公开(公告)日：2015-05-21

申请号：US14538684

申请日：2014-11-11

Applicant: FINISAR CORPORATION

Inventor： Henry Meyer Daghighian ,  Steven C. Bird ,  YongShan Zhang

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/4046 ,  H05K1/0245 ,  H05K1/0251 ,  H05K3/0094 ,  H05K2201/0959 ,  H05K2201/09636 ,  H05K2201/10242 ,  Y10T29/49165

Abstract: Some embodiments relate to micro vias in printed circuit boards (PCBs). In an example, a PCB may include a PCB substrate and a micro via. The micro via may extend between opposing surfaces of the PCB substrate and may have a diameter less than or equal to about 100 microns. In another example, a method of forming micro vias in a PCB may include forming a through hole in a PCB substrate of the PCB. The method may also include positioning a pillar that is electrically conductive within the through hole. The method may also include backfilling the through hole around the pillar with an epoxy backfill.

Abstract translation: 一些实施例涉及印刷电路板（PCB）中的微通孔。 在一个示例中，PCB可以包括PCB基板和微通孔。 微通孔可以在PCB基板的相对表面之间延伸并且可以具有小于或等于约100微米的直径。 在另一示例中，在PCB中形成微通孔的方法可以包括在PCB的PCB衬底中形成通孔。 该方法还可以包括定位在通孔内导电的支柱。 该方法还可以包括用环氧填充物填充柱周围的通孔。