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公开(公告)号：US06578891B1
公开(公告)日：2003-06-17
申请号：US09612212
申请日：2000-07-07
IPC分类号： B25J1500
CPC分类号： H01L21/67259 , B25J13/086 , B25J15/00 , B25J19/021 , H01L21/67766 , H01L21/68707 , Y10S294/907 , Y10S414/141
摘要： The present invention provides a substrate holder for holding and transferring a thin substrate, comprising a substrate support member having a recessed area for placing a thin substrate therein and substrate mount portions formed in the recessed area in the vicinity of a circumferential edge thereof. The substrate mount portions is adapted to be engaged with an outer circumferential portion of a backside of the substrate placed in the recessed area. The substrate holder further comprises a substrate detector for detecting presence or absence of the substrate in the recessed area.
摘要翻译： 本发明提供了一种用于保持和转印薄基板的基板保持器，包括：具有用于放置薄基板的凹陷区域的基板支撑构件和形成在其周缘附近的凹陷区域中的基板安装部分。 基板安装部分适于与放置在凹陷区域中的基板的背面的外周部分接合。 衬底保持器还包括用于检测凹陷区域中的衬底的存在或不存在的衬底检测器。
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公开(公告)号：US06534164B2
公开(公告)日：2003-03-18
申请号：US09947411
申请日：2001-09-07
申请人： Masaaki Futamoto , Nobuyuki Inaba , Yoshiyuki Hirayama , Yukio Honda , Kazuetsu Yoshida , Kenya Ito
发明人： Masaaki Futamoto , Nobuyuki Inaba , Yoshiyuki Hirayama , Yukio Honda , Kazuetsu Yoshida , Kenya Ito
IPC分类号： G11B566
CPC分类号： H04B10/504 , G11B5/66 , Y10S428/90 , Y10T428/12465 , Y10T428/12861 , Y10T428/12875 , Y10T428/24942 , Y10T428/2495 , Y10T428/24975 , Y10T428/26 , Y10T428/265
摘要： Magnetic recording medium includes at least two layers having different magnetic anisotropy constants formed on a substrate and the perpendicular magnetic anisotropy of the second magnetic film of those magnetic films, far from the substrate surface, made equal to or larger than that of the first magnetic film near to the substrate surface, thus improving the magnetic isolation.
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公开(公告)号：US09287158B2
公开(公告)日：2016-03-15
申请号：US11630512
申请日：2006-04-18
申请人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
发明人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , H01L21/302 , H01L21/461 , H01L21/687 , B24B9/06 , B24B49/04 , H01L21/67
CPC分类号： H01L21/67219 , B24B9/065 , B24B49/04 , H01L21/302 , H01L21/461 , H01L21/67253 , H01L21/68707 , H01L21/68728
摘要： A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
摘要翻译： 基板处理装置包括：第一抛光单元，用于抛光基板周边部分;第一清洗单元，用于清洁基板;二次清洁和干燥单元，用于干燥在主清洗单元中清洁的基板;以及测量单元， 测量衬底的周边部分。 测量单元包括用于在第一和第二抛光单元中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构。
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公开(公告)号：US08047896B2
公开(公告)日：2011-11-01
申请号：US12310364
申请日：2007-10-02
申请人： Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
发明人： Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
CPC分类号： B24B21/20 , B24B21/004 , B24B21/04
摘要： The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44). The polishing-tape supply and recovery mechanism (45) includes a motor Mb adapted to apply a torque to the polishing-tape supply reel (46) so as to exert a predetermined tension on the polishing tape (43) traveling through the polishing head (44), and a rotation angle detector REa adapted to detect a rotation angle of the polishing-tape supply reel (46).
摘要翻译： 本发明提供一种抛光装置和抛光方法，其能够计算研磨带供给卷轴和抛光带回收卷轴上的研磨带的辊的外径，并且能够计算研磨带的剩余量和消耗量 的研磨带的外径。 该抛光装置包括：抛光带供给卷轴（46），研磨头（44），研磨带引出机构G1和被配置为回收研磨带的研磨带供给和恢复机构（45） 43）从研磨带供给卷轴（46）经由研磨头（44）。 抛光带供给和恢复机构（45）包括电动机Mb，该电动机Mb适于向抛光带供给卷轴（46）施加转矩，以便在穿过抛光头（3）的抛光带（43）上施加预定的张力 44）和适于检测研磨带供给卷轴（46）的旋转角度的旋转角度检测器REa。
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公开(公告)号：US20110256811A1
公开(公告)日：2011-10-20
申请号：US13080821
申请日：2011-04-06
申请人： Masayuki NAKANISHI , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
发明人： Masayuki NAKANISHI , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
IPC分类号： B24B1/00
CPC分类号： B24B21/002 , B24B9/065 , B24B21/04 , B24B37/042
摘要： A polishing method can obtain a good polishing profile which, for example, will not cause peeling of a semiconductor layer from a silicon substrate. The polishing method includes: positioning a polishing head at a position above a polishing start position in an edge portion of a rotating substrate; lowering a polishing tool of the polishing head until the polishing tool comes into contact with the polishing start position in the edge portion of the rotating substrate and a pressure between the polishing tool and the polishing start position reaches a set pressure; allowing the polishing tool to stay at the polishing start position for a predetermined amount of time; and then moving the polishing head toward a peripheral end of the substrate while keeping the polishing tool in contact with the edge portion of the rotating substrate at the set pressure.
摘要翻译： 抛光方法可以获得良好的抛光轮廓，其例如不会导致半导体层从硅衬底剥离。 抛光方法包括：将抛光头定位在旋转基板的边缘部分中的抛光开始位置上方的位置; 降低抛光头的抛光工具，直到研磨工具与旋转基板的边缘部分中的抛光开始位置接触，并且抛光工具和抛光开始位置之间的压力达到设定压力; 允许抛光工具在抛光开始位置停留预定的时间量; 然后将抛光头朝向基板的周缘移动，同时保持抛光工具在旋转基板的边缘部分处于设定压力。
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公开(公告)号：US08029333B2
公开(公告)日：2011-10-04
申请号：US11911808
申请日：2007-10-17
申请人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
发明人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
IPC分类号： B24B49/00
摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.
摘要翻译： 用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动 的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。 将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。
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27.发明申请POLISHING APPARATUS, POLISHING METHOD AND PRESSING MEMBER FOR PRESSING A POLISHING TOOL 有权抛光设备，抛光方法和压制用于压制抛光工具的构件公开(公告)号：US20110237164A1
公开(公告)日：2011-09-29
申请号：US12986481
申请日：2011-01-07
申请人： Masaya SEKI , Kenya Ito , Masayuki Nakanishi
发明人： Masaya SEKI , Kenya Ito , Masayuki Nakanishi
CPC分类号： B24B9/065 , B24B21/004 , B24B37/27
摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism 3 configured to hold the substrate W horizontally and to rotate the substrate W; and at least one polishing head 30 disposed near the peripheral portion of the substrate. The polishing head 30 has at least one protrusion 51a, 51b extending along a circumferential direction of the substrate W, and the polishing head 30 is configured to press a polishing surface of a polishing tape 23 by the protrusion 51a, 51b against the peripheral portion of the substrate W from above or below.
摘要翻译： 抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。 抛光装置包括旋转保持机构3，其构造成水平地保持基板W并使基板W旋转; 以及设置在基板的周边部分附近的至少一个抛光头30。 抛光头30具有沿着基板W的圆周方向延伸的至少一个突起51a，51b，并且抛光头30被构造成通过突起51a，51b将抛光带23的抛光表面压靠在基板 基底W从上方或下方。
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公开(公告)号：US20100137540A1
公开(公告)日：2010-06-03
申请号：US12531606
申请日：2008-03-21
申请人： Kenya Ito , Hisao Oikawa , Koji Ohguma , Mikio Yamahiro
发明人： Kenya Ito , Hisao Oikawa , Koji Ohguma , Mikio Yamahiro
IPC分类号： C08F230/08
CPC分类号： C08F290/148 , C08F283/12 , C08F290/06 , C08F290/068 , C08G77/04 , C08G77/24 , C09D143/04 , Y10T428/31855
摘要： A polymer and a treating agent (such as a surface-treating agent) are provided that have excellent characteristics in such properties as water repellency, oil repellency, antifouling property and charge controlling property. The polymer contains a structural unit derived from fluorosilsesquioxane having an addition polymerizable group, or contains a structural unit derived from fluorosilsesquioxane having an addition polymerizable group and a structural unit derived from organopolysiloxane having an addition polymerizable group. The treating agent contains the polymer. An article treated with the treating agent is also provided.
摘要翻译： 提供聚合物和处理剂（例如表面处理剂），其具有防水性，拒油性，防污性和电荷控制性等性能优异的特性。 聚合物含有衍生自具有加成聚合基团的氟代倍半硅氧烷的结构单元，或含有衍生自具有加聚性基团的氟代倍半硅氧烷的结构单元和衍生自具有加成聚合基团的有机聚硅氧烷的结构单元。 处理剂含有聚合物。 还提供了用处理剂处理的制品。
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29.发明申请公开(公告)号：US20090093192A1
公开(公告)日：2009-04-09
申请号：US11911808
申请日：2006-04-18
申请人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
发明人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.
摘要翻译： 用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动 的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。 将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。
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公开(公告)号：US20090004952A1
公开(公告)日：2009-01-01
申请号：US12213186
申请日：2008-06-16
申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
发明人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
CPC分类号： B24B21/002 , B24B9/065 , H01L21/68707 , H01L21/68792
摘要： A polishing apparatus according to the present invention is suitable for use in polishing a periphery of a substrate such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold the workpiece, a polishing head configured to bring the polishing tape into contact with the workpiece, a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot lying on a predetermined point.
摘要翻译： 根据本发明的抛光装置适用于抛光半导体晶片等基板的周边。 抛光装置包括：保持部，其构造成保持工件;抛光头，被配置为使抛光带与工件接触;供给卷轴，其构造成将抛光带供给到抛光头;构造成倒带抛光的回卷卷轴 已经接触到工件的胶带和摆动机构，其构造成使得抛光头在其枢轴位于预定点上时进行摆动运动。
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