公开(公告)号：US07361076B2

公开(公告)日：2008-04-22

申请号：US11802353

申请日：2007-05-22

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： B24B49/00 ,  G06F19/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。

公开(公告)号：US07150673B2

公开(公告)日：2006-12-19

申请号：US11176184

申请日：2005-07-08

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： B24B49/00 ,  G06F19/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。

公开(公告)号：US20060009127A1

公开(公告)日：2006-01-12

申请号：US11176184

申请日：2005-07-08

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： B24B49/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset the polishing conditions according to the state of a polishing member based on data on the polishing profile changing with time, thereby extending the life of the polishing member and obtaining flatness of the polished surface with higher accuracy. The polishing method, including the steps of: independently applying a desired pressure by each of the pressing portions of the top ring on the polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that the difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位研磨条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法，包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定的压力值估计抛光对象的抛光轮廓，并计算推荐的抛光压力值，使得抛光对象在一定的抛光条件下抛光的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。

公开(公告)号：US20070224916A1

公开(公告)日：2007-09-27

申请号：US11802353

申请日：2007-05-22

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： B24B49/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

公开(公告)号：US20070205112A1

公开(公告)日：2007-09-06

申请号：US11797480

申请日：2007-05-03

申请人： Masako Kodera ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Akira Kodera ,  Hirokuni Hiyama ,  Manabu Tsujimura ,  Kazuto Hirokawa ,  Akira Fukunaga

发明人： Masako Kodera ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Akira Kodera ,  Hirokuni Hiyama ,  Manabu Tsujimura ,  Kazuto Hirokawa ,  Akira Fukunaga

IPC分类号： B23H3/00

CPC分类号： B23H5/08 ,  B24B53/001 ,  B24B53/017 ,  C09G1/02 ,  C25F3/02 ,  C25F7/00 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/76814 ,  H01L21/76825 ,  H01L21/7684

摘要： A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W) against the polishing surface (32) under a pressing pressure. The polishing apparatus (30) also has a controller (44) to adjust a polishing condition in a non-Preston range in which a polishing rate is not proportional to a product of the pressing pressure and the relative speed. The polishing apparatus (30) can simultaneously achieve uniform supply of a chemical liquid to a surface of the wafer (W) and a uniform polishing rate within the surface of the wafer (W).

摘要翻译： 抛光装置（30）具有抛光面（32），用于保持晶片（W）的顶环（36），使抛光面（32）和晶片（W）相对于运动的电机（46,56）相对于 以及垂直移动机构（54），其在压制压力下将晶片（W）压靠在抛光表面（32）上。 抛光装置（30）还具有控制器（44），用于在抛光速率与按压压力与相对速度的乘积不成比例的非普雷斯顿范围内调节抛光状态。 抛光装置（30）可以同时实现向晶片（W）的表面均匀供应化学液体，并且在晶片表面（W）内均匀的研磨速率。

公开(公告)号：US07234999B2

公开(公告)日：2007-06-26

申请号：US11599351

申请日：2006-11-15

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： B24B49/00 ,  G06F19/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

公开(公告)号：US20070061036A1

公开(公告)日：2007-03-15

申请号：US11599351

申请日：2006-11-15

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： G06F19/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。

公开(公告)号：US20050155868A1

公开(公告)日：2005-07-21

申请号：US11035373

申请日：2005-01-14

申请人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

发明人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

IPC分类号： B23H5/08 ,  B24B37/04 ,  C25F1/00 ,  C25F3/00 ,  H01L21/321 ,  H01L21/768 ,  B23H3/00

CPC分类号： H01L21/32115 ,  B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  C25F1/00 ,  C25F3/00 ,  H01L21/7684

摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation for a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with and close to the processing electrode at a distance of not more than 10 μm.

摘要翻译： 电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对于改变离子交换剂的操作的需要。 电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中进行工件的电解处理，同时保持工件不超过10um的距离与处理电极接触并靠近处理电极。

公开(公告)号：US20100081361A1

公开(公告)日：2010-04-01

申请号：US12566224

申请日：2009-09-24

申请人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Yutaka Wada ,  Yoichi Shiokawa ,  Hirokuni Hiyama

发明人： Akira Fukuda ,  Yoshihiro Mochizuki ,  Yutaka Wada ,  Yoichi Shiokawa ,  Hirokuni Hiyama

IPC分类号： B24B53/02 ,  B24B1/00 ,  B24B53/12

CPC分类号： B24B53/017

摘要： A method of dressing a polishing member with a diamond dresser having diamond particles arranged on a surface thereof is provided. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the dressing conditions determined. The simulation includes calculation of the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.

摘要翻译： 提供了一种用金刚石修整器修整抛光构件的方法，其具有布置在其表面上的金刚石颗粒。 该方法包括通过对抛光构件的表面上的金刚石修整器的滑动距离的分布进行模拟来确定修整条件，以及在确定的修整条件下用金刚石修整器修整抛光构件。 模拟包括根据推入抛光构件的金刚石颗粒的深度校正的滑动距离的计算。

公开(公告)号：US06454644B1

公开(公告)日：2002-09-24

申请号：US09629440

申请日：2000-07-31

申请人： Hisamitsu Miyazaki ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Hisamitsu Miyazaki ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24D1100

CPC分类号： B24B37/26 ,  B24B37/245 ,  B24D3/32 ,  B24D7/06 ,  B24D18/0009

摘要： A polishing tool uses a fixed abrasive polisher which can perform polishing of an object with good surface accuracy for a long period of time. A mixture of abrasive grains, having an average particle diameter of 0.01 to 2.0 &mgr;m, and comprising at least one of cerium oxide, manganese oxide, titanium oxide, zirconia, silica, and iron oxide, and polyimide resin particles or phenolic resin particles having an average particle diameter of 0.1 to 20 &mgr;m is heated at a temperature of 120 to 250° C. under a pressure of 9,800 to 49,000 kPa (100 to 500 kg/cm2) to mold the mixture into a desired shape. This can provide a polisher 4 having abrasive grains dispersed in a thermosetting resin, and having abrasive grains of 20 to 60% by volume, a binder of 30 to 50% by volume, pores of not more than 40% by volume, and a Rockwell hardness of not less than 30 in terms of the H scale. This polisher is attached to a surface plate by an epoxy adhesive to produce a polishing tool.

摘要翻译： 抛光工具使用固定磨料抛光机，其可以长时间对表面精度进行抛光。 平均粒径为0.01〜2.0μm，并且包含氧化铈，氧化锰，氧化钛，氧化锆，二氧化硅和氧化铁中的至少一种的磨粒的混合物，以及聚酰亚胺树脂粒子或酚醛树脂粒子 将平均粒径为0.1〜20μm的树脂在温度为120〜250℃，压力为9,800〜49000kPa（100〜500kg / cm2）的条件下加热，成型为所需的形状。 这可以提供一种抛光机4，其具有分散在热固性树脂中的磨粒，并且具有20至60体积％的磨料颗粒，30至50体积％的粘合剂，不超过40体积％的孔，以及洛氏 硬度以H比例计不低于30。 该抛光机通过环氧树脂粘合剂附接到表面板以产生抛光工具。