公开(公告)号：US08466529B2

公开(公告)日：2013-06-18

申请号：US13051413

申请日：2011-03-18

申请人： Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Koichi Ishii ,  Hideyuki Funaki

发明人： Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Koichi Ishii ,  Hideyuki Funaki

IPC分类号： H01L31/0232

CPC分类号： H01L27/14618 ,  H01L27/14649 ,  H01L2224/13

摘要： According to one embodiment, an imaging device includes a substrate, a photodetecting portion, a circuit portion and a through interconnect. The substrate has a first major surface, a second major surface on a side opposite to the first major surface, a recess portion provided on the first major surface and retreated in a first direction going from the first major surface to the second major surface, and a through hole communicating with the first major surface and the second major surface and extending in the first direction. The photodetecting portion is provided above the recess portion and away from the substrate. The circuit portion is electrically connected to the photodetecting portion and provided on the first major surface. The through interconnect is electrically connected to the circuit portion and provided inside the through hole. The recess portion has a first inclined surface. The through hole has a second inclined surface.

摘要翻译： 根据一个实施例，成像装置包括基板，光电检测部分，电路部分和通孔互连。 基板具有第一主表面，与第一主表面相对的一侧的第二主表面，设置在第一主表面上并沿着从第一主表面到第二主表面的第一方向退回的凹部，以及 与所述第一主表面和所述第二主表面连通并且沿所述第一方向延伸的通孔。 光电检测部分设置在凹部的上方并远离基板。 电路部分电连接到光电检测部分并设置在第一主表面上。 通孔互连电连接到电路部分并设置在通孔的内部。 凹部具有第一倾斜面。 通孔具有第二倾斜面。

公开(公告)号：US20130075849A1

公开(公告)日：2013-03-28

申请号：US13416290

申请日：2012-03-09

申请人： Kazuhiro SUZUKI ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

发明人： Kazuhiro SUZUKI ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

IPC分类号： H01L27/146 ,  H01L31/18

CPC分类号： H01L27/14605 ,  H01L24/32 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： According to one embodiment, a solid state imaging device includes a sensor substrate curved such that an upper face having a plurality of pixels formed is recessed and an imaging lens provided on the upper face side.

摘要翻译： 根据一个实施例，固态成像装置包括弯曲的传感器基板，使得形成有多个像素的上表面凹陷，并且设置在上表面侧的成像透镜。

公开(公告)号：US20130075586A1

公开(公告)日：2013-03-28

申请号：US13361321

申请日：2012-01-30

申请人： Risako UENO ,  Hideyuki Funaki ,  Kazuhiro Suzuki ,  Mitsuyoshi Kobayashi ,  Honam Kwon

发明人： Risako UENO ,  Hideyuki Funaki ,  Kazuhiro Suzuki ,  Mitsuyoshi Kobayashi ,  Honam Kwon

IPC分类号： H01L27/148 ,  H01L27/146

CPC分类号： H01L27/14623 ,  H01L27/14632 ,  H01L27/14634

摘要： According to one embodiment, a solid imaging device includes an imaging substrate, a light-shielding member and a AD conversion circuits. The imaging substrate is two-dimensionally arranged with a plurality of pixels. The plurality of pixels have a top face formed with an optoelectronic conversion element for converting incident light into an electric charge and storing it and a back face opposite to the top faces. The imaging substrate is formed with a top face by the top face of the plurality of pixels and formed with a back face by the back face of the plurality of pixels. The light-shielding member is provided on the top face side of the imaging substrate. The AD conversion circuits is formed on the back face of the pixels shielded from the light.

摘要翻译： 根据一个实施例，固体成像装置包括成像基板，遮光部件和AD转换电路。 成像基板二维排列有多个像素。 多个像素具有形成有光电转换元件的顶面，用于将入射光转换成电荷并将其存储，并且与顶面相反的背面。 成像基板由多个像素的顶面形成有顶面，并且由多个像素的背面形成有背面。 遮光构件设置在成像基板的顶面侧。 AD转换电路形成在屏蔽光的像素的背面上。

公开(公告)号：US20130242161A1

公开(公告)日：2013-09-19

申请号：US13714960

申请日：2012-12-14

申请人： Mitsuyoshi Kobayashi ,  Risako Ueno ,  Kazuhiro Suzuki ,  Hiroto Honda ,  Hideyuki Funaki

发明人： Mitsuyoshi Kobayashi ,  Risako Ueno ,  Kazuhiro Suzuki ,  Hiroto Honda ,  Hideyuki Funaki

IPC分类号： H04N5/225

CPC分类号： H04N5/2254 ,  H04N5/2171

摘要： A solid-state imaging device according to an embodiment includes: an imaging element including a plurality of pixel blocks each containing a plurality of pixels; a first optical system forming an image of an object on an imaging plane; and a second optical system including a microlens array, the microlens array including a light transmissive substrate, a plurality of first microlenses formed on the light transmissive substrate, and a plurality of second microlenses formed around the first microlenses, a focal length of the first microlenses being substantially equal to a focal length of the second microlenses, an area of the first microlenses in contact with the light transmissive substrate being larger than an area of the second microlenses in contact with the light transmissive substrate, the second optical system being configured to reduce and reconstruct the image formed on the imaging plane on the pixel blocks via the microlens array.

摘要翻译： 根据实施例的固态成像装置包括：成像元件，其包括多个像素块，每个像素块包含多个像素; 第一光学系统，其在成像平面上形成物体的图像; 以及包括微透镜阵列的第二光学系统，所述微透镜阵列包括透光衬底，形成在所述透光衬底上的多个第一微透镜以及围绕所述第一微透镜形成的多个第二微透镜，所述第一微透镜的焦距 基本上等于第二微透镜的焦距，与透光基板接触的第一微透镜的面积大于与透光基板接触的第二微透镜的面积，第二光学系统被配置为减小 并且通过微透镜阵列重建在像素块上的成像平面上形成的图像。

公开(公告)号：US08212214B2

公开(公告)日：2012-07-03

申请号：US13052903

申请日：2011-03-21

申请人： Hiroto Honda ,  Hideyuki Funaki

发明人： Hiroto Honda ,  Hideyuki Funaki

IPC分类号： G01J5/00 ,  G01J5/20

CPC分类号： G01V8/10 ,  G01J5/20 ,  G01J5/22 ,  G01J2005/0077 ,  H01L27/144 ,  H01L31/101 ,  H04N5/33

摘要： It is possible to quickly and readily determine the location of an object. A solid-state imaging element according to an embodiment includes: at least two infrared detectors formed on a semiconductor substrate; an electric interconnect configured to connect the at least two infrared detectors in series; and a comparator unit configured to compare an intermediate voltage of the electric interconnect connecting the infrared detectors in series, with a predetermined reference voltage.

摘要翻译： 可以快速，容易地确定对象的位置。 根据实施例的固态成像元件包括：形成在半导体衬底上的至少两个红外检测器; 配置为串联连接所述至少两个红外检测器的电互连; 以及比较器单元，被配置为将连接红外线检测器的电气互连串联的中间电压与预定的参考电压进行比较。

公开(公告)号：US07737400B2

公开(公告)日：2010-06-15

申请号：US12206234

申请日：2008-09-08

申请人： Hideyuki Funaki ,  Yoshinori Iida ,  Hiroto Honda

发明人： Hideyuki Funaki ,  Yoshinori Iida ,  Hiroto Honda

IPC分类号： G01J5/20

CPC分类号： H04N5/33 ,  G01J5/20 ,  G01J5/22 ,  G01J2005/0048 ,  H04N5/3575 ,  H04N5/361 ,  H04N5/363 ,  H04N5/3651

摘要： A bolometer type uncooled infrared ray sensor includes: an image pickup region having detection pixels arranged in a matrix form on a semiconductor substrate to detect incident infrared rays; a plurality of row selection lines provided in the image pickup region; current sources capable of letting constant currents flow through the respective row selection lines; a plurality of signal lines provided in the image pickup region; voltage readout circuits provided so as to respectively correspond to the signal lines to read out signal voltages generated on the respectively corresponding signal lines; coupling capacitances respectively provided between the respective signal lines and the corresponding voltage readout circuits; and a calculator which calculates a difference between two signal voltages read out by the voltage readout circuits, corresponding to outputs of the same detection pixel for two different current values supplied from the current sources.

摘要翻译： 测辐射计型非冷却红外线传感器包括：具有以矩阵形式布置在半导体衬底上的检测像素的摄像区域，以检测入射的红外线; 设置在图像拾取区域中的多个行选择线; 能够使恒定电流流过各行选择线的电流源; 设置在所述摄像区域中的多条信号线; 电压读出电路，分别对应于信号线，以读出分别对应的信号线上产生的信号电压; 分别设置在各信号线和对应的电压读出电路之间的耦合电容; 以及计算器，其计算由电压读出电路读出的两个信号电压之间的差值，对应于从电流源提供的两个不同电流值的相同检测像素的输出。

公开(公告)号：US20110226953A1

公开(公告)日：2011-09-22

申请号：US13052903

申请日：2011-03-21

申请人： Hiroto HONDA ,  Hideyuki Funaki

发明人： Hiroto HONDA ,  Hideyuki Funaki

IPC分类号： G01J5/12 ,  G01J5/20

CPC分类号： G01V8/10 ,  G01J5/20 ,  G01J5/22 ,  G01J2005/0077 ,  H01L27/144 ,  H01L31/101 ,  H04N5/33

摘要： It is possible to quickly and readily determine the location of an object. A solid-state imaging element according to an embodiment includes: at least two infrared detectors formed on a semiconductor substrate; an electric interconnect configured to connect the at least two infrared detectors in series; and a comparator unit configured to compare an intermediate voltage of the electric interconnect connecting the infrared detectors in series, with a predetermined reference voltage.

摘要翻译： 可以快速，容易地确定对象的位置。 根据实施例的固态成像元件包括：形成在半导体衬底上的至少两个红外检测器; 配置为串联连接所述至少两个红外检测器的电互连; 以及比较器单元，被配置为将连接红外线检测器的电气互连串联的中间电压与预定的参考电压进行比较。

公开(公告)号：US20100230594A1

公开(公告)日：2010-09-16

申请号：US12709759

申请日：2010-02-22

申请人： Hiroto Honda ,  Hideyuki Funaki

发明人： Hiroto Honda ,  Hideyuki Funaki

IPC分类号： H01L27/146

CPC分类号： H01L27/14623 ,  H01L27/14649 ,  H01L27/14669

摘要： An infrared solid-state image sensor comprises: a pixel area comprising a sensitive pixel area where infrared detection pixels are arranged in a matrix form to detect incident infrared rays on the semiconductor substrate and a reference pixel area where reference pixels are provided, each of the infrared detection pixels comprising a thermoelectric conversion part, the thermoelectric conversion part comprising an infrared absorption film to absorb the incident infrared rays and convert the incident infrared rays to heat and a first thermoelectric conversion element to convert the heat obtained by the conversion in the infrared absorption film to a electric signal, each of the reference pixels comprising a second thermoelectric conversion element. Each of first ends of the reference pixels are connected to a reference potential line, and a difference between the signal potential read out from a corresponding signal line and a reference potential supplied from the reference potential line is amplified and outputted.

摘要翻译： 一种红外固态图像传感器包括：像素区域，包括敏感像素区域，其中红外检测像素以矩阵形式布置以检测半导体衬底上的入射红外线和参考像素的参考像素区域， 红外线检测像素包括热电转换部分，该热电转换部分包括用于吸收入射的红外线并将入射的红外线转换成热的红外线吸收膜和第一热电转换元件，以将通过红外吸收中的转换获得的热量转换 每个参考像素包括第二热电转换元件。 参考像素的每个第一端连接到参考电位线，并且从相应的信号线读出的信号电位与从参考电位线提供的参考电位之间的差放大并输出。

公开(公告)号：US20100025584A1

公开(公告)日：2010-02-04

申请号：US12508846

申请日：2009-07-24

申请人： Keita SASAKI ,  Hideyuki Funaki ,  Hiroto Honda ,  Ikuo Fujiwara ,  Koichi Ishii ,  Hitoshi Yagi

发明人： Keita SASAKI ,  Hideyuki Funaki ,  Hiroto Honda ,  Ikuo Fujiwara ,  Koichi Ishii ,  Hitoshi Yagi

IPC分类号： H01L31/02 ,  H01L31/00

CPC分类号： H01L27/14669 ,  H01L27/1203 ,  H01L27/14683

摘要： An image sensor includes a semiconductor substrate; first pixels laid out above cavities provided within the semiconductor substrate, the first pixels converting thermal energy generated by incident light into an electric signal; supporting parts connected between the first pixels and the semiconductor substrate, the supporting parts supporting the first pixels above the cavities; and second pixels fixedly provided on the semiconductor substrate without via the cavities, wherein a plurality of the first pixels and a plurality of the second pixels are laid out two-dimensionally to form a pixel region, and each of the second pixels is adjacent to the first pixels.

摘要翻译： 图像传感器包括半导体衬底; 第一像素被布置在设置在半导体衬底内的腔上方，第一像素将由入射光产生的热能转换为电信号; 连接在第一像素和半导体衬底之间的支撑部件，支撑部件支撑空腔上方的第一像素; 以及固定地设置在半导体衬底上的第二像素，而不经由空腔，其中多个第一像素和多个第二像素被二维布置以形成像素区域，并且每个第二像素与 第一个像素。

公开(公告)号：US20090236526A1

公开(公告)日：2009-09-24

申请号：US12405497

申请日：2009-03-17

申请人： Keita Sasaki ,  Hiroto Honda ,  Hideyuki Funaki ,  Ikuo Fujiwara ,  Kazuhiro Suzuki

发明人： Keita Sasaki ,  Hiroto Honda ,  Hideyuki Funaki ,  Ikuo Fujiwara ,  Kazuhiro Suzuki

IPC分类号： H01L27/14

CPC分类号： G01J5/02 ,  G01J5/023 ,  G01J5/024 ,  G01J5/045 ,  G01J5/08 ,  G01J5/0853

摘要： An infrared ray sensor element includes: a first signal wiring part including a first signal wire and provided on a first region of a semiconductor substrate different from a region on which a concave part is provided; a second signal wiring part including a second signal wire and provided on the first region so as to intersect the first signal wiring part; a supporter including a support wiring part disposed over the concave part, and including a first wire electrically connected at a first end thereof to the first signal wire, and a second wire insulated from the first wire, disposed in parallel with the first wire, and electrically connected at a first end thereof to the second signal wire; a thermoelectric transducer electrically connected to second ends of the first and second wires; an infrared ray absorption layer provided over the thermoelectric transducer; and a detection cell provided over the concave part.

摘要翻译： 一种红外线传感器元件包括：第一信号布线部，包括第一信号线，设置在与设置有凹部的区域不同的半导体基板的第一区域上; 第二信号布线部分，包括第二信号线，并设置在第一区域上，以与第一信号布线部分相交; 支撑件，其包括设置在所述凹部上方的支撑布线部，并且包括在其第一端处电连接到所述第一信号线的第一线和与所述第一线平行布置的与所述第一线绝缘的第二线，以及 在其第一端电连接到第二信号线; 电连接到第一和第二导线的第二端的热电换能器; 设置在所述热电换能器上的红外线吸收层; 以及设置在所述凹部上的检测单元。