摘要:
A high capacity, fast access dynamic random access memory is provided. Furthermore, a pipelined write method can be realized at each array block by affixing a latch between the sense amplifier and write data line for each column. In this manner, a data write phase can occur simultaneously with the pre-read phase of the following address. Using this method, the effective access speed to the array block can be increased, yielding a fast access cache memory.
摘要:
A high capacity, fast access dynamic random access memory is provided. Furthermore, a pipelined write method can be realized at each array block by affixing a latch between the sense amplifier and write data line for each column. In this manner, a data write phase can occur simultaneously with the pre-read phase of the following address. Using this method, the effective access speed to the array block can be increased, yielding a fast access cache memory.
摘要:
A high capacity, fast access dynamic random access memory is provided. Furthermore, a pipelined write method can be realized at each array block by affixing a latch between the sense amplifier and write data line for each column. In this manner, a data write phase can occur simultaneously with the pre-read phase of the following address. Using this method, the effective access speed to the array block can be increased, yielding a fast access cache memory.
摘要:
A semiconductor device employs a SESO memory or a phase change memory which has a smaller memory cell area than SRAM. The semiconductor device has a plurality of memory banks each composed of the SESO or phase change memories, and a cache memory which has a number of ways equal to the ratio of a write speed (m) to a read speed (n). The semiconductor device controls the cache memory such that a write back operation is not repeated on the same memory bank.
摘要:
Provided are a wire electric discharge machining method for poorly conductive materials, such as solar cell silicon, and a semiconductor wafer manufacturing method and a solar battery cell manufacturing method based on the wire electric discharge machining method. Electrical discharge machining of a high volume resistivity, hard and brittle materials, having a volume resistivity that is equal to or higher than 0.5 Ω·cm and equal to or lower than 5 Ω·cm is performed by applying a pulse voltage having a pulse width that is equal to or higher than 1 μsec and equal to or lower than 4 μsec and having a peak current at the time of machining a wire electrode that is equal to or higher than 10A and equal to or lower than 50A to a wire electrode and generating a discharge pulse between the wire electrode and a subject to be machined.
摘要:
In a memory array structured of memory cells using a storage circuit STC and a comparator CP, either one electrode of a source electrode or a drain electrode of a transistor, whose gate electrode is connected to a search line, of a plurality of transistors structuring the comparator CP is connected to a match line HMLr precharged to a high voltage. Further, a match detector MDr is arranged on a match line LMLr precharged to a low voltage to discriminate a comparison signal voltage generated at the match line according to the comparison result of data. According to such memory array structure and operation, comparison operation can be performed at low power and at high speed while influence of search-line noise is avoided in a match line pair. Therefore, a low power content addressable memory which allows search operation at high speed can be realized.
摘要:
The range-specified IP addresses are effectively stored to reduce the number of necessary entries thereby the memory capacity of TCAM is improved. The representative means of the present invention is that: the storage information (entry) and the input information (comparison information or search key) are the common block code such that any bit must be the logical value ‘1’; Match-lines are hierarchically structured and memory cells are arranged at the intersecting points of a plurality of sub-match lines and a plurality of search lines; Further the sub-match lines are connected to main-match lines through the sub-match detectors, respectively and main-match detectors are arranged on the main-match lines.
摘要:
The present invention provides a data communication method and a data communication device capable of performing high-speed data communication by using a parallel link and higher-speed data communication by reducing a timing skew. A data communication method includes: a step of encoding data of N bits (N being 2 or larger) to transmission data of M bits (M being 3 or larger) on a transmission side; a step of generating a transmission signal in which transition takes place in at least one level of any of the transmission data synchronously with a transmission clock and transmitting the transmission signal to a transmission line on the transmission side; a step of recognizing transition in the signal of M bits received via the transmission line and detecting the reception data of M bits synchronized with the transmission clock on a reception side; and a step of decoding the reception data of M bits to the data of N bits.
摘要:
A dummy cell includes a plurality of first memory cells MC for storing “1” or “0”, arranged at points of intersection between a plurality of word lines WR0 to WR7 and a plurality of first data lines D0 to D7, a plurality of first dummy cells MCH for storing “1” or “0”, arranged at points of intersection between the word lines WR0 to WR7 and a first dummy data line, and a plurality of second dummy cells MCL for storing “0”, arranged at points of intersection between the word lines WR0 to WR7 and a second dummy data line DD1.
摘要:
A semiconductor memory device includes a plurality of memory cells, each including, a source region formed of a semiconductor material, a drain region formed of the semiconductor material, and a first region formed of the semiconductor material and located between the source region and the drain region. First and second insulator films sandwich the first region and a first gate electrode is connected to the first region through the first insulator film. In this arrangement, the first region is adapted to accumulate charges corresponding to stored information.