公开(公告)号：US09912058B2

公开(公告)日：2018-03-06

申请号：US14519166

申请日：2014-10-21

Applicant: Infineon Technologies AG

Inventor： Petteri Palm ,  Martin Buchsbaum ,  Josef Gruber ,  Juergen Hoelzl ,  Frank Pueschner ,  Peter Stampka

IPC: H01Q7/08 ,  H01Q1/24 ,  H01Q21/24

CPC classification number: H01Q7/08 ,  H01Q1/243 ,  H01Q21/24

Abstract: According to one embodiment, a hybrid antenna is described comprising a plurality of windings wherein each winding comprises a loop antenna portion arranged in a plane and a ferrite antenna portion arranged at least partially outside of the plane.

公开(公告)号：US20160004947A1

公开(公告)日：2016-01-07

申请号：US14771240

申请日：2014-02-27

Applicant: BUNDESDRUCKEREI GMBH ,  INFINEON TECHNOLOGIES AG

Inventor： Frank Pueschner ,  Joerg Fischer ,  Juergen Hoegerl ,  Peter Stampka ,  Markus Tietke ,  Stefan Troelenberg

IPC: G06K19/077

CPC classification number: G06K19/07705 ,  G06K19/07309 ,  G06K19/07722 ,  G06K19/07749 ,  G06K19/07754

Abstract: In various embodiments, a chip card module is provided that can have: a chip card module support; a wiring structure that is arranged on the chip card module support; an integrated circuit that is arranged on the chip card module support and is electrically coupled to the wiring structure; a chip card module antenna that is arranged on the chip card module support and is electrically coupled to the wiring structure, and a lighting device that is arranged on the chip card module support and is electrically coupled to the wiring structure.

Abstract translation: 在各种实施例中，提供了可以具有：芯片卡模块支撑的芯片卡模块; 布置在芯片卡模块支架上的布线结构; 布置在芯片卡模块上的集成电路支撑并电耦合到布线结构; 布置在芯片卡模块上的芯片卡模块天线，并且电耦合到布线结构;以及照明装置，布置在芯片卡模块上并被电耦合到布线结构。

公开(公告)号：US20230289554A1

公开(公告)日：2023-09-14

申请号：US18182468

申请日：2023-03-13

Applicant: Infineon Technologies AG

Inventor： Jens Pohl ,  Frank Püschner ,  Thomas Spöttl ,  Peter Stampka

IPC: G06K19/077

CPC classification number: G06K19/07747

Abstract: A smart card module including a contact region with at least one electrical smart card module contact, and a verification code display unit configured to display a verification code, the verification code display unit being arranged in the smart card module, wherein the verification code display unit is configured as a dynamic permanent display unit, the controlled display of which continues to be displayed after deenergization of the verification code display unit.

公开(公告)号：US20230021853A1

公开(公告)日：2023-01-26

申请号：US17866777

申请日：2022-07-18

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Peter Stampka ,  Jens Pohl ,  Uwe Wagner ,  Thomas Spoettl

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  B42D25/305

Abstract: A method for producing a document structure, wherein the method includes producing a chip structure by forming a cavity in a carrier having a top side and an under side, picking up a chip having at least one chip contact and a redistribution layer (RDL) connected to the at least one chip contact by means of a picking-up device detaching the chip from an auxiliary carrier, wherein the chip bears on the auxiliary carrier by way of the RDL, wherein the chip is lifted up from the auxiliary carrier by means of pressure being exerted on the RDL, wherein the lifted-up chip is picked up and inserted into the cavity, and wherein the RDL is oriented on the top side of the carrier, fixing the chip in the cavity by means of an adhesive, electrically conductively connecting the at least one chip contact of the RDL to an electrically conductive region of the carrier by means of an electrically conductive material, and embedding the carrier between a first paper layer and a second paper layer.

公开(公告)号：US10423870B2

公开(公告)日：2019-09-24

申请号：US14710689

申请日：2015-05-13

Applicant: Infineon Technologies AG

Inventor： Martin Buchsbaum ,  Josef Gruber ,  Juergen Hoelzl ,  Frank Pueschner ,  Peter Stampka

IPC: H01Q1/50 ,  G06K19/073 ,  H01Q7/08 ,  H01Q1/22 ,  H03H7/38 ,  H04B1/40 ,  H04B5/00

Abstract: Various embodiments provide a communication module having a carrier, a loop antenna, a modulation circuit which is coupled to the loop antenna and is configured to modulate or demodulate signals which are received or transmitted using the loop antenna, and an impedance matching circuit for matching the impedance of the loop antenna to the input impedance of the modulation circuit. The modulation circuit and the impedance matching circuit are arranged inside the loop antenna on or in the carrier.

公开(公告)号：US10380477B2

公开(公告)日：2019-08-13

申请号：US15406832

申请日：2017-01-16

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Peter Stampka ,  Siegfried Hoffner ,  Jens Pohl

IPC: G06K19/00 ,  G06K19/077

Abstract: A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna structure including a wire arranged to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna, wherein the wire may include an electrically conductive material coated with an electrically insulating material, wherein the wire of the first antenna portion may be arranged such that a direction of laying progress of the wire of at least some adjacent wire portions are opposite to each other, such that the at least some adjacent wire portions may form a capacitor, wherein the isolation material of the at least some adjacent wire portions may be physically contacting each other.

公开(公告)号：US09935042B2

公开(公告)日：2018-04-03

申请号：US15609136

申请日：2017-05-31

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Frank Pueschner ,  Guenther Ruhl ,  Peter Stampka

IPC: H01L23/48 ,  H01L23/498 ,  H01L25/065 ,  H01L23/367 ,  H01L23/495 ,  G06K19/07 ,  G06K19/077 ,  H05K1/11 ,  H01L23/00 ,  H01L23/34

CPC classification number: H01L23/498 ,  G06K19/072 ,  G06K19/07309 ,  G06K19/077 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/49537 ,  H01L23/573 ,  H01L24/73 ,  H01L25/0657 ,  H05K1/113

Abstract: A semiconductor package includes a chip, a layer which is thermally coupled to the chip and which is formed from a material having a triggering temperature of greater than or equal to 200° C., starting from which an exothermic reaction takes place, and encapsulating material which at least partly covers the chip and the layer. The layer is configured in such a way and is arranged relative to the chip in such a way that, in the case of a triggered exothermic reaction of the material of the layer, at least one component of the chip is damaged on account of the temperature increase caused by the exothermic reaction.

公开(公告)号：US20170345740A1

公开(公告)日：2017-11-30

申请号：US15609136

申请日：2017-05-31

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Frank Pueschner ,  Guenther Ruhl ,  Peter Stampka

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L23/495 ,  H01L23/367 ,  H01L23/34 ,  G06K19/077 ,  H05K1/11 ,  G06K19/07

CPC classification number: H01L23/498 ,  G06K19/072 ,  G06K19/07309 ,  G06K19/077 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/49537 ,  H01L23/573 ,  H01L24/73 ,  H01L25/0657 ,  H05K1/113

Abstract: A semiconductor package includes a chip, a layer which is thermally coupled to the chip and which is formed from a material having a triggering temperature of greater than or equal to 200° C., starting from which an exothermic reaction takes place, and encapsulating material which at least partly covers the chip and the layer. The layer is configured in such a way and is arranged relative to the chip in such a way that, in the case of a triggered exothermic reaction of the material of the layer, at least one component of the chip is damaged on account of the temperature increase caused by the exothermic reaction.

公开(公告)号：US09070067B2

公开(公告)日：2015-06-30

申请号：US14292270

申请日：2014-05-30

Applicant: Infineon Technologies AG

Inventor： Juergen Hoegerl ,  Andreas Mueller-Hipper ,  Frank Pueschner ,  Wolfgang Schindler ,  Peter Stampka

IPC: G06K19/06 ,  G06K19/077 ,  H01L23/00

CPC classification number: G06K19/07743 ,  G06K19/07728 ,  G06K19/07745 ,  H01L23/16 ,  H01L23/293 ,  H01L24/16 ,  H01L24/83 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/014

Abstract: A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.

Abstract translation: 用于智能卡的智能卡模块包括微芯片和用于通过读取器与微芯片接触的接触区域。 微芯片可以通过封装，其可以从所有侧面完全包围微芯片。

公开(公告)号：US20250045555A1

公开(公告)日：2025-02-06

申请号：US18777070

申请日：2024-07-18

Applicant: Infineon Technologies AG

Inventor： Jens Pohl ,  Frank Püschner ,  Peter Stampka

IPC: G06K19/077

Abstract: A method for producing a smart card inlay, including: introducing an antenna wire into a surface of a carrier, wherein the antenna wire comprises metal having an insulating coating; pinching the antenna wire such that a partial region of the metal of the antenna wire is stripped of insulation; and soldering the insulation-stripped partial region of the metal of the antenna wire with a metallic contact region of a smart card module that has been introduced into an opening of the carrier.