公开(公告)号：US20200285271A1

公开(公告)日：2020-09-10

申请号：US16792903

申请日：2020-02-18

Applicant: InnoLux Corporation

Inventor： Wan-Ling Huang ,  Shu-Ming Kuo ,  Tsau-Hua Hsieh ,  Chun-Hsien Lin ,  Tzu-Min Yan

IPC: G06F1/16 ,  G09F9/302

Abstract: A tiled display device includes a first panel. The first panel includes a first lower substrate and a first upper substrate disposed opposite to the first lower substrate. The first upper substrate includes a first upper surface, a first lower surface and a first side surface located between the first upper surface and the first lower surface. The tiled display device further includes a second panel disposed adjacent to the first panel. The second panel includes a second lower substrate and a second upper substrate disposed opposite to the second lower substrate. The second upper substrate includes a second upper surface, a second lower surface and a second side surface located between the second upper surface and the second lower surface. The second side surface is disposed adjacent to the first side surface. A portion of the first side surface is not perpendicular to the first upper surface or the first lower surface, and a portion of the second side surface is not perpendicular to the second upper surface or the second lower surface.

公开(公告)号：US10446752B2

公开(公告)日：2019-10-15

申请号：US15662522

申请日：2017-07-28

Applicant: InnoLux Corporation

Inventor： Chun-Hsien Lin ,  Ming-Chang Lin ,  Tzu-Min Yan ,  Tsau-Hua Hsieh ,  Tung-Kai Liu ,  Jui-Feng Ko ,  Hui-Chieh Wang

IPC: H01L51/00 ,  H01L27/28 ,  H01L27/32 ,  H01L21/48

Abstract: A light-emitting diode display device includes a light-emitting diode and a substrate. The light-emitting diode includes a central axis, and the substrate includes a first connecting portion and a second connecting portion. The central axis is extended through the first connecting portion. The second connecting portion is disposed outside of the first connecting portion and is spaced apart from the first connecting portion by a distance which is greater than zero, and the first connecting portion and the second connecting portion are respectively electrically connected to the light-emitting diode.

公开(公告)号：US10217403B2

公开(公告)日：2019-02-26

申请号：US15597149

申请日：2017-05-16

Applicant: Innolux Corporation

Inventor： Chun-Hsien Lin ,  Chih-Yung Hsieh ,  Tsau-Hua Hsieh ,  Shu-Ming Kuo

IPC: H01L33/58 ,  G09G3/32 ,  G09G3/20 ,  H01L27/12 ,  H01L25/075 ,  H01L33/62 ,  H01L33/42

Abstract: The disclosure provides a display apparatus. The display apparatus of the disclosure includes a substrate having a plurality of pixel regions, a plurality of active elements, a plurality of first signal lines and second signal lines, a plurality of ground signal lines and a plurality of light emitting diodes (LEDs). The plurality of ground signal lines are disposed on the substrate and arranged to alternate with the first signal lines. At least one LED has first and second electrodes. The first electrode of at least one LED is electrically connected with a corresponding active element. A second electrode of at least one LED is electrically connected with a corresponding ground signal line. At least two LEDs disposed in an identical pixel region is electrically connected with an identical ground signal line between two first signal lines adjacent to each other. The display apparatus of the disclosure has high resolution.

公开(公告)号：US20170345801A1

公开(公告)日：2017-11-30

申请号：US15603482

申请日：2017-05-24

Applicant: Innolux Corporation ,  Advanced Optoelectronic Technology Inc.

Inventor： Chun-Hsien Lin ,  Tsau-Hua Hsieh ,  Po-Min Tu ,  Tzu-Chien Hung ,  Chien-Chung Peng ,  Shih-Cheng Huang

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/54 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L25/075 ,  H01L25/0756 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/15 ,  H01L33/0079 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A display apparatus and a fabricating method thereof are provided. The display apparatus includes a substrate, a light emitting diode, a first bump, a first insulating layer and a second insulating layer. The light emitting diode has a first surface and a second surface opposite each other, wherein the first surface faces the substrate. The light emitting diode is bonded to the substrate through the first bump. The first insulating layer is disposed on a periphery of the first bump and the light emitting diode, and contacts the first bump and the first surface. The second insulating layer is disposed on the substrate and surrounds at least a portion of the first insulating layer.

公开(公告)号：US20250072195A1

公开(公告)日：2025-02-27

申请号：US18943853

申请日：2024-11-11

Applicant: Innolux Corporation

Inventor： Chun-Hsien Lin ,  Shuhei Hosaka

IPC: H01L33/62 ,  H01L25/075

Abstract: An electronic device includes a substrate, a circuit structure, a light blocking layer and an opening. The circuit structure is disposed on the substrate and includes at least one data wire, at least one scan wire, a plurality of primary bonding pads, and a plurality of reserved bonding pads. The plurality of primary bonding pads are configured to be bonded with electronic elements, and the plurality of reserved bonding pads are configured to be bonded with repair or backup electronic elements. The light blocking layer is disposed on the substrate and overlapping with the circuit structure. A material of the light blocking layer includes metal. The opening is surrounded and enclosed by the light blocking layer, and configured to allow ambient light to penetrate. The opening does not overlap with the plurality of primary bonding pads and the plurality of reserved bonding pads.

公开(公告)号：US12170347B2

公开(公告)日：2024-12-17

申请号：US17504519

申请日：2021-10-19

Applicant: Innolux Corporation

Inventor： Chun-Hsien Lin ,  Shuhei Hosaka

IPC: H01L33/62 ,  H01L25/075

Abstract: An embodiment of the disclosure provides an electronic device including multiple units. Each unit in the units includes multiple primary bonding regions and at least one reserved bonding region. Each reserved bonding region is connected to the primary bonding regions. The number of the at least one reserved bonding region is less than the number of primary bonding regions.

公开(公告)号：US11994779B2

公开(公告)日：2024-05-28

申请号：US18171510

申请日：2023-02-20

Applicant: InnoLux Corporation

Inventor： Chun-Hsien Lin

IPC: G02F1/1362 ,  H10K59/131

CPC classification number: G02F1/136263 ,  G02F1/136227 ,  H10K59/131 ,  G02F2201/506

Abstract: An electronic device includes a conductive structure, a first insulation layer and a second insulation layer. The first insulation layer is disposed on the conductive structure. The second insulation layer is disposed on the first insulation layer. The first insulation layer includes a first hole, and the first hole overlaps a part of the conductive structure. The second insulation layer includes a second hole, and the first hole and the second hole at least partially overlap. A width of the second hole is less than a width of the first hole.

公开(公告)号：US11949040B2

公开(公告)日：2024-04-02

申请号：US17725732

申请日：2022-04-21

Applicant: InnoLux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Tung-Kai Liu ,  Hui-Chieh Wang ,  Chun-Hsien Lin ,  Jui-Feng Ko

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/32

CPC classification number: H01L33/0093 ,  H01L33/0095 ,  H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0075 ,  H01L33/32 ,  H01L2933/0066

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

公开(公告)号：US20230102061A1

公开(公告)日：2023-03-30

申请号：US17486868

申请日：2021-09-27

Applicant: Innolux Corporation

Inventor： Hirofumi Watsuda ,  Shu-Ming Kuo ,  Chun-Hsien Lin

IPC: H01L23/525 ,  H01L33/62 ,  H01L21/768

Abstract: An electronic device and method of fabricating the same are provided herein. The electronic device includes a first main pad; a second main pad; a first repair line electrically connected to the first main pad; a second repair line electrically connected to the second main pad, wherein the first repair line and the second repair line forms a first weldable region; a first spare pad; a second spare pad; a connection line electrically connected to the second repair line, the first spare pad and the second spare pad; and a first electronic unit disposed on the first main pad and the second main pad.

公开(公告)号：US11528832B2

公开(公告)日：2022-12-13

申请号：US17180878

申请日：2021-02-22

Applicant: InnoLux Corporation

Inventor： Wan-Ling Huang ,  Tzu-Yuan Lin ,  Geng-Fu Chang ,  Chun-Hsien Lin ,  Shu-Ming Kuo ,  Jui-Feng Ko ,  Tsau-Hua Hsieh

IPC: H05K7/20 ,  H05K1/18 ,  H05K5/00 ,  H05K1/14

Abstract: An electronic device is provided, which is for coupling to another electronic device in a side-by-side manner, and the electronic device includes a substrate, a first thermal dissipation sheet and a thermal dissipation element. The substrate includes a first surface and a second surface. The first thermal dissipation sheet is disposed on the first surface. The thermal dissipation element is disposed on the substrate. The first thermal dissipation sheet is disposed between the thermal dissipation element and the substrate, and the thermal dissipation element at least partially overlaps the first thermal dissipation sheet.