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公开(公告)号：US20210011853A1
公开(公告)日：2021-01-14
申请号：US16939158
申请日：2020-07-27
Applicant: Intel Corporation
Inventor： Jianfang Zhu , Cristiano J. Ferreira , Bo Qiu , Ajit Krisshna Nandyal Lakshman , Nikhil Talpallikar , Deepak Gandiga Shivakumar , Brandt M. Guttridge , Kim Pallister , Frank J. Soqui , Anand Srivatsa , Travis T. Schluessler , Abhishek R. Appu , Ankur N. Shah , Joydeep Ray , Altug Koker , Jonathan Kennedy
IPC: G06F12/10 , G06F12/0875 , G06F12/0811 , G06T1/60
Abstract: An embodiment of an electronic processing system may include an application processor, system memory communicatively coupled to the application processor, a graphics processor communicatively coupled to the application processor, graphics memory communicatively coupled to the graphics processor, and persistent storage media communicatively coupled to the application processor and the graphics processor to store one or more graphics assets, wherein the graphics processor is to access the one or more graphics asset mapped from the persistent storage media. The persistent storage media may include a low latency, high capacity, and byte-addressable nonvolatile memory. The one or more graphics assets may include one or more of a mega-texture and terrain data. Other embodiments are disclosed and claimed.
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公开(公告)号：US10152100B2
公开(公告)日：2018-12-11
申请号：US15200614
申请日：2016-07-01
Applicant: Intel Corporation
Inventor： Michael Ahrens , George H. Daskalakis , Steven J. Lofland , David Pidwerbecki , Bo Qiu , James C. Raupp , Stacy L. Yee
IPC: G06F1/20 , H05K7/20 , H01L23/367 , G06F1/32 , G06F1/16
Abstract: In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.
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公开(公告)号：USD829166S1
公开(公告)日：2018-09-25
申请号：US29559312
申请日：2016-03-26
Applicant: Intel Corporation
Designer： Sayan Lahiri , Bo Qiu , Reese Bowes , Jianfang Olena Zhu , Bradley Alan Jackson
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公开(公告)号：US20180004261A1
公开(公告)日：2018-01-04
申请号：US15200614
申请日：2016-07-01
Applicant: Intel Corporation
Inventor： Michael Ahrens , George H. Daskalakis , Steven J. Lofland , David Pidwerbecki , Bo Qiu , James C. Raupp , Stacy L. Yee
CPC classification number: G06F1/206 , G06F1/1632 , G06F1/203 , G06F1/3203 , G06F1/3234 , H01L23/367 , H05K7/20127 , H05K7/20154 , H05K7/2039
Abstract: In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.
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公开(公告)号：US20230421802A1
公开(公告)日：2023-12-28
申请号：US18345880
申请日：2023-06-30
Applicant: Intel Corporation
Inventor： Yunbiao Lin , Changliang Wang , Ce Wang , Yongfa Zhou , Bo Zhao , Ping Liu , Jianwei Yang , Zhan Lou , Yu Yang , Yating Wang , Wenyi Tang , Bo Qiu
IPC: H04N19/527 , H04N19/154 , H04N19/167 , H04N19/176 , H04N19/52 , H04N19/189 , H04N21/6587
CPC classification number: H04N19/527 , H04N19/154 , H04N19/167 , H04N19/176 , H04N19/52 , H04N19/189 , H04N21/6587 , H04N13/161
Abstract: An embodiment of an adaptive video encoder may include technology to determine headset-related information including at least one of focus-related information and motion-related information, and determine one or more video encode parameters based on the headset-related information. Other embodiments are disclosed and claimed.
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Patent Agency Ranking
公开(公告)号：US11736716B2
公开(公告)日：2023-08-22
申请号：US17526388
申请日：2021-11-15
Applicant: Intel Corporation
Inventor： Yunbiao Lin , Changliang Wang , Ce Wang , Yongfa Zhou , Bo Zhao , Ping Liu , Jianwei Yang , Zhan Lou , Yu Yang , Yating Wang , Wenyi Tang , Bo Qiu
IPC: H04N7/12 , H04N19/527 , H04N19/154 , H04N19/167 , H04N19/176 , H04N19/52 , H04N19/189 , H04N21/6587 , H04N13/161
CPC classification number: H04N19/527 , H04N19/154 , H04N19/167 , H04N19/176 , H04N19/189 , H04N19/52 , H04N21/6587 , H04N13/161
Abstract: An embodiment of an adaptive video encoder may include technology to determine headset-related information including at least one of focus-related information and motion-related information, and determine one or more video encode parameters based on the headset-related information. Other embodiments are disclosed and claimed.
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公开(公告)号：US11178424B2
公开(公告)日：2021-11-16
申请号：US16651676
申请日：2017-11-23
Applicant: Intel Corporation
Inventor： Yunbiao Lin , Changliang Wang , Ce Wang , Yongfa Zhou , Bo Zhao , Ping Liu , Jianwei Yang , Zhan Lou , Yu Yang , Yating Wang , Wenyi Tang , Bo Qiu
IPC: H04N7/12 , H04N19/527 , H04N19/154 , H04N19/167 , H04N19/176 , H04N19/52 , H04N19/189 , H04N13/161
Abstract: An embodiment of an adaptive video encoder may include technology to determine headset-related information including at least one of focus-related information and motion-related information, and determine one or more video encode parameters based on the headset-related information. Other embodiments are disclosed and claimed.
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公开(公告)号：US20200264698A1
公开(公告)日：2020-08-20
申请号：US16793539
申请日：2020-02-18
Applicant: Intel Corporation
Inventor： Karthik Veeramani , Jianfang Zhu , Sayan Lahiri , Bo Qiu , Bradley A. Jackson , Paul S. Diefenbaugh , Kim Pallister
Abstract: An embodiment of a graphics apparatus may include an image generator, and a gesture tracker communicatively coupled to the image generator. The image generator may be configured to generate an image of a virtual input device, the gesture tracker may be configured to determine a position of a user's finger relative to the virtual input device, and the image generator may be further configured to generate an image of a virtual finger based on the determined position of the user's finger relative to the virtual input device. Other embodiments are disclosed and claimed.
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公开(公告)号：US20180293173A1
公开(公告)日：2018-10-11
申请号：US15483741
申请日：2017-04-10
Applicant: Intel Corporation
Inventor： Jianfang Zhu , Cristiano J. Ferreira , Bo Qiu , Ajit Krisshna Nandyal Lakshman , Nikhil Talpallikar , Deepak Gandiga Shivakumar , Brandt M. Guttridge , Kim Pallister , Frank J. Soqui , Anand Srivatsa , Travis T. Schluessler , Abhishek R. Appu , Ankur N. Shah , Joydeep Ray , Altug Koker , Jonathan Kennedy
IPC: G06F12/10
Abstract: An embodiment of an electronic processing system may include an application processor, system memory communicatively coupled to the application processor, a graphics processor communicatively coupled to the application processor, graphics memory communicatively coupled to the graphics processor, and persistent storage media communicatively coupled to the application processor and the graphics processor to store one or more graphics assets, wherein the graphics processor is to access the one or more graphics asset mapped from the persistent storage media. The persistent storage media may include a low latency, high capacity, and byte-addressable nonvolatile memory. The one or more graphics assets may include one or more of a mega-texture and terrain data. Other embodiments are disclosed and claimed.
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公开(公告)号：US09980412B2
公开(公告)日：2018-05-22
申请号：US15280746
申请日：2016-09-29
Applicant: Intel Corporation
Inventor： Bo Qiu , Xi Guo , James C. Raupp , Michael Ahrens , David Pidwerbecki , Steven J. Lofland , George H. Daskalakis , Stacy L. Yee , Mark MacDonald
CPC classification number: H05K7/20509 , G06F1/1681 , G06F1/203 , H05K1/0203 , H05K1/0204 , H05K1/0209 , H05K1/181 , H05K5/0017 , H05K5/0226 , H05K7/20409 , H05K7/20963 , H05K2201/066
Abstract: Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.
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