Abstract:
A tunneling field effect transistor (TFET) device includes a semiconductor substrate having a layer of relatively intermediate bandgap semiconductor material, a layer of relatively low bandgap semiconductor material overlying the layer of relatively intermediate bandgap semiconductor material, and a layer of relatively high bandgap semiconductor material overlying the layer of relatively low bandgap semiconductor material. The TFET device includes a source region, a drain region, and a channel region defined in the semiconductor substrate. The TFET device also has a gate structure overlying at least a portion of the channel region. The source region is highly doped with an impurity dopant having a first conductivity type, and the drain region is highly doped with an impurity dopant having a second conductivity type. The layer of relatively low bandgap semiconductor material promotes tunneling at a first junction between the source region and the channel region, and the layer of relatively high bandgap semiconductor material inhibits tunneling at a second junction between the source region and the channel region.
Abstract:
A method of manufacturing semiconductor fins for a semiconductor device may begin by providing a bulk semiconductor substrate. The method continues by growing a layer of first epitaxial semiconductor material on the bulk semiconductor substrate, and by growing a layer of second epitaxial semiconductor material on the layer of first epitaxial semiconductor material. The method then creates a fin pattern mask on the layer of second epitaxial semiconductor material. The fin pattern mask has features corresponding to a plurality of fins. Next, the method anisotropically etches the layer of second epitaxial semiconductor material, using the fin pattern mask as an etch mask, and using the layer of first epitaxial semiconductor material as an etch stop layer. This etching step results in a plurality of fins formed from the layer of second epitaxial semiconductor material.
Abstract:
Disclosed are novel compounds that can be used as an energetic binder used for improving the performance and the properties of a high explosive, and a preparation method thereof. More specifically, provided are glycidyl dinitropropyl formal of chemical formula IV having a nitro group (—NO2) as an energy group and having no hydrogen bonding to carbon to which the nitro group is binding, poly(glycidyl dinitropropyl formal) of chemical formula V polymerized using the glycidyl dinitropropyl formal as a monomer, and a preparation method thereof.
Abstract:
Disclosed are a membrane coupled activated sludge method and apparatus operating anoxic/anaerobic processes alternately for removal of nitrogen and phosporus, wherein nitrogen and phosphorous together with organics in the sewage, wastewater, filthy water etc. can be simultaneously removed with an economic and efficient manner, an operation thereof is easy and efficient, a capacity thereof is high and the method is economic due to the reduced operating costs with performing measurement and control of a recycle rate, a recycle time of alternate operation of the anoxic and anaerobic process, an amount of sludge, an amount of aeration and an operation of a blower for an intermittent membrane cleaning.
Abstract:
A disk drive assembly including a disk drive, a bracket for containing the disk drive, and a damper for absorbing an impact transmitted to the disk drive. The damper may have a shape of a ring to encircle a corner of the disk drive and may be formed of an elastic material to buffer an impact transmitted between the disk drive and the bracket. Particularly, since the width and/or diameter of the damper may be formed with a minimized size, the damper is capable of providing sufficient buffering properties. In addition, the space occupied by the damper may further be minimized. Thus, since the space occupied by the disk drive assembly may be reduced, it is possible to favorably apply the assembly to a portable electronic device.
Abstract:
A circuit for detecting the amount of radio frequency power provided by an amplifier. The circuit contains an array of coupled transistors in two power amplifiers, and a log-detector circuit, all resident on a single semiconductor die. The main power amplifier contains the larger array of transistors to amplify the radio frequency signal for feeding to an antenna, and a secondary power amplifier contains a smaller array of transistors to provide a scaled output that is proportional to the amplified radio frequency signal and is used to control the main power amplifier. The log-detector circuit converts the signal from the secondary power amplifier to a full-wave rectified log-linear DC signal that is logarithmically proportional to the controlling signal. The DC signal output from the log-detector circuit is fed to the main power amp to control it.
Abstract:
An exhaust gas catalyst where the catalyst efficiency is improved by enhancing diffusion of the exhaust gas in a catalyst layer. An exhaust gas catalyst comprises at least a carrier and a plurality of layers formed on the carrier. At least one of the layers has pores therein, and at least one other layer has pores therein and contains, as catalyst components, a noble metal, alumina and a complex oxide mainly containing ceria, zirconia and one or more rare earth elements other than cerium.
Abstract:
One method disclosed herein includes forming a plurality of source/drain contacts that are conductively coupled to a source/drain region of a plurality of transistor devices, wherein at least one of the source/drain contacts is a local interconnect structure that spans the isolation region and is conductively coupled to a first source/drain region in a first active region and to a second source/drain region in a second active region, and forming a patterned mask layer that covers the first and second active regions and exposes at least a portion of the local interconnect structure positioned above an isolation region that separates the first and second active regions. The method further includes performing an etching process through the patterned mask layer to remove a portion of the local interconnect structure, thereby defining a recess positioned above a remaining portion of the local interconnect structure, and forming an insulating material in the recess.
Abstract:
A content addressable memory includes a first plurality of search lines, a second plurality of search lines, a first match line, and a storage location. Each search line of the first plurality of search lines receives a corresponding high voltage level or low voltage level during a match detect operation, and each search line of the second plurality of search lines to receive a corresponding high voltage level or low voltage level during the match detect operation. The storage location of the content addressable memory includes a plurality of CAM cells, each CAM cell a first thyristor and second thyristor.
Abstract:
A content addressable memory includes a first plurality of search lines, a second plurality of search lines, a first match line, and a storage location. Each search line of the first plurality of search lines receives a corresponding high voltage level or low voltage level during a match detect operation, and each search line of the second plurality of search lines to receive a corresponding high voltage level or low voltage level during the match detect operation. The storage location of the content addressable memory includes a plurality of CAM cells, each CAM cell a first thyristor and second thyristor.