Abstract:
In one embodiment, a method of forming a MEMS device includes providing a substrate, forming a sacrificial layer above the substrate layer, forming a silicon based working portion on the sacrificial layer, releasing the silicon based working portion from the sacrificial layer such that the working portion includes at least one exposed outer surface, forming a first layer of silicide forming metal on the at least one exposed outer surface of the silicon based working portion, and forming a first silicide layer with the first layer of silicide forming metal.
Abstract:
An acceleration sensor includes a substrate and a first mass element, which is connected to the substrate in such a way that the first mass element is rotatable about an axis, the first mass element being connected to a second mass element in such a way that the second mass element is movable along a first direction parallel to the axis, and the first mass element being connected to a third mass element in such a way that the third mass element is movable along a second direction perpendicular to the axis.
Abstract:
A rate-of-rotation sensor having a substrate and a first Coriolis element are provided, an excitation arrangement being provided for the excitation of vibrations of the first Coriolis element in a first direction, a first detection arrangement being provided for detecting a first deflection of the first Coriolis element in a third direction running generally perpendicular to the first direction; characterized by the first Coriolis element being developed as balancing rocker.
Abstract:
A rotation rate sensor includes: a mounting device; a first drive frame having a drive, which is designed to set the first drive frame into a first oscillatory motion along an axis of oscillation relative to the mounting device; a first stator electrode; a first actuator electrode coupled to the first drive frame in such a way that in a rotary motion of the rotation rate sensor due to a Coriolis force, the first actuator electrode being displaceable in a first deflection direction relative to the first stator electrode; and an evaluation device configured to determine a voltage applied between the first stator electrode and the first actuator electrode, and to specify information regarding the rotary motion of the rotation rate sensor while taking the determined voltage value into account.
Abstract:
An acceleration sensor includes a substrate, a rocker mass, a z spring connected to the rocker mass, which allows the rocker mass to rotate about an axis, and at least one additional spring system connected to the substrate and the rocker mass. The additional spring system allows the rocker mass to deflect in an x or y direction oriented parallel or perpendicular to the axis. The z spring or the additional spring system allows the rocker mass to deflect in a y or x direction oriented parallel or perpendicular to the axis.
Abstract:
An acceleration sensor includes a substrate and a first mass element, which is connected to the substrate in such a way that the first mass element is rotatable about an axis, the first mass element being connected to a second mass element in such a way that the second mass element is movable along a first direction parallel to the axis, and the first mass element being connected to a third mass element in such a way that the third mass element is movable along a second direction perpendicular to the axis.
Abstract:
A micromechanical z-sensor includes a sensitivity, a torsion spring, and a seismic additional mass, the torsion spring having a spring width, and the seismic additional mass including webs having a web width. The web width is selected smaller than the spring width.
Abstract:
A yaw rate sensor includes a drive mass element which is situated above a surface of a substrate and is drivable to vibrate by a drive device along a first axis extending along the surface, having a detection mass element, which is deflectable under the influence of a Coriolis force along a second axis perpendicular to the surface, and having a detection device by which the deflection of the detection mass element along the second axis is detectable. Due to the arrangement of the second axis perpendicular to the surface, the yaw rate sensor may be integrated into a chip together with additional yaw rate sensors suitable for detection of rotations about axes of rotation in other directions.
Abstract:
A micromechanical rotation rate sensor has a seismic mass and driving devices which cause a driving vibration of the seismic mass in a first direction x. The rotation rate sensor has measuring devices which measure a deflection of the seismic mass in a second direction y, and generate a deflection signal. The deflection includes a measurement deflection caused by a Coriolis force and an interference deflection, the interference deflection being phase-shifted with respect to the measurement deflection by 90°. Compensation devices are provided at the seismic mass to reduce the interference deflection. Regulation devices are provided, to which the deflection signal is supplied as an input variable, which demodulate an interference deflection signal from the deflection signal, and which generate a compensation signal from the interference deflection signal, which is supplied to the compensation devices.
Abstract:
A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.