DYNAMIC RANDOM ACCESS MEMORY CIRCUIT, DESIGN STRUCTURE AND METHOD
    21.
    发明申请
    DYNAMIC RANDOM ACCESS MEMORY CIRCUIT, DESIGN STRUCTURE AND METHOD 有权
    动态随机访问存储器电路,设计结构和方法

    公开(公告)号:US20090268510A1

    公开(公告)日:2009-10-29

    申请号:US12108548

    申请日:2008-04-24

    IPC分类号: G11C11/24 H01L21/8242

    摘要: Disclosed is a DRAM circuit that incorporates an improved reference cell, has half the capacitance of the memory cell, does not require a particular reference voltage, and can be formed using the same fabrication processes as the memory cell. This DRAM circuit comprises a memory cell with a single trench capacitor and a reference cell having two trench capacitors. The two reference cell trench capacitors are connected in series through a merged buried capacitor plate such that they provide half the capacitance of the memory cell trench capacitor. Additionally, the reference cell trench capacitors have essentially the same structure as the memory cell trench capacitor so that they can be formed in conjunction with the memory cell trench capacitor. Also disclosed are a design structure for the above-described memory circuit and a method for forming the above-described memory circuit.

    摘要翻译: 公开了一种DRAM电路,其包含改进的参考单元,具有存储单元的一半电容,不需要特定参考电压,并且可以使用与存储单元相同的制造工艺来形成。 该DRAM电路包括具有单沟槽电容器的存储单元和具有两个沟槽电容器的参考单元。 两个参考单元沟槽电容器通过合并的埋入式电容器板串联连接,使得它们提供存储单元沟槽电容器的一半的电容。 此外,参考单元沟槽电容器具有与存储单元沟槽电容器基本相同的结构,使得它们可以与存储单元沟槽电容器结合形成。 还公开了用于上述存储电路的设计结构和用于形成上述存储电路的方法。

    EMBEDDED DRAM HAVING MULTI-USE REFRESH CYCLES
    22.
    发明申请
    EMBEDDED DRAM HAVING MULTI-USE REFRESH CYCLES 审中-公开
    嵌入式DRAM具有多次使用的刷新周期

    公开(公告)号:US20090193186A1

    公开(公告)日:2009-07-30

    申请号:US12019818

    申请日:2008-01-25

    IPC分类号: G06F12/00

    摘要: An embedded DRAM (eDRAM) having multi-use refresh cycles is described. In one embodiment, there is a multi-level cache memory system that comprises a pending write queue configured to receive pending prefetch operations from at least one of the levels of cache. A prefetch queue is configured to receive prefetch operations for at least one of the levels of cache. A refresh controller is configured to determine addresses within each level of cache that are due for a refresh. The refresh controller is configured to assert a refresh write-in signal to write data supplied from the pending write queue specified for an address due for a refresh rather than refresh existing data. The refresh controller asserts the refresh write-in signal in response to a determination that there is pending data to supply to the address specified to have the refresh. The refresh controller is further configured to assert a refresh read-out signal to send refreshed data to the prefetch queue of a higher level of cache as a prefetch operation in response to a determination that the refreshed data is useful.

    摘要翻译: 描述了具有多次使用刷新周期的嵌入式DRAM(eDRAM)。 在一个实施例中,存在多级高速缓冲存储器系统,其包括被配置为从高速缓存的至少一个级别接收未决的预取操作的等待写入队列。 预取队列被配置为接收至少一个缓存级别的预取操作。 刷新控制器被配置为确定要刷新到期的每个高速缓存级别内的地址。 刷新控制器被配置为断言刷新写入信号以写入从针对刷新而不是刷新现有数据的地址指定的等待写入队列提供的数据。 刷新控制器响应于确定有未决数据提供给被指定为刷新的地址,来确定刷新写入信号。 刷新控制器还被配置为响应于确定刷新的数据是有用的,将更新读出信号断言以将更新的数据发送到较高级别的高速缓存的预取队列作为预取操作。

    SEMICONDUCTOR-ON-OXIDE STRUCTURE AND METHOD OF FORMING
    23.
    发明申请
    SEMICONDUCTOR-ON-OXIDE STRUCTURE AND METHOD OF FORMING 有权
    半导体氧化物结构及其形成方法

    公开(公告)号:US20130256830A1

    公开(公告)日:2013-10-03

    申请号:US13435056

    申请日:2012-03-30

    CPC分类号: H01L29/06 H01L21/76254

    摘要: Semiconductor-on-oxide structures and related methods of forming such structures are disclosed. In one case, a method includes: forming a first dielectric layer over a substrate; forming a first conductive layer over the first dielectric layer, the first conductive layer including one of a metal or a silicide; forming a second dielectric layer over the first conductive layer; bonding a donor wafer to the second dielectric layer, the donor wafer including a donor dielectric and a semiconductor layer; cleaving the donor wafer to remove a portion of the donor semiconductor layer; forming at least one semiconductor isolation region from an unremoved portion of the donor semiconductor layer; and forming a contact to the first conductive layer through donor dielectric and the second dielectric layer.

    摘要翻译: 公开了形成这种结构的半导体 - 氧化物结构和相关方法。 在一种情况下,一种方法包括:在衬底上形成第一介质层; 在所述第一介电层上形成第一导电层,所述第一导电层包括金属或硅化物之一; 在所述第一导电层上形成第二电介质层; 将施主晶片键合到第二介电层,施主晶片包括施主电介质和半导体层; 切割施主晶片以去除施主半导体层的一部分; 从所述施主半导体层的未移动部分形成至少一个半导体隔离区; 以及通过施主电介质和第二介电层形成与第一导电层的接触。

    DEEP TRENCH ELECTROSTATIC DISCHARGE (ESD) PROTECT DIODE FOR SILICON-ON-INSULATOR (SOI) DEVICES
    24.
    发明申请
    DEEP TRENCH ELECTROSTATIC DISCHARGE (ESD) PROTECT DIODE FOR SILICON-ON-INSULATOR (SOI) DEVICES 失效
    用于硅绝缘体(SOI)器件的深度放电静电放电(ESD)保护二极管

    公开(公告)号:US20120083091A1

    公开(公告)日:2012-04-05

    申请号:US13324486

    申请日:2011-12-13

    IPC分类号: H01L21/02

    摘要: A semiconductor includes a bulk substrate of a first polarity type, a buried insulator layer disposed on the bulk substrate, an active semiconductor layer disposed on top of the buried insulator layer including a shallow trench isolation region and a diffusion region of the first polarity type, a band region of a second polarity type disposed directly beneath the buried insulator layer and forming a conductive path, a well region of the second polarity type disposed in the bulk substrate and in contact with the band region, a deep trench filled with a conductive material of the first polarity type disposed within the well region, and an electrostatic discharge (ESD) protect diode defined by a junction between a lower portion of the deep trench and the well region.

    摘要翻译: 半导体包括第一极性类型的体基板,设置在体基板上的掩埋绝缘体层,设置在包括浅沟槽隔离区和第一极性类型的扩散区的掩埋绝缘体层的顶部上的有源半导体层, 第二极性类型的带区域直接设置在掩埋绝缘体层的正下方并形成导电路径,第二极性类型的阱区域布置在本体衬底中并与带区域接触,填充有导电材料的深沟槽 设置在阱区内的第一极性类型和由深沟槽的下部与阱区之间的接合部限定的静电放电(ESD)保护二极管。

    EMBEDDED DYNAMIC RANDOM ACCESS MEMORY DEVICE AND METHOD
    25.
    发明申请
    EMBEDDED DYNAMIC RANDOM ACCESS MEMORY DEVICE AND METHOD 有权
    嵌入式动态随机访问存储器件和方法

    公开(公告)号:US20110180862A1

    公开(公告)日:2011-07-28

    申请号:US12692760

    申请日:2010-01-25

    摘要: Embodiments of the invention provide an integrated circuit for an embedded dynamic random access memory (eDRAM), a semiconductor-on-insulator (SOI) wafer in which such an integrated circuit may be formed, and a method of forming an eDRAM in such an SOI wafer. One embodiment of the invention provides an integrated circuit for an embedded dynamic random access memory (eDRAM) comprising: a semiconductor-on-insulator (SOI) wafer including: an n-type substrate; an insulator layer atop the n-type substrate; and an active semiconductor layer atop the insulator layer; a plurality of deep trenches, each extending from a surface of the active semiconductor layer into the n-type substrate; a dielectric liner along a surface of each of the plurality of deep trenches; and an n-type conductor within each of the plurality of deep trenches, the dielectric liner separating the n-type conductor from the n-type substrate; wherein the n-type substrate, the dielectric liner, and the n-type conductor form a buried plate, a node dielectric, and a node plate, respectively, of a cell capacitor.

    摘要翻译: 本发明的实施例提供了一种用于嵌入式动态随机存取存储器(eDRAM),其中可形成这种集成电路的绝缘体上半导体(SOI)晶片的集成电路,以及在这种SOI中形成eDRAM的方法 晶圆。 本发明的一个实施例提供了一种用于嵌入式动态随机存取存储器(eDRAM)的集成电路,包括:绝缘体上半导体(SOI)晶片,其包括:n型衬底; 位于n型衬底顶部的绝缘体层; 和位于绝缘体层顶部的有源半导体层; 多个深沟槽,各自从有源半导体层的表面延伸到n型衬底中; 沿着所述多个深沟槽中的每一个的表面的电介质衬垫; 以及在所述多个深沟槽的每一个内的n型导体,所述电介质衬垫将所述n型导体与所述n型衬底分离; 其中所述n型衬底,所述电介质衬垫和所述n型导体分别形成电池电容器的掩埋板,节点电介质和节点板。

    REFERENCE LEVEL GENERATION WITH OFFSET COMPENSATION FOR SENSE AMPLIFIER
    26.
    发明申请
    REFERENCE LEVEL GENERATION WITH OFFSET COMPENSATION FOR SENSE AMPLIFIER 有权
    用于感应放大器的偏移补偿的参考电平生成

    公开(公告)号:US20110051532A1

    公开(公告)日:2011-03-03

    申请号:US12550848

    申请日:2009-08-31

    IPC分类号: G11C5/14 G11C7/00

    CPC分类号: G11C7/14 G11C7/065 G11C7/12

    摘要: An approach that provides reference level generation with offset compensation for a sense amplifier is described. In one embodiment, an arbitrary reference level is generated to provide an offset that compensates for device mismatch and voltage threshold of a sense amplifier.

    摘要翻译: 描述了一种为感测放大器提供具有偏移补偿的参考电平生成的方法。 在一个实施例中,产生任意参考电平以提供补偿读出放大器的器件失配和电压阈值的偏移。

    DESIGN STRUCTURE INCLUDING FAILING ADDRESS REGISTER AND COMPARE LOGIC FOR MULTI-PASS REPAIR OF MEMORY ARRAYS
    27.
    发明申请
    DESIGN STRUCTURE INCLUDING FAILING ADDRESS REGISTER AND COMPARE LOGIC FOR MULTI-PASS REPAIR OF MEMORY ARRAYS 失效
    设计结构,包括失败地址寄存器和比较逻辑,用于存储器阵列的多次修复

    公开(公告)号:US20090158224A1

    公开(公告)日:2009-06-18

    申请号:US12128197

    申请日:2008-05-28

    IPC分类号: G06F17/50

    摘要: Disclosed is design structure including an integrated circuit having a system for moving a failing address into a new FAR by utilizing the functional compare circuitry during BIST of redundant memory elements. Disclosed is an any-for-any scheme that eliminates the tri-state address bus. The design structure allows for easy, discrete scaling with the addition of more FARs, while also allowing larger addresses with no additional control circuit overhead.

    摘要翻译: 公开了包括集成电路的集成电路,该集成电路具有通过在冗余存储器元件的BIST期间利用功能比较电路将故障地址移动到新的FAR中的系统。 公开了一种消除三态地址总线的任何方案。 该设计结构允许通过添加更多FAR来实现简单,离散的缩放,同时还允许更大的地址,而无需额外的控制电路开销。

    APPARATUS AND METHOD FOR IMPLEMENTING REFRESHLESS SINGLE TRANSISTOR CELL eDRAM FOR HIGH PERFORMANCE MEMORY APPLICATIONS
    28.
    发明申请
    APPARATUS AND METHOD FOR IMPLEMENTING REFRESHLESS SINGLE TRANSISTOR CELL eDRAM FOR HIGH PERFORMANCE MEMORY APPLICATIONS 审中-公开
    用于实现高性能存储器应用的无刷单晶振子电池的装置和方法

    公开(公告)号:US20090144507A1

    公开(公告)日:2009-06-04

    申请号:US11950015

    申请日:2007-12-04

    IPC分类号: G06F12/08

    摘要: An apparatus for implementing a refreshless, embedded dynamic random access memory (eDRAM) cache device includes a cache structure having a cache tag array associated with a DRAM data cache with a plurality of cache lines, the cache tag array having an address tag, a valid bit and an access bit corresponding to each of the plurality of cache lines; and each access bit configured to indicate whether the corresponding cache line has been accessed as a result of a read or a write operation during a defined assessment period, the defined assessment period being smaller than retention time of data in the DRAM data cache. For any of the cache lines that have not been accessed during the defined assessment period, the individual valid bit associated therewith is set to a logic state that indicates the data in the associated cache line is invalid.

    摘要翻译: 一种用于实现无刷嵌入式动态随机存取存储器(eDRAM)高速缓存设备的装置包括具有与具有多个高速缓存线的DRAM数据高速缓存相关联的高速缓存标签阵列的高速缓存结构,高速缓存标签阵列具有地址标签,有效的 位和对应于所述多个高速缓存行中的每一条的存取位; 并且每个访问位被配置为指示在定义的评估周期期间作为读取或写入操作的结果是否已经访问了相应的高速缓存行,所述定义的评估周期小于DRAM数据高速缓存中的数据的保留时间。 对于在定义的评估周期期间未被访问的任何高速缓存行,将与其相关联的单个有效位设置为指示相关联的高速缓存行中的数据无效的逻辑状态。

    STRUCTURE FOR IMPLEMENTING REFRESHLESS SINGLE TRANSISTOR CELL eDRAM FOR HIGH PERFORMANCE MEMORY APPLICATIONS
    29.
    发明申请
    STRUCTURE FOR IMPLEMENTING REFRESHLESS SINGLE TRANSISTOR CELL eDRAM FOR HIGH PERFORMANCE MEMORY APPLICATIONS 审中-公开
    用于实现高性能存储器应用的无刷单晶片单元的结构

    公开(公告)号:US20090144504A1

    公开(公告)日:2009-06-04

    申请号:US12116234

    申请日:2008-05-07

    IPC分类号: G06F12/00

    CPC分类号: G06F12/0893

    摘要: A design structure embodied in a machine readable medium used in a design process includes a cache structure having a cache tag array associated with a eDRAM data cache comprising a plurality of cache lines, the cache tag array having an address tag, a valid bit and an access bit corresponding to each of the plurality of cache lines; and each access bit configured to indicate whether the corresponding cache line has been accessed as a result of a read or a write operation during a defined assessment period, which is smaller than retention time of data in the DRAM data cache; wherein, for any of the cache lines not accessed as a result of a read or a write operation during the defined assessment period, the individual valid bit associated therewith is set to a logic state that indicates the data in the associated cache line is invalid.

    摘要翻译: 体现在设计过程中使用的机器可读介质中的设计结构包括具有与包括多个高速缓存线的eDRAM数据高速缓存相关联的高速缓存标签阵列的高速缓存结构,高速缓存标签阵列具有地址标签,有效位和 对应于所述多个高速缓存行中的每一个的存取位; 并且每个访问位被配置为指示在定义的评估周期期间作为读取或写入操作的结果是否已经访问了相应的高速缓存行,其小于DRAM数据高速缓存中的数据的保留时间; 其中,对于在定义的评估周期期间作为读取或写入操作的结果未被访问的任何高速缓存行,将与其相关联的各个有效位设置为指示相关联的高速缓存行中的数据无效的逻辑状态。