摘要:
Disclosed is a DRAM circuit that incorporates an improved reference cell, has half the capacitance of the memory cell, does not require a particular reference voltage, and can be formed using the same fabrication processes as the memory cell. This DRAM circuit comprises a memory cell with a single trench capacitor and a reference cell having two trench capacitors. The two reference cell trench capacitors are connected in series through a merged buried capacitor plate such that they provide half the capacitance of the memory cell trench capacitor. Additionally, the reference cell trench capacitors have essentially the same structure as the memory cell trench capacitor so that they can be formed in conjunction with the memory cell trench capacitor. Also disclosed are a design structure for the above-described memory circuit and a method for forming the above-described memory circuit.
摘要:
An embedded DRAM (eDRAM) having multi-use refresh cycles is described. In one embodiment, there is a multi-level cache memory system that comprises a pending write queue configured to receive pending prefetch operations from at least one of the levels of cache. A prefetch queue is configured to receive prefetch operations for at least one of the levels of cache. A refresh controller is configured to determine addresses within each level of cache that are due for a refresh. The refresh controller is configured to assert a refresh write-in signal to write data supplied from the pending write queue specified for an address due for a refresh rather than refresh existing data. The refresh controller asserts the refresh write-in signal in response to a determination that there is pending data to supply to the address specified to have the refresh. The refresh controller is further configured to assert a refresh read-out signal to send refreshed data to the prefetch queue of a higher level of cache as a prefetch operation in response to a determination that the refreshed data is useful.
摘要:
Semiconductor-on-oxide structures and related methods of forming such structures are disclosed. In one case, a method includes: forming a first dielectric layer over a substrate; forming a first conductive layer over the first dielectric layer, the first conductive layer including one of a metal or a silicide; forming a second dielectric layer over the first conductive layer; bonding a donor wafer to the second dielectric layer, the donor wafer including a donor dielectric and a semiconductor layer; cleaving the donor wafer to remove a portion of the donor semiconductor layer; forming at least one semiconductor isolation region from an unremoved portion of the donor semiconductor layer; and forming a contact to the first conductive layer through donor dielectric and the second dielectric layer.
摘要:
A semiconductor includes a bulk substrate of a first polarity type, a buried insulator layer disposed on the bulk substrate, an active semiconductor layer disposed on top of the buried insulator layer including a shallow trench isolation region and a diffusion region of the first polarity type, a band region of a second polarity type disposed directly beneath the buried insulator layer and forming a conductive path, a well region of the second polarity type disposed in the bulk substrate and in contact with the band region, a deep trench filled with a conductive material of the first polarity type disposed within the well region, and an electrostatic discharge (ESD) protect diode defined by a junction between a lower portion of the deep trench and the well region.
摘要:
Embodiments of the invention provide an integrated circuit for an embedded dynamic random access memory (eDRAM), a semiconductor-on-insulator (SOI) wafer in which such an integrated circuit may be formed, and a method of forming an eDRAM in such an SOI wafer. One embodiment of the invention provides an integrated circuit for an embedded dynamic random access memory (eDRAM) comprising: a semiconductor-on-insulator (SOI) wafer including: an n-type substrate; an insulator layer atop the n-type substrate; and an active semiconductor layer atop the insulator layer; a plurality of deep trenches, each extending from a surface of the active semiconductor layer into the n-type substrate; a dielectric liner along a surface of each of the plurality of deep trenches; and an n-type conductor within each of the plurality of deep trenches, the dielectric liner separating the n-type conductor from the n-type substrate; wherein the n-type substrate, the dielectric liner, and the n-type conductor form a buried plate, a node dielectric, and a node plate, respectively, of a cell capacitor.
摘要:
An approach that provides reference level generation with offset compensation for a sense amplifier is described. In one embodiment, an arbitrary reference level is generated to provide an offset that compensates for device mismatch and voltage threshold of a sense amplifier.
摘要:
Disclosed is design structure including an integrated circuit having a system for moving a failing address into a new FAR by utilizing the functional compare circuitry during BIST of redundant memory elements. Disclosed is an any-for-any scheme that eliminates the tri-state address bus. The design structure allows for easy, discrete scaling with the addition of more FARs, while also allowing larger addresses with no additional control circuit overhead.
摘要:
An apparatus for implementing a refreshless, embedded dynamic random access memory (eDRAM) cache device includes a cache structure having a cache tag array associated with a DRAM data cache with a plurality of cache lines, the cache tag array having an address tag, a valid bit and an access bit corresponding to each of the plurality of cache lines; and each access bit configured to indicate whether the corresponding cache line has been accessed as a result of a read or a write operation during a defined assessment period, the defined assessment period being smaller than retention time of data in the DRAM data cache. For any of the cache lines that have not been accessed during the defined assessment period, the individual valid bit associated therewith is set to a logic state that indicates the data in the associated cache line is invalid.
摘要:
A design structure embodied in a machine readable medium used in a design process includes a cache structure having a cache tag array associated with a eDRAM data cache comprising a plurality of cache lines, the cache tag array having an address tag, a valid bit and an access bit corresponding to each of the plurality of cache lines; and each access bit configured to indicate whether the corresponding cache line has been accessed as a result of a read or a write operation during a defined assessment period, which is smaller than retention time of data in the DRAM data cache; wherein, for any of the cache lines not accessed as a result of a read or a write operation during the defined assessment period, the individual valid bit associated therewith is set to a logic state that indicates the data in the associated cache line is invalid.