公开(公告)号：US20100112341A1

公开(公告)日：2010-05-06

申请号：US12531815

申请日：2008-03-26

申请人： Hideki Takagi ,  Masaharu Takahashi ,  Ryutaro Maeda ,  Shinichi Miyazawa

发明人： Hideki Takagi ,  Masaharu Takahashi ,  Ryutaro Maeda ,  Shinichi Miyazawa

IPC分类号： B32B5/00 ,  C03B11/00 ,  B32B17/06

CPC分类号： C03B11/082 ,  C03B2215/07 ,  C03B2215/10 ,  C03B2215/17 ,  C03C23/008 ,  Y02P40/57 ,  Y10T428/265

摘要： In order to solve problems involved in micromolding of a glass, according to the present invention, there can be provided a technology for enabling molding of a glass without applying a large load.A molding apparatus of a glass material according to the present invention is characterized by containing means for holding a glass material and a molding die in contact with each other, means for heating the glass material and the molding die, and means for applying a voltage across the glass material and the molding die, in which press-molding is performed by electrostatic attraction acting between a surface of the glass material and a surface of the molding die. Further, a molded product of a glass material according to the present invention is characterized by including an alkali metal as a component, in which a concentration of the alkali metal is lowered in vicinity of a surface to be molded as compared with that of a glass base material.

摘要翻译： 为了解决玻璃微成型所涉及的问题，根据本发明，可以提供一种能够在不施加大负荷的情况下成型玻璃的技术。 根据本发明的玻璃材料的成型装置的特征在于包含用于保持彼此接触的玻璃材料和模制模具的装置，用于加热玻璃材料和模制模具的装置，以及用于施加电压的装置 玻璃材料和成型模具，其中通过在玻璃材料的表面和成型模具的表面之间进行静电吸引来进行加压成型。 此外，根据本发明的玻璃材料的成型体的特征在于，与玻璃相比，含有碱金属作为成分的成分，其中碱金属的浓度在待模制的表面附近降低 基材。

公开(公告)号：US06509633B1

公开(公告)日：2003-01-21

申请号：US09545409

申请日：2000-04-07

申请人： Hideki Takagi

发明人： Hideki Takagi

IPC分类号： H01L2302

CPC分类号： H01L23/057 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An IC (Integrated Circuit) package includes a package body having a cavity formed for receiving an IC chip therein. A terrace protrudes from at least part of the edges defining the cavity into the cavity. Discrete devices can be mounted on the terrace, i.e., inside the IC package. With this configuration, the IC package insures the stable operation of a high-frequency IC circuit.

摘要翻译： IC（集成电路）封装包括具有形成为用于在其中接收IC芯片的空腔的封装体。 露台从限定空腔的至少一部分边缘凸出到空腔中。 分立器件可以安装在露台上，即IC封装内部。 利用这种配置，IC封装确保高频IC电路的稳定操作。

公开(公告)号：US06280802B1

公开(公告)日：2001-08-28

申请号：US09360450

申请日：1999-07-26

申请人： Jun Akedo ,  Hideki Takagi

发明人： Jun Akedo ,  Hideki Takagi

IPC分类号： B05D102

CPC分类号： C23C4/12 ,  C23C4/02 ,  C23C4/134 ,  C23C24/04

摘要： A method of forming a film of ultrafine particles includes the steps of accelerating ultrafine particles within a vacuum chamber to cause them to collide with a substrate and be deposited, and, at least before said ultrafine particles collide with said substrate, irradiating the ultrafine particles and the substrate with an ionic, atomic or molecular beam or low-temperature plasma or other high-speed, high-energy beam of high-energy atoms or molecules, whereby the surfaces of the ultrafine particles and substrate are activated without being fused, thus promoting bonding between said ultrafine particles and substrate or between the ultrafine particles to form a dense deposit that has good film properties and good adhesion to the substrate while maintaining the crystal properties of the ultrafine particles.

摘要翻译： 形成超微粒子膜的方法包括以下步骤：在真空室内加速超细颗粒，使其与基材碰撞并沉积，并且至少在所述超细颗粒与所述基材碰撞之前，照射超细颗粒和 具有离子，原子或分子束或低温等离子体或其他高能量高能量高能原子或分子束的衬底，由此超微粒子和衬底的表面被激活而不被熔化，从而促进 在所述超微粒子与基底之间或超微粒子之间键合，形成致密的沉积物，其具有良好的膜性能和对基底的良好粘附性，同时保持超微粒子的晶体性质。

公开(公告)号：US20140167066A1

公开(公告)日：2014-06-19

申请号：US14232517

申请日：2012-05-25

申请人： Yukio Kashima ,  Eriko Matsuura ,  Hiromi Nishihara ,  Takaharu Tashiro ,  Takafumi Ookawa ,  Hideki Hirayama ,  Sachie Fujikawa ,  Sung Won Youn ,  Hideki Takagi ,  Ryuichiro Kamimura ,  Yamato Osada

发明人： Yukio Kashima ,  Eriko Matsuura ,  Hiromi Nishihara ,  Takaharu Tashiro ,  Takafumi Ookawa ,  Hideki Hirayama ,  Sachie Fujikawa ,  Sung Won Youn ,  Hideki Takagi ,  Ryuichiro Kamimura ,  Yamato Osada

IPC分类号： H01L33/32 ,  H01L21/66

CPC分类号： H01L33/32 ,  H01L22/12 ,  H01L33/20 ,  H01L33/44 ,  H01L2933/0083

摘要： A semiconductor light emitting element including, in a light extraction layer thereof, a photonic crystal periodic structure including two systems (structures) with different refractive indices. An interface between the two systems (structures) satisfies Bragg scattering conditions, and the photonic crystal periodic structure has a photonic band gap.

摘要翻译： 一种半导体发光元件，在其光提取层中包括具有不同折射率的两个系统（结构）的光子晶体周期性结构。 两个系统（结构）之间的界面满足布拉格散射条件，光子晶体周期结构具有光子带隙。

公开(公告)号：US20100213811A1

公开(公告)日：2010-08-26

申请号：US12708868

申请日：2010-02-19

申请人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

发明人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

IPC分类号： H01J1/88 ,  C03B29/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： The package for a light emitting element according to the present invention comprises a base substrate made of ceramic including glass, and a frame body made of ceramic. The frame body is arranged on a top surface of the base substrate and provided therein with a cavity for accommodating the light emitting element. A part of the glass included in the base substrate is precipitated in an area of the top surface of the base substrate, which is a bottom surface of the cavity, and a crystallinity degree of the precipitated glass is greater than 3%. In the manufacturing method of the package according to the present invention, a ceramic body which is to be the package is fired at a temperature of 840 degrees C. or higher and lower than 950 degrees C.

摘要翻译： 根据本发明的用于发光元件的封装包括由包括玻璃的陶瓷制成的基底基板和由陶瓷制成的框体。 框架主体布置在基底基板的顶表面上并且在其中设置有用于容纳发光元件的空腔。 包括在基底中的玻璃的一部分在作为空腔底面的基底基板的上表面的区域中析出，析出玻璃的结晶度大于3％。 在根据本发明的包装的制造方法中，作为包装的陶瓷体在840℃以上且低于950℃的温度下烧成。

公开(公告)号：US20100182791A1

公开(公告)日：2010-07-22

申请号：US12688227

申请日：2010-01-15

申请人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

发明人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

IPC分类号： F21V7/00 ,  F21V19/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/48227

摘要： In a package for a light emitting element according to the present invention, a light reflecting plate is buried in a base substrate at a position below a cavity with a light reflecting surface thereof facing upward, a part of the ceramic forming the base substrate is interposed between the light reflecting surface of the light reflecting plate and a top surface of the base substrate, and at least the part is light-transmitting. A light emitting device comprises the package, and the light emitting element accommodated in the cavity of the package. In another light emitting device, a first reflector which is made of a metal material and reflects a light emitted from the light emitting element is buried in a frame body.

摘要翻译： 在根据本发明的发光元件的封装中，将光反射板埋在基板的位于空腔下方的位置，其光反射面朝上，形成基板的陶瓷的一部分插入 在所述光反射板的光反射表面和所述基底基板的顶表面之间，并且至少所述部分是透光的。 发光器件包括封装，并且发光元件容纳在封装的空腔中。 在另一发光器件中，由金属材料制成并将从发光元件发出的光反射的第一反射器被埋入框架体中。

公开(公告)号：US20070196659A1

公开(公告)日：2007-08-23

申请号：US11218285

申请日：2005-08-31

申请人： Norihiko Setoyama ,  Tsutomu Kajino ,  Hideki Takagi ,  Takahiko Asaoka ,  Yoshiaki Fukushima

发明人： Norihiko Setoyama ,  Tsutomu Kajino ,  Hideki Takagi ,  Takahiko Asaoka ,  Yoshiaki Fukushima

IPC分类号： B32B9/00 ,  C01B31/08

CPC分类号： H01M4/926 ,  C01B32/00 ,  H01M4/90 ,  H01M4/9083 ,  Y10T428/30

摘要： A carbon gel composite material including: a carbon gel which is composed of primary particles with an average particle diameter of 2 to 50 nm, where no x-ray diffraction peaks are observed over a scan angle (2θ) range of 0.5 to 10° (CuK60 radiation) and where in a pore size distribution calculated from an adsorption/desorption isotherm, if a pore diameter corresponding to the peak of the pore size distribution is not smaller than 1 nm and is smaller than 10 nm (pore diameter (d)), pores accounting for 60% or more of the total pore volume have a pore diameter within plus or minus 2 nm of the pore diameter (d), and if a pore diameter corresponding to the peak of the pore size distribution is in a range of 10 to 50 nm (pore diameter (D)), pores accounting for 60% or more of the total pore volume have a pore diameter in a range of (0.75×D) to (1.25×D); and at least one adsorbed component selected from the group consisting of proteins, metal complexes and metals, which is adsorbed on the carbon gel.

摘要翻译： 一种碳凝胶复合材料，包括：由平均粒径为2〜50nm的一次粒子构成的碳凝胶，在0.5〜10°的扫描角（2θ）范围内不观察到x射线衍射峰 （CuK <60>辐射），并且在由吸附/解吸等温线计算的孔径分布中，如果对应于孔径分布的峰值的孔径不小于1nm并且小于 10nm（孔径（d）），占孔体积的60％以上的孔的孔径（d）的孔径在±2nm以内，如果孔径对应于 孔径分布在10〜50nm的范围（孔径（D）），占孔体积的60％以上的孔的孔径在（0.75×D）〜（1.25×D）的范围内， ; 以及吸附在碳凝胶上的至少一种选自蛋白质，金属络合物和金属的吸附组分。