摘要:
A semiconductor memory device of the present invention comprises a plurality of word lines formed on a substrate, a plurality of bit lines perpendicular to the word lines and divided into bit-line groups in the column direction along the word line, each group containing three bit lines, and arrays of memory cells arranged at the intersections of word lines and bit lines, wherein two memory cells are placed at two of every three adjacent intersections arranged in each of the row and column directions, and where these memory cell arrays are divided into subarrays in the row direction, each of the cell arrays is divided into cell blocks in the row direction, two of the three bit lines in each bit-line group along the bit line are crossed each other between adjacent cell blocks, and a plurality of sense amplifiers are placed between adjacent cell arrays so as to correspond to cell blocks.
摘要:
A dynamic random access memory device includes a semiconductor substrate, a plurality of parallel word lines on the substrate, and a plurality of pairs of bit lines transverse to the word lines on the substrate. An array of one-transistor memory cells are selectively arranged at the cross points as defined between the word lines and the bit lines. The array is subdivided into a plurality of subarray sections. A sense amplifier section is connected to the bit lines. The sense amplifier section includes first and second sense amplifier circuits. Adjacent bit-line pairs of the bit lines include a first bit-line pair and a second bit-line pair, one of which has a folded bit-line arrangement being included in a certain subarray section to be connected to the first sense amplifier circuit, and the other of which has an open bit-line arrangement that extends into the subarray section and another subarray section adjacent thereto, and is connected to the second sense amplifier circuit.
摘要:
A dynamic random access memory including a sense amplifier having MOSFETs, which constitute a flip-flop, and an activating MOSFET. A memory cell includes a switching MOSFET and a capacitor having a grooved structure. A dummy cell includes a switching MOSFET and capacitor having a planar structure. The activating MOSFET has its gate coupled to a gate bias generator, which comprises a reference capacitor group consisting of planar type capacitors having a nearly constant capacitance, irrespective of the influence of process parameters, and a monitoring capacitor group consisting of capacitors having the same grooved structure and the same capacitance as the memory cell capacitor. The reference capacitor group, and the monitoring capacitor group are pre-charged. When the sensing operation starts, the reference capacitor group and the monitoring capacitor group are short-circuited, so that a charge reallocation is executed between these groups. When a word line driver functions, the gate of the switching MOSFET of the memory cell is open, thus transferring data of the memory cell capacitor and dummy cell capacitor onto bit line BL and BL. The voltage of the node between the reference and monitoring capacitor groups, which are short-circuited, is applied to the gate of the activating MOSFET of the sense amplifier after a predetermined time delay.
摘要:
There is disclosed a divided-bit line type dynamic random access memory having parallel main bit line pairs which are formed on a substrate and to each of which sub-bit line pairs are provided in parallel with each other. Parallel word lines insulatively cross the sub-bit line pairs. Memory cells are provided at the crossing points of the sub-bit line pairs and the word lines. Each memory cell has a capacitor for storing information and a voltage-controlled switching transistor such as a MOSFET. First sense amplifier circuits are connected to the sub-bit line pairs, while second sense amplifier circuits are connected to the main bit line pairs. In a restoring mode, a specific sub-bit line pair, to which a selected memory cell is connected, is electrically disconnected from the corresponding main bit one pair, and a first sense amplifier circuit connected thereto is activated to perform a restoring operation. At this time, the remaining sub-bit line pairs other than the specific sub-bit line pair are also connected to the corresponding main bit line pair, and the first sense amplifier circuits of the remaining sub-bit line pairs are rendered inoperative to save power consumption.
摘要:
A semiconductor nonvolatile read only memory device has a voltage applying circuit which sets all word lines at ground potential in a stand-by mode and sets only a selected word line at a high level in an active mode. The word lines are connected to the gates of semiconductor nonvolatile memory transistors. Each of the memory transistors has the source (or drain) grounded and the drain (or source) connected to output lines. In a stand-by mode, the voltage applying circuit keeps all the word lines at ground potential. In an active mode, the voltage applying circuit applies a high level voltage only to the selected word line. The memory transistor connected to the selected word line produces data of "0" or "1" to the output line.
摘要:
In a cruise control system installed in a vehicle and electrically connected to a plurality of switches installed therein, a detecting unit detects that one of the plurality of switches is operated. A cruise control unit executes cruise control of the vehicle based on an instruction corresponding to the one of the plurality of switches upon detection of the one of the plurality of switches being operated. When the detecting unit detects that, during the first switch being operated, the second switch is operated, and when a combination of first and second instructions sent from the detected first and second switches is matched with at least one predetermined combination of instructions to be sent from the plurality of switches, a cruise control disabling unit disables the cruise control unit to execute cruise control of the vehicle based on the second instruction.
摘要:
A semiconductor memory device includes active regions arranged on a semiconductor substrate such that those of the active regions which are adjacent in the word line direction deviate in the bit line direction, MOS transistors respectively formed in the active regions and each having a source and a drain one of which is connected to the bit line, a plurality of trenches each arranged to another set of source an drain regions and arranged to deviate in the word line direction in the respective active regions, those of the trenches which are adjacent with a through word line disposed therebetween being arranged to deviate in the bit line direction so as to be set closer to each other, a plurality of storage electrodes respectively formed in the trenches with capacitor insulative films disposed therebetween, and connection electrodes arranged between the word lines and each connecting the other of the source and drain to the storage electrode.
摘要:
An erasable programmable read-only memory with NAND cell structure includes NAND cell blocks, each of which has a selection transistor connected to the corresponding bit line and a series array of memory cell transistors, and a switching transistor connected between the series array of memory cell transistors and ground. Each cell transistor has a floating gate and a control gate. Word lines are connected to the control gates of the cell transistors. In a data writing mode, a selection transistor of a certain cell block containing a selected cell is rendered conductive, so that this cell block is connected to the corresponding bit line. Under such a condition, a decoder circuit stores a desired data (a logic "one" e.g.) in the selected cell, by applying an "H" level voltage to the bit line, applying an "L" level voltage to a word line connected to the selected cell, applying the "H" level voltage to a memory cell or cells positioned between the selected cell and the bit line, and applying the "L" level voltage to a memory cell or cells positioned between the selected cell and the ground. The selection transistor and switching transistor for a corresponding series array of memory cell transistors have different channel lengths to reduce punch through.
摘要:
A process for forming an array of FATMOS transistors serving as memory cells of a NAND cell type EEPROM. A multi-layered structure is provided on a substrate with two stacked conductive layers insulated by an intermediate insulative layer, the first or inner conductive layer being insulated by a first insulative layer from the substrate, the second or outer conductive layer being covered with a second insulative layer. The second insulative layer is etched to define a first array of etched layer portions. A photoresist layer is deposited and etched to define a second array of layer portions, each of which is positioned between two neighboring ones of the first array of layer portions. The multi-layered structure is etched with the first and second layer portions being as a mask, to thereby form an array of a plurality of pairs of insulated gate electrodes above the substrate. A chosen impurity is doped into the substrate with the insulated gate electrodes serving as a mask to thereby form impurity-doped regions in the substrate.
摘要:
An electrically erasable programmable read-only memory with a NAND cell structure has parallel bit lines, and memory cells defining NAND cell blocks, each of which has a series-circuit of memory cell transistors. Each transistor has a floating gate and a control gate. Parallel word lines are connected to the control gates of the cell transistors. The first, second and third intermediate voltages are used in the data write mode: the first voltage is lower than the "H" level voltage and higher than the "L" level voltage; the second and third voltages are higher than the first voltage and lower than the "H" level voltage. Data is written into a selected memory cell transistor of a NAND cell block, by applying the "H" level voltage to a word line connected to the selected transistor, applying the second voltage to the remaining unselected word lines, applying a corresponding bit line associated with the selected transistor with one of the first and third voltages which is selected in accordance with a logic level of the data, and applying unselected bit lines with the third voltage, whereby carriers are moved by tunneling from or to the floating gate of the selected memory cell transistor.