Pattern forming method, chemical amplification resist composition and resist film
    22.
    发明授权
    Pattern forming method, chemical amplification resist composition and resist film 有权
    图案形成方法,化学放大抗蚀剂组合物和抗蚀剂膜

    公开(公告)号:US08722319B2

    公开(公告)日:2014-05-13

    申请号:US13245326

    申请日:2011-09-26

    IPC分类号: G03F7/26

    摘要: A pattern forming method includes: (i) forming a film from a chemical amplification resist composition that contains (A) a resin, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation and (C) a tertiary alcohol; (ii) exposing the film; and (iii) performing development by using a developer containing an organic solvent.

    摘要翻译: 图案形成方法包括:(i)从化学放大抗蚀剂组合物形成膜,其包含(A)树脂,(B)在通过光化射线或辐射照射时能够产生酸的化合物和(C) 醇; (ii)曝光胶片; 和(iii)通过使用含有有机溶剂的显影剂进行显影。

    Resist composition and method of forming pattern therewith
    27.
    发明授权
    Resist composition and method of forming pattern therewith 有权
    抗蚀剂组合物和形成图案的方法

    公开(公告)号:US09017917B2

    公开(公告)日:2015-04-28

    申请号:US12535240

    申请日:2009-08-04

    摘要: A resist composition comprises two or more polymers containing a first polymer and a second polymer and a compound that when exposed to actinic rays or radiation, generates an acid, wherein when the resist composition is formed into a dry resist film, the mixing ratios of at least the first and second polymers in the resist film exhibit a gradient distribution such that the mixing ratios continuously change in entirety or partially in the direction of the depth from the surface of the resist film on the air side toward a support, and wherein the mixing ratio of the first polymer at a superior portion of the resist film is higher than that of the second polymer, while the mixing ratio of the second polymer at an inferior portion of the resist film is higher than that of the first polymer.

    摘要翻译: 抗蚀剂组合物包括含有第一聚合物和第二聚合物的两种或更多种聚合物和当暴露于光化射线或辐射时产生酸的化合物,其中当抗蚀剂组合物形成干燥抗蚀剂膜时, 抗蚀剂膜中的第一和第二聚合物的至少表现出梯度分布,使得混合比在空气侧的抗蚀剂膜的表面朝向载体的深度方向全部或部分地连续变化,并且其中混合 抗蚀剂膜的上部的第一聚合物的比例高于第二聚合物,而抗蚀剂膜的下部的第二聚合物的混合比高于第一聚合物的比例。