摘要:
A dielectric block having an external conductor on the outer surface and a plurality of holes with internal conductors formed therein; no internal conductors are provided near one end of each of the plurality of holes. Portions of the dielectric block and the external conductor are removed so as to obtain a dielectric resonator having desired resonator characteristics. In another embodiment, portions of the dielectric block are removed so as to bring the external conductor closer to the internal conductors thereby obtaining a dielectric resonator resonant with a desired frequency. The dielectric resonators limit leakage of electromagnetic field and do not require additional parts such as terminals and case.
摘要:
A back-surface-incidence semiconductor light element includes: a semiconductor substrate of a first conductivity type; a first semiconductor layer of a first conductivity type on the semiconductor substrate; a light absorbing layer on the first semiconductor layer; a second semiconductor layer on the light absorbing layer; and an impurity diffusion region of a second conductivity type in a portion of the second semiconductor layer. A region including a p-n junction between the first semiconductor layer and the impurity diffusion region, and extending through the light absorbing layer, is a light detecting portion that detects light incident on a back surface of the semiconductor substrate. A groove in the back surface of the semiconductor substrate surrounds the light detecting portion, as viewed in plan.
摘要:
A band-elimination filter (BEF) that includes a coaxial dielectric resonator block, a substrate, and first, second, and third inductance elements. The coaxial dielectric resonator block includes inner conductors and an outer conductor, and forms coaxial dielectric resonators. The first inductance element is between a signal transmission path connected to one of the coaxial dielectric resonators via a series resonant capacitor and a signal transmission path connected to the other one of the coaxial dielectric resonators via a series resonant capacitor. The second inductance element is between one end of the first inductance element and the ground, and the third inductance elements is between the other end of the first inductance element and the ground.
摘要:
A semiconductor device has a two-dimensional slab photonic crystal structure in which a substrate supports a sheet-like slab layer including, sequentially stacked, a lower cladding layer, an active layer, and an upper cladding layer. A periodic refractive index profile structure, in surfaces of the stacked layers, introduces a linear defect region that serves as a waveguide. A p-type region and an n-type region in the slab layer define a pn junction surface at a predetermined angle with respect to the surfaces of the stacked layers in the slab layer.
摘要:
A waveguide semiconductor optical device has a pin junction on a semi-insulating substrate. The pin junction consists of an n-type cladding layer, an i-type absorption layer, and a p-type cladding layer. The waveguide semiconductor optical device includes a dopant impurity concentration not higher than 1016 cm-3 in the i-type absorption layer.
摘要翻译:波导半导体光学器件在半绝缘衬底上具有pin结。 pin结由n型包覆层,i型吸收层和p型覆层组成。 该波导半导体光学器件包括在i型吸收层中不高于10 16 cm -3的掺杂剂杂质浓度。
摘要:
A band discontinuity reduction layer having a band gap energy larger than that of that of an MQW (multiple quantum well) absorption layer and smaller than that of a p-InP clad layer is provided between the MQW absorption layer and the p-InP clad layer. In addition, a band discontinuity reduction layer having a band gap energy larger than that of the MQW absorption layer and smaller than that of an n-InP clad layer is provided between the MQW absorption layer and the n-InP clad layer. Consequently, as a pile-up of carriers is suppressed, a semiconductor light modulator with an enhanced response speed can be obtained.
摘要:
A light modulator includes a semiconductor substrate having a main surface, a rear surface, and a grounding conductor on the rear surface. A wave guide section having a width is located on the semiconductor substrate. A bonding pad section on the semiconductor substrate is located adjacent to the wave guide section and an insulating layer covers the main surface of the semiconductor substrate. A portion of the insulating layer immediately opposite the bonding pad section includes a multiple layer structure of insulating films. An electrode opposite the bonding pad section is electrically connected to the wave guide section.
摘要:
A method of adjusting characteristics of a dielectric filter having integral electromagnetic shielding, the dielectric filter comprises a dielectric body having an outer surface including first and second end surfaces and side surfaces extending between the first and second end surfaces; an external conductor disposed on the outer surface of the dielectric body and providing integral electromagnetic shielding of the dielectric filter; at least one hole extending through the dielectric body between the first and second end surfaces; a respective pair of internal conductors provided in the at least one hole and conductively connected to the external conductor at respective ends of the hole, a respective non-conductive portion in the hole being spaced from both ends and thereby separating the pair of internal conductors and defining a respective capacitance between the pair of internal conductors; and signal input and output electrodes provided on the outer surface of the dielectric body and electrically isolated from the external conductor. According to the method, a portion of the dielectric material is removed, for example by grinding, to form the respective non-conductive portion in the hole. The hole may have a changing diameter along its length, due to a hollow formed in one end surface, the non-conductive portion being adjacent to the hollow; or due to a narrowed throttle portion formed at or near the end surface, the non-conductive portion being formed on the throttle portion. Alternatively, the hole may have a substantially constant cross-section, and the non-conductive portion may be substantially flush with the inner surface of the hole. The dielectric body may be regular in shape or may have a side surface with portions spaced from the resonator hole by different respective distances.
摘要:
A dielectric filter comprising: a dielectric block including a first elongated sub-block and a second elongated sub-block each having a corresponding pair of longitudinally opposing end faces, and an outer surface, said sub-blocks being disposed adjacent one another; a first longitudinally extending through-hole disposed between the first pair of longitudinally opposing end faces of said first sub-block, the first through-hole having two outer ends and an inner surface; a first inner conductor formed on the inner surface of said first through-hole, said first inner conductor having outer ends; an outer conductor formed on the outer surface of said dielectric block but not electrically coupled to the outer ends of the first inner conductor such that the outer ends of the first inner conductor are open-circuited; a first connection conductor through which a predetermined part of the first inner conductor between its outer ends is connected to said outer conductor; a second longitudinally extending through-hole disposed between the second pair of longitudinally opposing end faces of said second sub-block, the second through-hole having two outer ends and an inner surface; a second inner conductor formed on the inner surface of said second through-hole, said second inner conductor being electrically connected to said outer conductor at its outer ends such that they are short-circuited, said inner conductor having a pair of open-circuited inner ends disposed at a predetermined location between its two outer ends, wherein said first and second sub-blocks of said dielectric block are longitudinally shifted relative to one another.
摘要:
A dielectric filter includes: a dielectric block having a pair of opposing end faces; a through-hole formed between the pair of opposing end faces of the dielectric block; an inner conductor formed on the inner surface of the through-hole, the inner conductor being open-circuited at both its ends; an outer conductor formed on the outer surface of the dielectric block; and a connection conductor by which a central part of the inner conductor between its two opposing ends is connected to the outer conductor. Although the dielectric filter is composed of the single dielectric block, it behaves as a band-elimination filter having pass-bands around the elimination-band centered at a trap frequency wherein elimination occurs at both edges of the pass-bands.