摘要:
Methods of improving operational parameters between at least a pair of matched transistors, and a set of transistors, are disclosed. One embodiment of a method includes a method of improving at least one of a threshold voltage (Vt) mismatch and current drive between at least a pair of matched transistors for analog applications, the method comprising: forming at least a pair of transistors, each with a gate having a plurality of connected fingers; and optimizing a total length of a channel under the plurality of fingers to attain at least one of: a) a reduced threshold voltage mismatch between the at least pair of transistors, and b) increased current drive for a given threshold voltage mismatch, between the at least pair of transistors, each finger having a length less than an overall length of the channel.
摘要:
A method for calibrating a software model for a given structure of interest for a variable imposed by an adjacent structure. First determine the spatial extent of the variable imposed by the adjacent structure. Then assign a value to the spatial extent, which varies as a function of distance from the adjacent structure to the given structure. Finally, attach that value to the model of the given structure.
摘要:
A method and system for forming a semiconductor device having superior ESD protection characteristics. A resistive material layer is disposed within a contact hole on at least one of the contact stud upper and lower surface. In preferred embodiments, the integral resistor has a resistance value of between about one Ohm and about ten Ohms, or between 10 and 100 Ohms. Embodiments of the resistive layer include sputtered silicon material, a tunnel oxide, a tunnel nitride, a silicon-implanted oxide, a silicon-implanted nitride, or an amorphous polysilicon. Embodiments of the invention include SRAMs, bipolar transistors, SOI lateral diodes, MOSFETs and SiGe Transistors.
摘要:
Disclosed is a method and structure for altering an integrated circuit design having silicon over insulator (SOI) transistors. The method/structure prevents damage from charging during processing to the gate of SOI transistors by tracing electrical nets in the integrated circuit design, identifying SOI transistors that may have a voltage differential between the source/drain and gate as potentially damaged SOI transistors (based on the tracing of the electrical nets), and connecting a shunt device across the source/drain and the gate of each of the potentially damaged SOI transistors. Alternatively, the method/structure provides for connecting compensating conductors through a series device.
摘要:
A method of ion implantation is provided. The method comprising: providing a substrate; forming a masking image having a sidewall on the substrate; forming a blocking layer on the substrate and on the masking image; and performing a retrograde ion implant through the blocking layer into the substrate, wherein the blocking layer substantially blocks ions scattered at the sidewall of the masking layer.
摘要:
A method of ion implantation is provided. The method comprising: providing a substrate; forming a masking image having a sidewall on the substrate; forming a blocking layer on the substrate and on the masking image; and performing a retrograde ion implant through the blocking layer into the substrate, wherein the blocking layer substantially blocks ions scattered at the sidewall of the masking layer.
摘要:
The present invention is a active pixel sensor cell and method of making and using the same. The active pixel sensor cell approximately doubles the available signal for a given quanta of light. The device of the present invention utilizes the holes produced by impinging photons in a active pixel sensor cell circuit. Two active pixel sensor cell circuits, an NFET circuit and PFET circuit are created for use with a photodiode. The NFET circuit captures electron current. The PFET circuit captures hole current. The sum of the currents is approximately double that of conventional active pixel sensor circuits using similarly sized photodiode regions.
摘要:
A field effect transistor device includes a bulk semiconductor substrate, a fin arranged on the bulk semiconductor substrate, the fin including a source region, a drain region, and a channel region, a first shallow trench isolation (STI) region arranged on a portion of the bulk semiconductor substrate adjacent to the fin, a first recessed region partially defined by the first STI region and the channel region of the fin, and a gate stack arranged over the channel region of the fin, wherein a portion of the gate stack is partially disposed in the first recessed region.
摘要:
A semiconductor device is disclosed. The semiconductor device includes a semiconductor substrate including: a high-K dielectric region; a blocking region disposed against at least one surface of the high-K dielectric region and adapted to form an oxidized layer in response to exposure to oxygen; and an oxygen rich region disposed against the blocking region such that the blocking region is interposed between the oxygen rich region and the high-K dielectric region.
摘要:
An integrated circuit comprising an N+ type layer, a buffer layer arranged on the N+ type layer; a P type region formed on with the buffer layer; an insulator layer overlying the N+ type layer, a silicon layer overlying the insulator layer, an embedded RAM FET formed in the silicon layer and connected with a conductive node of a trench capacitor that extends into the N+ type layer, the N+ type layer forming a plate electrode of the trench capacitor, a first contact through the silicon layer and the insulating layer and electrically connecting to the N+ type layer, a first logic RAM FET formed in the silicon layer above the P type region, the P type region functional as a P-type back gate of the first logic RAM FET, and a second contact through the silicon layer and the insulating layer and electrically connecting to the P type region.