Method for manufacturing semiconductor device and laser irradiation apparatus
    22.
    发明授权
    Method for manufacturing semiconductor device and laser irradiation apparatus 有权
    半导体装置及激光照射装置的制造方法

    公开(公告)号:US08309443B2

    公开(公告)日:2012-11-13

    申请号:US12611990

    申请日:2009-11-04

    IPC分类号: H01L21/268

    摘要: It is an object to achieve continuous crystal growth without optical interference using a compact laser irradiation apparatus. A megahertz laser beam is split and combined to crystallize a semiconductor film. At this point of time, an optical path difference is provided between the split beams to reduce optical interference. The optical path difference is set to have a length equivalent to the pulse width of the megahertz laser beam or more and less than a length equivalent to the pulse repetition interval; thus, optical interference can be suppressed with a very short optical path difference. Therefore, laser beams can be applied continuously and efficiently without energy deterioration.

    摘要翻译: 本发明的目的是使用紧凑型激光照射装置来实现无光学干涉的连续晶体生长。 将一兆赫兹的激光束分离并组合以使半导体膜结晶。 在这个时间点上,在分束之间提供光路差以减少光学干涉。 光程差被设定为具有等于兆赫兹激光束的脉冲宽度的长度,或者多于等于脉冲重复间隔的长度; 因此,能够以非常短的光程差来抑制光学干涉。 因此,可以连续有效地施加激光束而不会使能量劣化。

    Laser beam treatment device and semiconductor device
    23.
    发明授权
    Laser beam treatment device and semiconductor device 有权
    激光束处理装置及半导体装置

    公开(公告)号:US08269136B2

    公开(公告)日:2012-09-18

    申请号:US10840338

    申请日:2004-05-07

    申请人: Koichiro Tanaka

    发明人: Koichiro Tanaka

    IPC分类号: B23K26/00

    摘要: A laser beam treatment device capable of solving problem in a conventional technology that any uniform laser anneal cannot be realized since use of a galvano mirror changes the angle of incidence of the laser beam to the substrate and the reflected light from a back side of a transmissive substrate interferes with the reflected light from a surface of a semiconductor film or an interface between the semiconductor film and the substrate. Laser anneal is performed by using the laser beam treatment device comprising a laser, an optical system for shaping the laser beam oscillated from the laser, and a substrate holds to hold a work formed on the transmissive substrate, in which the substrate holder holds a liquid, and the liquid is brought into contact with the surface.

    摘要翻译: 能够解决传统技术中的问题的激光束处理装置,由于使用电流镜,不能实现任何均匀的激光退火,所以可以将激光束的入射角改变为基板的反射光和来自透射的背面的反射光 衬底干涉来自半导体膜的表面的反射光或半导体膜与衬底之间的界面。 激光退火通过使用包括激光的激光束处理装置,用于使从激光器振荡的激光束成形的光学系统和用于保持形成在透射基板上的工件的基板保持来进行激光退火,其中基板保持器保持液体 使液体与表面接触。

    Reception device and reception method
    24.
    发明授权
    Reception device and reception method 有权
    接收设备和接收方式

    公开(公告)号:US08233865B2

    公开(公告)日:2012-07-31

    申请号:US12376387

    申请日:2008-01-09

    IPC分类号: H04B1/00

    CPC分类号: H04B7/0865 H04B17/345

    摘要: The noise amount information storage unit 161 stores noise amount information which indicates relationships between gain value of the variable gain amplification units 121 and 125 and the amount of noise included in BB signals output from the down converters 131 and 135. The AGC unit 140 controls the gain value of the variable gain amplification units 121 and 125 so that the power of BB signals output from the down converters 131 and 135 becomes constant. The noise amount estimation unit 162 estimates noise amount of noise corresponding to the controlled gain value of the variable gain amplification units 121 and 125 by referring to the noise amount information stored in the noise amount information storage unit 161. The weight generation unit 170 generates weight matrix based on results of estimations performed by the channel characteristic estimation unit 150 and the noise estimation unit 162.

    摘要翻译: 噪声量信息存储单元161存储指示可变增益放大单元121和125的增益值与从下变频器131和135输出的BB信号中包括的噪声量之间的关系的噪声量信息。AGC单元140控制 可变增益放大单元121和125的增益值,使得从下变频器131和135输出的BB信号的功率变得恒定。 噪声量估计单元162通过参考存储在噪声量信息存储单元161中的噪声量信息来估计与可变增益放大单元121和125的受控增益值相对应的噪声噪声量。权重生成单元170产生权重 基于由信道特性估计单元150和噪声估计单元162执行的估计结果的矩阵。

    Method for manufacturing crystalline semiconductor film
    25.
    发明授权
    Method for manufacturing crystalline semiconductor film 有权
    晶体半导体膜的制造方法

    公开(公告)号:US08216892B2

    公开(公告)日:2012-07-10

    申请号:US13092173

    申请日:2011-04-22

    IPC分类号: H01L21/84

    摘要: There is provided a method for manufacturing a crystalline semiconductor film. An insulating film is formed over a substrate; an amorphous semiconductor film is formed over the insulating film; a cap film is formed over the amorphous semiconductor film; the amorphous semiconductor film is scanned and irradiated with a continuous wave laser beam or a laser beam with a repetition rate of greater than or equal to 10 MHz, through the cap film; and the amorphous semiconductor film is melted and crystallized At this time, an energy distribution in a length direction and a width direction in a laser beam spot is a Gaussian distribution, and the amorphous semiconductor film is scanned with the laser beam so as to be irradiated with the laser beam for a period of greater than or equal to 5 microseconds and less than or equal to 100 microseconds per region.

    摘要翻译: 提供一种制造结晶半导体膜的方法。 在基板上形成绝缘膜; 在绝缘膜上形成非晶半导体膜; 在非晶半导体膜上形成盖膜; 通过盖膜扫描并照射具有大于或等于10MHz的重复率的连续波激光束或激光束的非晶半导体膜; 并且非晶半导体膜熔化和结晶此时,激光束点中的长度方向和宽度方向上的能量分布是高斯分布,并且用激光束扫描非晶半导体膜以便被照射 激光束的周期大于或等于5微秒,并且每个区域小于或等于100微秒。

    Manufacturing apparatus for selectively removing one or more material layers by laser ablation
    26.
    发明授权
    Manufacturing apparatus for selectively removing one or more material layers by laser ablation 有权
    用于通过激光烧蚀选择性地去除一个或多个材料层的制造装置

    公开(公告)号:US08202811B2

    公开(公告)日:2012-06-19

    申请号:US12878461

    申请日:2010-09-09

    IPC分类号: H01L21/428 B23K26/06

    摘要: To provide a manufacturing apparatus of a semiconductor device, which does not use a stepper in a manufacturing process in the case where mass production of semiconductor devices is carried out by using a large-sized substrate. A thin film formed over a substrate having an insulating surface is selectively irradiated with a laser beam through light control means, specifically through an electro-optical device to cause ablation; accordingly, the thin film is partially removed, thereby processing the thin film in a remaining region into a desired shape. The electro-optical device functions as a variable mask by inputting an electrical signal based on design CAD data of the semiconductor device.

    摘要翻译: 为了提供在通过使用大尺寸基板进行半导体器件的批量生产的情况下在制造工艺中不使用步进器的半导体器件的制造装置。 通过光控制装置,特别是通过电光装置选择性地用激光束照射形成在具有绝缘表面的基板上的薄膜以引起烧蚀; 因此,薄膜被部分去除,从而将剩余区域中的薄膜处理成期望的形状。 电光装置通过基于半导体器件的设计CAD数据输入电信号而用作可变掩模。

    Method for manufacturing display device including laser irradiation and selective removing of a light absorber layer
    27.
    发明授权
    Method for manufacturing display device including laser irradiation and selective removing of a light absorber layer 有权
    用于制造包括激光照射和选择性去除光吸收层的显示装置的方法

    公开(公告)号:US08183067B2

    公开(公告)日:2012-05-22

    申请号:US11881233

    申请日:2007-07-26

    IPC分类号: H01L21/00 H01L21/44

    摘要: A display device which can be manufactured with improved material use efficiency and through a simplified manufacturing process, and a manufacturing technique thereof. A light-absorbing layer is formed, an insulating layer is formed over the light-absorbing layer, the light-absorbing layer and the insulating layer are selectively irradiated with laser light to remove an irradiated region of the insulating layer so that a first opening is formed in the insulating layer, and the light-absorbing layer is selectively removed by using the insulating layer having the first opening as a mask so that a second opening is formed in the insulating layer and the light-absorbing layer. A conductive film is formed in the second opening to be in contact with the light-absorbing layer, thereby electrically connecting to the light-absorbing layer with the insulating layer interposed therebetween.

    摘要翻译: 可以制造具有改善的材料使用效率并且通过简化制造工艺的显示装置及其制造技术。 形成光吸收层,在光吸收层上形成绝缘层,用激光选择性地照射光吸收层和绝缘层,以除去绝缘层的照射区域,使得第一开口为 并且通过使用具有第一开口的绝缘层作为掩模来选择性地去除光吸收层,使得在绝缘层和光吸收层中形成第二开口。 在第二开口中形成与光吸收层接触的导电膜,从而与隔着绝缘层的光吸收层电连接。

    Method for manufacturing evaporation donor substrate and light-emitting device
    29.
    发明授权
    Method for manufacturing evaporation donor substrate and light-emitting device 有权
    制造蒸发供体基板和发光装置的方法

    公开(公告)号:US08080811B2

    公开(公告)日:2011-12-20

    申请号:US12341424

    申请日:2008-12-22

    IPC分类号: H01J1/62

    摘要: An evaporation donor substrate which enables only a desired evaporation material to be evaporated at the time of deposition by an evaporation method, and capable of reduction in manufacturing cost by increase in use efficiency of the evaporation material and deposition with high uniformity. An evaporation donor substrate capable of controlling laser light so that a desired position of an evaporation donor substrate is irradiated with the laser light in accordance with the wavelength of the emitted laser light at the time of evaporation. Specifically, an evaporation donor substrate in which a region which reflects laser light and a region which absorbs laser light at the time of irradiation with laser light having a wavelength of greater than or equal to 400 nm and less than or equal to 600 nm at the time of evaporation are formed.

    摘要翻译: 一种蒸发供体基板,其通过蒸发法沉积时只能使期望的蒸发材料蒸发,并且能够通过提高蒸发材料的使用效率和高均匀性的沉积而降低制造成本。 一种能够控制激光的蒸发施主基板,使得根据在蒸发时发射的激光的波长,用激光照射蒸发供体基板的期望位置。 具体而言,在该激光的反射时,激光的反射区域和在波长为400nm以上且小于等于600nm的激光照射时的区域的蒸发供体基板 形成蒸发时间。

    Transmitting device, wireless communication system and transmitting method
    30.
    发明授权
    Transmitting device, wireless communication system and transmitting method 有权
    传输设备,无线通信系统和传输方式

    公开(公告)号:US08064370B2

    公开(公告)日:2011-11-22

    申请号:US12281388

    申请日:2007-03-01

    IPC分类号: H04B7/005

    摘要: At a time T131, a wireless communication apparatus 11A determines to transmit a data packet, and then performs interference signal detection for a period TA. At a time T132, which precedes a time T133 at which the period TA has elapsed since the time T131, the wireless communication apparatus 11A detects a data packet d21 (an interference signal). At a time T134, at which a period TB has elapsed since the time T132 at which the interference signal has been detected, the wireless communication apparatus 11A starts transmitting a data packet d11 to a wireless communication apparatus 12A. At a time T136, the wireless communication apparatus 11A completes the transmission of the data packet d11.

    摘要翻译: 在时间T131,无线通信设备11A确定发送数据分组,然后执行周期TA的干扰信号检测。 无线通信装置11A在从时间T131开始经过了周期TA的时间T133之前的时刻T132,检测到数据包d21(干扰信号)。 在从检测到干扰信号的时间T132开始经过了周期TB的时间T134之后,无线通信装置11A开始向无线通信装置12A发送数据包d11。 在时间T136,无线通信装置11A完成数据分组d11的发送。