公开(公告)号：US06633247B2

公开(公告)日：2003-10-14

申请号：US09958567

申请日：2001-11-27

Applicant: Masami Yakabe

Inventor： Masami Yakabe

IPC: H03M162

CPC classification number: H03M1/664 ,  H03M1/367

Abstract: An analog multiplier 11 raises a base reference voltage “Vref0” to the nth power so that a reference voltage “Vref1” is produced. Analog multipliers 12 and 13 sequentially raise the reference voltage “Vref1” to the nth power so that reference voltages “Vref2” and “Vref3” are produced. Switch groups 38-41 control the reference voltages “Vref0” to “Vref3”, which are then sent to an analog multiplier 14 together with an input voltage “Vin”. A comparator 14 sequentially compares a multiplication result “Vx” of the multiplier 14 with a voltage “Vout” outputted from a sensor circuit 2, so that a digital output value “Dout” is produced. The analog multiplier 14 is set as appropriate.

Abstract translation: 模拟乘法器 11 将基准参考电压“Vref 0 ”提升到第n个功率，使得参考电压“Vref 1 “。 模拟乘法器 12 和 13 依次提升参考电压“Vref 1 PDAT>“到第n个功率，从而产生参考电压”Vref 2 “和”Vref 3 “。 开关组 38-41 将参考电压“Vref 0 ”控制为“Vref 3 < / BOLD> “，然后将它们与输入电压”Vin“一起发送到模拟乘法器 14 。 比较器 14 将乘法器 14 的乘法结果“Vx”与从 传感器电路 2， ，从而产生数字输出值“Dout”。 模拟乘法器 14 根据需要设置。

公开(公告)号：US08141426B2

公开(公告)日：2012-03-27

申请号：US12315742

申请日：2008-12-05

Applicant: Naoki Ikeuchi ,  Hisashi Fujiwara ,  Masami Yakabe ,  Masato Hayashi

Inventor： Naoki Ikeuchi ,  Hisashi Fujiwara ,  Masami Yakabe ,  Masato Hayashi

IPC: G01P15/125 ,  G01P9/04 ,  G01C19/56

CPC classification number: G01P15/125 ,  G01C19/5719 ,  G01P2015/0814

Abstract: A displacement measurement apparatus for a microstructure according to the present invention measures a displacement of the microstructure having a fixed portion electrode including a first electrode and a second electrode and a movable portion electrode located oppositely to the fixed portion electrode. A bias generating circuit applies a bias signal to between the first electrode and the movable portion electrode so that influence of a noise signal on a detection signal picked up from between the second electrode and the movable portion electrode may be reduced. A C/V converting circuit converts a capacitance change that is picked up from between the second electrode and the movable portion electrode into a voltage. A detecting circuit detects a displacement of the movable portion electrode based on the voltage.

Abstract translation: 根据本发明的用于微结构的位移测量装置测量具有包括第一电极和第二电极的固定部分电极和位于与固定部分电极相对的可动部电极的微结构的位移。 偏置产生电路将偏置信号施加到第一电极和可动部分电极之间，从而可以减少噪声信号对从第二电极和可动部分电极之间拾取的检测信号的影响。 C / V转换电路将从第二电极和可动部分电极之间拾取的电容变化转换为电压。 检测电路基于电压检测可动部分电极的位移。

公开(公告)号：US20090128171A1

公开(公告)日：2009-05-21

申请号：US11887476

申请日：2006-03-30

Applicant: Katsuya Okumura ,  Masami Yakabe ,  Naoki Ikeuchi

Inventor： Katsuya Okumura ,  Masami Yakabe ,  Naoki Ikeuchi

IPC: G01R31/02

CPC classification number: G01C19/56 ,  B81C99/005 ,  G01P15/123 ,  G01P15/18 ,  G01P21/00 ,  G01P2015/084 ,  G01P2015/0842

Abstract: An inspecting method which is for a microstructure with a movable portion and executes a highly precise inspection without damaging a probe or an inspection electrode by supressing the effect of a needle pressure in contacting the probe to the inspection electrode is provided.When inspection on a microstructure is performed, first a pair of probes (2) are caused to contact respective electrode pads (PD), and the pair of probes (2) and a fritting power source (50) are connected together through relays (30). Next a voltage is applied from the fritting power source (50) to one probe (2) in the pair of probes (2). As the voltage is gradually increased, an oxide film between the pair of probes (2) is destroyed and a current flows between the pair of probes (2) by fritting phenomenon, and the probes (2) and the electrode pad (PD) are electrically conducted each other. Subsequently, the pair of probes (2) are switched to a measuring unit (40) side from the fritting power source (50) through the relays (30), and electrically connected to the measuring unit (40).

Abstract translation: 提供了一种用于具有可移动部分的微结构的检查方法，并且通过抑制将探针接触检查电极​​的针头压力的影响来执行高精度检查而不损坏探针或检查电极。 当对微结构进行检查时，首先使一对探针（2）与相应的电极焊盘（PD）接触，并且一对探针（2）和熔接电源（50）通过继电器（30）连接在一起 ）。 接下来，从熔接电源（50）向一对探针（2）中的一个探针（2）施加电压。 随着电压逐渐增加，一对探针（2）之间的氧化膜被破坏，并且通过烧结现象在一对探针（2）之间流动电流，并且探针（2）和电极焊盘（PD）是 相互导电。 随后，一对探针（2）通过继电器（30）从熔接电源（50）切换到测量单元（40）侧，并且电连接到测量单元（40）。

公开(公告)号：US07368920B2

公开(公告)日：2008-05-06

申请号：US10488597

申请日：2002-09-06

Applicant: Masami Yakabe

Inventor： Masami Yakabe

IPC: G01R27/26

CPC classification number: G01D5/24 ,  G01N27/22 ,  H04R3/06

Abstract: An electric potential fixing apparatus of the present invention is an electric potential fixing apparatus that is connected to a connection line (17) between two capacitances, the first capacitance (14) and the second capacitance (15) that is directly connected to the first capacitance, includes the first high resistance (3), the second high resistance (4) that is connected directly to the first high resistance, a voltage dividing unit that outputs electric potential divided by the first high resistance and the second high resistance to the output terminal, the third capacitance (8) that is connected in parallel to at least either of the first high resistance and the second high resistance, and a voltage supply unit (1) operable to maintain constantly electric potential of the connection line between the two capacitances (14) and (15), holding combined total electric charge quantity of the first capacitance and the second capacitance, and the output terminal of the voltage supply unit is connected to a signal line between the two capacitances.

Abstract translation: 本发明的电位定影装置是与两个电容之间的连接线（17）连接的电位定影装置，与第一电容直接连接的第一电容（14）和第二电容（15） 包括第一高电阻（3），直接连接到第一高电阻的第二高电阻（4），将分压第一高电阻和第二高电阻的电位输出到输出端子的分压单元 ，并联连接到第一高电阻和第二高电阻中的至少一个的第三电容（8）以及电压供应单元（1），其可操作以保持连接线在两个电容之间的恒定电位（ 14）和（15），保持第一电容和第二电容的组合总电荷量以及vo的输出端 电源供应单元连接到两个电容之间的信号线。

公开(公告)号：US20070278650A1

公开(公告)日：2007-12-06

申请号：US10590358

申请日：2005-02-28

Applicant: Kenichi Kagawa ,  Masami Yakabe

Inventor： Kenichi Kagawa ,  Masami Yakabe

IPC: H01L21/301 ,  H01L23/48

CPC classification number: B81C1/00896 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0828 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In a semiconductor device a substrate is formed in a rectangular shape having four edges along dicing lines, and a jetty portion is formed so as to surround an actuator element and an electrode pad for signal input and output. The jetty portion is a rectangular shape having four sides and each side continuously extends along each edge of the substrate in parallel. A foreign object generated when dicing process is performed, is prevented from attaching onto the actuator element and the electrode pad because close adhesion of a protecting tape is improved by the jetty portion.

Abstract translation: 在半导体装置中，基板沿着切割线形成为具有四个边缘的矩形形状，并且形成了围绕致动器元件的码元部分和用于信号输入和输出的电极焊盘。 码头部分是具有四个边的矩形形状，并且每个侧面平行地沿着基板的每个边缘连续地延伸。 当执行切割处理时产生的异物被防止附着到致动器元件和电极垫上，因为通过喷射部分提高了保护带的密合性。

公开(公告)号：US20070257692A1

公开(公告)日：2007-11-08

申请号：US11664807

申请日：2005-10-31

Applicant: Masami Yakabe ,  Tomohisa Hoshino ,  Naoki Ikeuchi

Inventor： Masami Yakabe ,  Tomohisa Hoshino ,  Naoki Ikeuchi

IPC: G01R31/02

CPC classification number: G01R1/06727 ,  G01R1/07342

Abstract: A probe, wherein a beam 3 is cantilevered by a supporter 2 with a predetermined space from a probe substrate 1, and a contact 4 extending in a direction away from the probe substrate 1 is attached to the beam 3. A projection 5 extending toward the probe substrate 1 is formed on the beam 3. Since the projection 5 is brought into contact with the probe substrate 1 when a load is applied to the probe substrate 1, stress imposed on the beam 3 can be dispersed.

Abstract translation: 探针，其中梁3由支撑件2以探针基板1的预定空间悬臂，并且沿远离探针基板1的方向延伸的接触件4附接到梁3。 在梁3上形成有朝向探针基板1延伸的突起5。 由于当将负载施加到探针基板1时突出部5与探针基板1接触，所以能够分散施加在光束3上的应力。

公开(公告)号：US20070246253A1

公开(公告)日：2007-10-25

申请号：US11631638

申请日：2005-07-05

Applicant: Masami Yakabe ,  Kenichi Kagawa ,  Tomohisa Hoshino

Inventor： Masami Yakabe ,  Kenichi Kagawa ,  Tomohisa Hoshino

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H01L21/486 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/552 ,  H01L2223/6622 ,  H01L2924/0002 ,  H05K1/0222 ,  H05K1/0306 ,  H05K3/423 ,  H05K2201/09809 ,  H05K2203/0733 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A through substrate which comprises a silicon substrate (10) having a through hole (19) penetrating a front surface (11) and a back surface (12), a oxidized silicon film (13) being provided along the inner wall surface of the through hole (19), layers (14, 15) comprising Zn and Cu, respectively, being formed on the inner wall surface of the oxidized silicon film (13), and a Cu plating layer (18) which has been grown from a Cu seed layer (17) along the inner wall surface of layers (14, 15) comprising Zn and Cu, respectively, via an insulating layer (16) between them. The above through substrate can provide a through electrode capable of avoiding the noise due to the cross talk.

Abstract translation: 一种贯穿基板，包括具有贯通前表面（11）和后表面（12）的通孔（19）的硅基板（10），沿着贯通孔的内壁表面设置的氧化硅膜（13） 分别形成在氧化硅膜（13）的内壁面上的包含Zn和Cu的层（14,15），以及从Cu种子生长的Cu镀层（18） 层（17）分别经由它们之间的绝缘层（16）沿着包括Zn和Cu的层（14,15）的内壁表面。 上述通过基板可以提供能够避免由于串扰引起的噪声的通孔电极。

公开(公告)号：US20070193358A1

公开(公告)日：2007-08-23

申请号：US10589352

申请日：2005-02-14

Applicant: Kenichi Kagawa ,  Masami Yakabe ,  Shinichi Saeki ,  Takahisa Ohtsuji

Inventor： Kenichi Kagawa ,  Masami Yakabe ,  Shinichi Saeki ,  Takahisa Ohtsuji

IPC: G01L9/12

CPC classification number: H04R19/005 ,  H04R19/04

Abstract: A capacity detection type sensor element includes a rectangular vibrating plate, a flat back electrode which are provided opposedly with each other, and fixing portions which are provided adjoining to the vibrating plate, and has a predetermined length A of edge at a side adjoining to the vibrating plate. The back electrode is held by the fixing portions in a state that space is provided between the back electrode and the vibrating plate. Outer edges of the back electrode which are not held by the adjoining fixing portions, are straight lines and the straight lines define an octagonal shape as a whole.

Abstract translation: 容量检测型传感器元件包括彼此相对设置的矩形振动板，扁平背面电极和与振动板相邻设置的固定部，并且在与该振动板相邻的一侧具有预定长度A的边缘 振动板 在背面电极和振动板之间设置有空间的状态下，由固定部保持背面电极。 没有被相邻的固定部分保持的背面电极的外边缘是直线，并且直线整体形成八边形。

公开(公告)号：US06900751B2

公开(公告)日：2005-05-31

申请号：US10611263

申请日：2003-07-02

Applicant: Masami Yakabe

Inventor： Masami Yakabe

IPC: H03M1/36 ,  H03M1/66 ,  H03M1/62 ,  H03M1/84 ,  H03M1/88

CPC classification number: H03M1/664 ,  H03M1/367

Abstract: An analog multiplier 11 raises a base reference voltage “Vref0” to the nth power so that a reference voltage “Vref1” is produced. Analog multipliers 12 and 13 sequentially raise the reference voltage “Vref1” to the nth power so that reference voltages “Vref2” and “Vref3” are produced. Switch groups 38-41 control the reference voltages “Vref0” to “Vref3”, which are then sent to an analog multiplier 14 together with an input voltage “Vin”. A comparator 14 sequentially compares a multiplication result “Vx” of the multiplier 14 with a voltage “Vout” outputted from a sensor circuit 2, so that a digital output value “Dout” is produced. The analog multiplier 14 is set as appropriate.

Abstract translation: 模拟乘法器11将基准参考电压“Vref 0”提高到第n个功率，从而产生参考电压“Vref 1”。 模拟乘法器12和13将参考电压“Vref 1”依次升高到第n个功率，从而产生参考电压“Vref 2”和“Vref 3”。 开关组38-41控制参考电压“Vref 0”至“Vref 3”，然后与输入电压“Vin”一起发送到模拟乘法器14。 比较器14顺序地将乘法器14的相乘结果“Vx”与从传感器电路2输出的电压“Vout”进行比较，从而产生数字输出值“Dout”。 模拟乘法器14被适当地设定。

公开(公告)号：US20050035771A1

公开(公告)日：2005-02-17

申请号：US10488679

申请日：2002-09-06

Applicant: Masami Yakabe ,  Naoki Ikeuchi

Inventor： Masami Yakabe ,  Naoki Ikeuchi

IPC: G01N27/22 ,  G01R27/26 ,  H04R29/00

CPC classification number: H04R29/004 ,  G01R27/26

Abstract: An electrostatic capacitance detection circuit 10 comprises a DC voltage generator 11, an operational amplifier 14 of which non-inverting input terminal is connected to specific potential, an impedance converter 16, a resistance (R1) 12 connected between the DC voltage generator 11 and an inverting input terminal of the operational amplifier 14, a resistance (R2) 13 connected between the inverting input terminal of the operational amplifier 14 and an output terminal of the impedance converter 16, and a capacitor 15 connected between an output terminal of the operational amplifier 14 and an input terminal of the impedance converter 16. A capacitor to be detected 17 is connected between the input terminal of the impedance converter 16 and specific potential.

Abstract translation: 静电电容检测电路10包括直流电压发生器11，其非反相输入端子连接到特定电位的运算放大器14，阻抗转换器16，连接在直流电压发生器11与电压 运算放大器14的反相输入端子，连接在运算放大器14的反相输入端子和阻抗转换器16的输出端子之间的电阻（R2）13以及连接在运算放大器14的输出端子之间的电容器15 和阻抗转换器16的输入端子。待检测电容器17连接在阻抗转换器16的输入端和特定电位之间。