摘要:
A semiconductor memory device provided with a memory cell region having first gate electrodes and a peripheral circuit region having second gate electrodes includes first gate electrodes arranged a first distance apart from each other on a semiconductor substrate, second gate electrodes arranged a second distance, which is larger than the first distance, apart from each other on the semiconductor substrate, first diffusion layers formed in the semiconductor substrate, the first diffusion layers sandwiching the first gate electrodes, second diffusion layers formed in the semiconductor substrate, the second diffusion layers sandwiching the second gate electrodes, a first insulating film formed on the first diffusion layer, second insulating films formed on the side surfaces of the second gate electrodes, first silicide films formed on the first gate electrodes, second silicide films formed on the second gate electrodes, and third silicide films formed on the second diffusion layers.
摘要:
A semiconductor integrated circuit device includes a semiconductor substrate, an element isolation region, a first interconnection, a second interconnection, and a memory cell unit connected between a corresponding one of the first interconnection and a second interconnection. The memory cell unit includes two selection transistors and memory cell transistors of not larger than two. The memory cell transistors are connected between the two selection transistors. The memory cell transistor has a charge storage layer whose side surface lies in the same plane as the side surface of the element isolation regions.
摘要:
A semiconductor memory device having: a cell array including bit lines, word lines and memory cells disposed at crossings thereof, plural memory cells being connected in series to constitute a NAND cell unit, plural blocks being arranged, each being constituted by plural NAND cell units arranged in the word line direction; and a row decoder configured to select a block, wherein the row decoder includes: transferring transistor arrays disposed in association with the blocks, in each of which transistors are arranged for transferring word line drive voltages; first decode portions disposed in association with the transferring transistor arrays, which are applied with boosted voltages to selectively drive the transferring transistor arrays; and second decode portions configured to select one of the blocks, each of which is disposed to be shared by adjacent two first decode portions.
摘要:
A semiconductor memory device having: a cell array including bit lines, word lines and memory cells disposed at crossings thereof, plural memory cells being connected in series to constitute a NAND cell unit, plural blocks being arranged, each being constituted by plural NAND cell units arranged in the word line direction; and a row decoder configured to select a block, wherein the row decoder includes: transferring transistor arrays disposed in association with the blocks, in each of which transistors are arranged for transferring word line drive voltages; first decode portions disposed in association with the transferring transistor arrays, which are applied with boosted voltages to selectively drive the transferring transistor arrays; and second decode portions configured to select one of the blocks, each of which is disposed to be shared by adjacent two first decode portions.
摘要:
A semiconductor memory device provided with a memory cell region having first gate electrodes and a peripheral circuit region having second gate electrodes includes first gate electrodes arranged a first distance apart from each other on a semiconductor substrate, second gate electrodes arranged a second distance, which is larger than the first distance, apart from each other on the semiconductor substrate, first diffusion layers formed in the semiconductor substrate, the first diffusion layers sandwiching the first gate electrodes, second diffusion layers formed in the semiconductor substrate, the second diffusion layers sandwiching the second gate electrodes, a first insulating film formed on the first diffusion layer, second insulating films formed on the side surfaces of the second gate electrodes, first silicide films formed on the first gate electrodes, second silicide films formed on the second gate electrodes, and third silicide films formed on the second diffusion layers.
摘要:
A semiconductor integrated circuit device includes a semiconductor substrate, an element isolation region, a first interconnection, a second interconnection, and a memory cell unit connected between a corresponding one of the first interconnection and a second interconnection. The memory cell unit includes two selection transistors and memory cell transistors of not larger than two. The memory cell transistors are connected between the two selection transistors. The memory cell transistor has a charge storage layer whose side surface lies in the same plane or in substantially the same plane as the side surface of the element isolation regions.
摘要:
A nonvolatile semiconductor memory includes: a memory sub array including a memory cell unit configured with a memory cell transistor and a select transistor connected in series; a control gate line driver including a control gate line driver transistor connected to a control gate line of the memory cell transistor; and a select transistor gate line driver including a select gate line driver transistor connected to a select gate line of the select transistor. A thickness of a gate insulator of the control gate line driver transistor is thicker than that of the select gate line driver transistor.
摘要:
A nonvolatile semiconductor memory includes: a memory sub array including a memory cell unit configured with a memory cell transistor and a select transistor connected in series; a control gate line driver including a control gate line driver transistor connected to a control gate line of the memory cell transistor; and a select transistor gate line driver including a select gate line driver transistor connected to a select gate line of the select transistor. A thickness of a gate insulator of the control gate line driver transistor is thicker than that of the select gate line driver transistor.
摘要:
A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, first and second control gate electrode layers, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on a high voltage gate insulating film, a second inter-gate insulating film having an aperture, third and fourth control gate electrode layers, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on a second tunneling insulating film, a third inter-gate insulating film having an aperture, fifth and sixth control gate electrode layers, and a third metallic silicide film; and a liner insulating film directly disposed on source and drain regions of each of the memory cell transistor, the low voltage transistor, and the high voltage transistor.
摘要:
A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, a first and a second control gate electrode layer, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on the high voltage gate insulating film, a second inter-gate insulating film having an aperture, a third and a fourth control gate electrode layer, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on the second tunneling insulating film, a third inter-gate insulating film having an aperture, a fifth and a sixth control gate electrode layer, and a third metallic silicide film; and a liner insulating film directly disposed on a first source and drain region of the memory cell transistor, a second source and drain region of the low voltage transistor, and a third source and drain region of the high voltage transistor.