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    Implantable medical device having a multi-axis magnetic sensor
    22.
    发明授权
    Implantable medical device having a multi-axis magnetic sensor 有权
    具有多轴磁性传感器的植入式医疗装置

    公开(公告)号：US08750961B1

    公开(公告)日：2014-06-10

    申请号：US13788310

    申请日：2013-03-07

    Applicant: Medtronic, Inc.

    Inventor： Andrew J. Ries ,  Mark E. Henschel ,  Lawrence C. McClure ,  Mark S. Ricotta ,  Lejun Wang

    IPC: A61B5/055 ,  A61B5/05 ,  A61N1/08

    CPC classification number: A61N1/3718 ,  A61B5/055 ,  A61N1/086

    Abstract: The present invention provides a packaging technique and apparatus that incorporates a flexible substrate package with a three-axis magnetic sensor for three-axis sensing in an implantable medical device. The apparatus includes three single-axis magnetic sensor integrated circuits (ICs) that are mounted to a substrate and encapsulated with a polymer mold compound. The substrate is excised around each of the sensor ICs to form panels that are folded to align the three single-axis sensors in the x, y and z axis.

    Abstract translation: 本发明提供一种封装技术和装置，其包括柔性衬底封装与用于可植入医疗装置中的三轴感测的三轴磁传感器。 该装置包括三个单轴磁传感器集成电路（IC），其安装到基板上并用聚合物模具化合物封装。 在每个传感器IC周围切除衬底，以形成折叠以将x，y和z轴上的三个单轴传感器对准的面板。

    Feedthrough header assembly and device including same
    24.
    发明授权
    Feedthrough header assembly and device including same 有权

    公开(公告)号：US12290693B2

    公开(公告)日：2025-05-06

    申请号：US17587676

    申请日：2022-01-28

    Applicant: Medtronic, Inc.

    Inventor： Mark E. Henschel ,  Andrew J. Ries ,  Songhua Shi ,  Jemmy Sutanto ,  Lea Ann Nygren

    IPC: A61N1/375 ,  H01R12/52 ,  H01R43/20

    Abstract: Various embodiments of an electronics module and an implantable medical device that includes such module are disclosed. The module includes a feedthrough header assembly having a conductive header that includes a conductive inner surface, an outer surface, and a contact disposed on the inner surface and electrically connected to the header; and a feedthrough pin disposed within a via that extends through the header. The module further includes an electronic layer having a substrate and an electronic component disposed on or within the substrate. The electronic component is electrically connected to the contact of the conductive header such that the electronic component is electrically connected to the header. A major surface of the substrate of the electronic layer faces the conductive inner surface of the header without any intervening nonconductive layers disposed between the major surface of the substrate and the conductive inner surface of the header.

    Electronic package and device including same
    26.
    发明授权
    Electronic package and device including same 有权

    公开(公告)号：US12082354B2

    公开(公告)日：2024-09-03

    申请号：US17574362

    申请日：2022-01-12

    Applicant: Medtronic, Inc.

    Inventor： David A. Ruben ,  Andrew J. Ries ,  Pankti N. Shah ,  Jason D. Hamack

    IPC: H05K5/00 ,  A61N1/378 ,  H02J50/10 ,  H05K1/18

    CPC classification number: H05K5/0095 ,  A61N1/3787 ,  H02J50/10 ,  H05K1/181 ,  H05K5/0052 ,  H05K2201/10015

    Abstract: Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover.

    Plunger
    27.
    外观设计
    Plunger 有权

    公开(公告)号：USD1010108S1

    公开(公告)日：2024-01-02

    申请号：US29740621

    申请日：2020-07-06

    Applicant: Medtronic, Inc.

    Designer： Andrew J. Ries ,  Kamal Deep Mothilal ,  Craig Wiklund ,  Kris A. Peterson ,  Hui Jin ,  Kathryn J. Moore

    Abstract: FIG. 1 is a front perspective view of a plunger according to an embodiment of the present design;
    FIG. 2 is front elevation view of the plunger of FIG. 1;
    FIG. 3 is a rear elevation view of the plunger of FIG. 1;
    FIG. 4 is a left side view of the plunger of FIG. 1;
    FIG. 5 is a right side view of the plunger of FIG. 1;
    FIG. 6 is a top plan view of the plunger of FIG. 1;
    FIG. 7 is a bottom plan view of the plunger of FIG. 1; and,
    FIG. 8 is a rear perspective view of the plunger of FIG. 1.
    The broken lines in the drawings are for the purpose of illustrating portions of the plunger that form no part of the claimed design. The dot-dash lines in the drawings represent the bounds of the claimed design and form no part thereof.

    Feedthrough assembly and device including same
    28.
    发明授权
    Feedthrough assembly and device including same 有权

    公开(公告)号：US11633611B2

    公开(公告)日：2023-04-25

    申请号：US17125250

    申请日：2020-12-17

    Applicant: Medtronic, Inc.

    Inventor： Andrew J. Ries ,  Chunho Kim ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey Voss ,  Kris A. Peterson ,  Mark E. Henschel

    IPC: A61N1/375

    Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

    PRESSURE SENSOR ASSEMBLY
    29.
    发明申请
    PRESSURE SENSOR ASSEMBLY 有权

    公开(公告)号：US20220244123A1

    公开(公告)日：2022-08-04

    申请号：US17571825

    申请日：2022-01-10

    Applicant: Medtronic, Inc.

    Inventor： Andreas Fenner ,  David A. Ruben ,  Andrew J. Ries ,  Chetan Patel

    IPC: G01L9/00 ,  B23K26/20 ,  H01L23/522 ,  H05K5/06 ,  H01L23/00

    Abstract: Various embodiments of a pressure sensor assembly and an implantable medical device that includes such assembly are disclosed. The assembly includes a substrate having a via that extends through the substrate along a via axis between a first major surface and a second major surface of the substrate, a membrane disposed on the first major surface of the substrate and over the via, and a patterned metal layer disposed on a first major surface of the membrane, a portion of such layer including a first capacitor plate. The assembly further includes an integrated circuit disposed adjacent to the first major surface of the membrane and electrically connected to the metal layer. The integrated circuit includes a second capacitor plate disposed on or within a substrate of the integrated circuit. The first capacitor plate and the second capacitor plate form a variable capacitor disposed along the via axis.

    FEEDTHROUGH HEADER ASSEMBLY AND DEVICE INCLUDING SAME
    30.
    发明申请
    FEEDTHROUGH HEADER ASSEMBLY AND DEVICE INCLUDING SAME 有权

    公开(公告)号：US20220241598A1

    公开(公告)日：2022-08-04

    申请号：US17587676

    申请日：2022-01-28

    Applicant: Medtronic, Inc.

    Inventor： Mark E. Henschel ,  Andrew J. Ries ,  Songhua Shi ,  Jemmy Sutanto ,  Lea Ann Nygren

    IPC: A61N1/375 ,  H01R43/20 ,  H01R12/52

    Abstract: Various embodiments of an electronics module and an implantable medical device that includes such module are disclosed. The module includes a feedthrough header assembly having a conductive header that includes a conductive inner surface, an outer surface, and a contact disposed on the inner surface and electrically connected to the header; and a feedthrough pin disposed within a via that extends through the header. The module further includes an electronic layer having a substrate and an electronic component disposed on or within the substrate. The electronic component is electrically connected to the contact of the conductive header such that the electronic component is electrically connected to the header. A major surface of the substrate of the electronic layer faces the conductive inner surface of the header without any intervening nonconductive layers disposed between the major surface of the substrate and the conductive inner surface of the header.

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