利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

26 条记录 (耗时 0.022 秒)

    Process of removing soldering flux and/or adhesive tape residue from a substrate
    21.
    发明授权
    Process of removing soldering flux and/or adhesive tape residue from a substrate 失效
    从基材去除焊剂和/或胶带残留物的工艺

    公开(公告)号：US5340407A

    公开(公告)日：1994-08-23

    申请号：US896051

    申请日：1992-06-09

    申请人： Paul L. Bolden ,  Michael E. Hayes

    发明人： Paul L. Bolden ,  Michael E. Hayes

    IPC分类号： B41N3/06 ,  C11D3/18 ,  C11D3/20 ,  C11D3/43 ,  C11D7/24 ,  C11D7/26 ,  C11D7/50 ,  C11D11/00 ,  C23G5/024 ,  C23G5/032 ,  G03F7/42 ,  H05K3/26 ,  B08B3/08

    CPC分类号： H05K3/26 ,  C11D11/0047 ,  C11D3/18 ,  C11D3/2093 ,  C11D3/43 ,  C11D7/5027 ,  C23G5/024 ,  C23G5/032 ,  G03F7/422 ,  C11D7/24 ,  C11D7/263 ,  C11D7/264 ,  C11D7/266 ,  H05K2203/0783

    摘要： Disclosed is an industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith. The process comprises the steps of contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material; removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water. The process also comprises separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.

    摘要翻译： 公开了一种工业清洗方法，其中包含焊剂和/或粘合带残留物的污染物从被污染的基底上除去。 该方法包括以下步骤：使基材与基本上不含水溶性有机材料的基于萜烯的清洁组合物接触; 通过与温度为约70°F至140°F的水接触，不要超过约10分钟的时间，从基材中除去组合物和溶解的污染物，以提供污染等级为无 大于约14微克NaCl当量/平方英寸（MIL-P-28809A），从而形成包含组合物，污染物和水的混合物。 该方法还包括从所述混合物中分离水，所分离的水基本上不含水溶性有机材料，并且化学需氧量不大于约1,000ppm。

    Method for the disposal of hazardous non-polar organic wastes
    22.
    发明授权
    Method for the disposal of hazardous non-polar organic wastes 失效
    处置危险非极性有机废物的方法

    公开(公告)号：US4931192A

    公开(公告)日：1990-06-05

    申请号：US327015

    申请日：1989-03-22

    申请人： J. Stansill Covington ,  Michael A. McBride ,  Michael E. Hayes

    发明人： J. Stansill Covington ,  Michael A. McBride ,  Michael E. Hayes

    IPC分类号： A62D3/00 ,  A62D3/33 ,  A62D101/04 ,  A62D101/20 ,  A62D101/22 ,  G21F9/16 ,  G21F9/30

    CPC分类号： A62D3/33 ,  G21F9/165 ,  G21F9/30 ,  A62D2101/04 ,  A62D2101/20 ,  A62D2101/22 ,  Y10S210/908

    摘要： A method for disposing of non-polar organic wastes including the steps of dissolving the organic waste in an organic solvent which is not environmentally objectionable, in combination with a suitable surfactant, mixing the resultant solution with a quantity of water to develop an emulsion in which the organic element is effectively dispersed in the water and thereafter mixing the emulsion with cement which, when allowed to solidify, encapsulates the organic waste within the solid cementitious mass. This solid mass is suitable for disposal in a landfill or the like. This invention is useful in safely disposing of environmentally hazardous organic wastes.

    摘要翻译： 一种处理非极性有机废物的方法，包括以下步骤：将有机废物溶解在不环境不利的有机溶剂中，与合适的表面活性剂组合，将所得溶液与一定量的水混合以形成乳液，其中 有机元素有效地分散在水中，然后将乳液与水泥混合，当胶凝固化时，将有机废物封装在固体胶结物质中。 这种固体块适用于在垃圾填埋场等中的处理。 本发明在安全处理有害环境有害废物方面是有用的。

    Process of cleaning soldering flux and/or adhesive tape with terpenet and monobasic ester
    24.
    发明授权
    Process of cleaning soldering flux and/or adhesive tape with terpenet and monobasic ester 失效
    清洁焊接和/或胶带的过程与TERPENET和单粒子

    公开(公告)号：US5120371A

    公开(公告)日：1992-06-09

    申请号：US620500

    申请日：1990-11-29

    申请人： Paul L. Bolden ,  Michael E. Hayes

    发明人： Paul L. Bolden ,  Michael E. Hayes

    IPC分类号： B08B3/08 ,  C11D3/18 ,  C11D3/20 ,  C11D3/43 ,  C11D7/24 ,  C11D7/26 ,  C11D7/50 ,  C11D11/00 ,  C23G5/024 ,  C23G5/032 ,  H05K3/26

    CPC分类号： C11D7/5027 ,  C11D11/0047 ,  C11D3/18 ,  C11D3/2093 ,  C11D3/43 ,  C23G5/024 ,  C23G5/032 ,  H05K3/26 ,  C11D7/24 ,  C11D7/263 ,  C11D7/264 ,  C11D7/266 ,  H05K2203/0783

    摘要： Disclosed is an industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith. The process comprises the steps of contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material; removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water. The process also comprises separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.

    摘要翻译： 公开了一种工业清洗方法，其中包含焊剂和/或粘合带残留物的污染物从被污染的基底上除去。 该方法包括以下步骤：使基材与基本上不含水溶性有机材料的基于萜烯的清洁组合物接触; 通过与温度为约70°F至140°F的水接触，不要超过约10分钟的时间，从基材中除去组合物和溶解的污染物，以提供污染等级为无 大于约14微克NaCl当量/平方英寸（MIL-P-28809A），从而形成包含组合物，污染物和水的混合物。 该方法还包括从所述混合物中分离水，所分离的水基本上不含水溶性有机材料，并且化学需氧量不大于约1,000ppm。