公开(公告)号：US20070281676A1

公开(公告)日：2007-12-06

申请号：US11421565

申请日：2006-06-01

申请人： Jaime A. Borras ,  Iwona Turlik ,  Kenneth J. Zdunek ,  Stephen L. Spear

发明人： Jaime A. Borras ,  Iwona Turlik ,  Kenneth J. Zdunek ,  Stephen L. Spear

IPC分类号： H04M3/00

CPC分类号： H04M1/56 ,  H04M1/2745 ,  H04M1/274508 ,  H04M1/72563 ,  H04W76/10

摘要： A wireless communication device (102) includes a multi-mode transceiver (204) that is operable to communicate with a plurality of communication networks. The device (102) also includes a memory (216) for storing: an electronic address book (226) that includes a plurality of identifiers (302), each identifier (302) identifying a call destination device; a plurality of access network choices (304) for at least one of the identifiers (302); and a plurality of service choices (308) for at least one of the identifiers. The device (102) further includes a controller (210) having access to the memory (216) for determining a preferred call model and selecting one of the plurality of access network choices and one of the plurality of service choices as a preferred call model for at least one of the identifiers.

摘要翻译： 无线通信设备（102）包括可操作以与多个通信网络进行通信的多模式收发器（204）。 设备（102）还包括存储器（216），用于存储：包括多个标识符（302）的电子地址簿（226），标识呼叫目的地设备的每个标识符（302） 用于所述标识符（302）中的至少一个的多个接入网络选择（304）; 以及用于至少一个标识符的多个服务选择（308）。 设备（102）还包括控制器（210），其具有访问存储器（216），用于确定优选呼叫模型，并且选择多个接入网络选择中的一个，并且将多个服务选择中的一个作为优选呼叫模型， 至少一个标识符。

公开(公告)号：US20060089557A1

公开(公告)日：2006-04-27

申请号：US10974874

申请日：2004-10-27

申请人： Liliana Grajales ,  Bryn Martin ,  Ion Nicolaescu ,  Iwona Turlik

发明人： Liliana Grajales ,  Bryn Martin ,  Ion Nicolaescu ,  Iwona Turlik

IPC分类号： A61B5/02

CPC分类号： A61B5/02444

摘要： A plurality of sensor clusters are provided (61) wherein at least some of the sensor clusters are comprised of at least one light sensitive sensor and a plurality of light emitters. These sensor clusters are disposed (62) in close proximity to a subject user and, in a preferred approach, at least some of the sensor clusters are disposed substantially distal to one another. The light emitters are caused (63) to emit light and the light sensitive sensors are used (64) to detect interactions as between the subject user and the emitted light. These detected interactions are then used (65) to determine the user's heart rate. In a preferred embodiment, the sensed interaction information is dynamically modified as a reflection of how valid the information trajectory appears to be at any given time.

摘要翻译： 提供多个传感器簇（61），其中传感器簇中的至少一些由至少一个光敏传感器和多个发光器组成。 这些传感器簇被布置（62），靠近被摄体使用者，并且在优选的方法中，传感器群组中的至少一些基本上远离彼此设置。 引起发光体（63）发光，并且使用光敏传感器（64）来检测被摄体使用者和发射光之间的相互作用。 然后使用这些检测到的相互作用（65）来确定用户的心率。 在优选实施例中，感测到的交互信息被动态地修改为反映信息轨迹在任何给定时间看起来如何有效。

公开(公告)号：US06194250B1

公开(公告)日：2001-02-27

申请号：US09152899

申请日：1998-09-14

申请人： Cynthia M. Melton ,  George N. Demet ,  Iwona Turlik

发明人： Cynthia M. Melton ,  George N. Demet ,  Iwona Turlik

IPC分类号： H01L2148

CPC分类号： H01L21/568 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An integrated circuit die (12) is positioned onto the molding support (38) within the opening such that a non-active face (32) of the integrated circuit die (12) rests against the molding support (38). Wire leads (18) connect an active face (28) of the integrated circuit die (12) to the metallic leads (16). A plurality of metallic bumps (20) are attached to the metallic leads (16), and a polymeric precursor is dispensed. The precursor embeds the active face (28) of the integrated circuit die (12), the inner surface (19) of the metallic leads (16), the wire leads (18), and the metallic bumps (20). The microelectronic package (10) is then heated to cure the polymeric precursor to form a polymeric body (14). The microelectronic package (10) is then capable of being tested and subsequently attached to printed circuit board (40) to form a low-profile microelectronic assembly (11).

摘要翻译： 通过将引线框架（22）放置在粘合聚酰亚胺胶带（38）上形成微电子封装（10）。 引线框架（22）包括多个金属引线（16）和开口。 集成电路模具（12）被定位在开口内的模制支撑件（38）上，使得集成电路模具（12）的非活动面（32）靠在模制支撑件（38）上。 导线（18）将集成电路管芯（12）的有源面（28）连接到金属引线（16）。 多个金属凸块（20）连接到金属引线（16）上，分配聚合物前体。 前体嵌入集成电路管芯（12）的有源面（28），金属引线（16）的内表面（19），引线引线（18）和金属凸块（20）。 然后加热微电子封装（10）以固化聚合物前体以形成聚合体（14）。 微电子封装（10）然后能够被测试并且随后连接到印刷电路板（40）以形成薄型微电子组件（11）。

公开(公告)号：US5447264A

公开(公告)日：1995-09-05

申请号：US270166

申请日：1994-07-01

申请人： Nicholas G. Koopman ,  Glenn A. Rinne ,  Iwona Turlik

发明人： Nicholas G. Koopman ,  Glenn A. Rinne ,  Iwona Turlik

IPC分类号： B23K1/00 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  B23K3/06 ,  B23K37/04

CPC分类号： H01L24/11 ,  B23K1/0016 ,  H01L21/6835 ,  H05K3/3473 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/10734 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/0726

摘要： A temporary substrate for solder bumps may be used to transfer solder bumps to a microelectronic device. The temporary substrate includes a solder nonwettable surface and a plurality of conductive vias therein. A solder bump is formed on each of the conductive vias and is electrically and mechanically connected thereto. The solder bump extends over the solder nonwettable surface to produce a solder bump cross-sectional area which is greater than the cross-sectional area of the conductive via. A microelectronic device is placed adjacent the temporary substrate with each input/output pad adjacent a respective solder bump. An electrical and mechanical connection is formed between the solder bump and the input/output pad, and the microelectronic device is separated from the temporary substrate with the solder bump remaining connected to the input/output pad. The temporary substrate can also be used for burn-in and testing of microelectronic devices and rework on multichip modules.

摘要翻译： 可以使用用于焊料凸块的临时衬底将焊料凸块转移到微电子器件。 临时衬底包括焊料不润湿表面和其中的多个导电通孔。 在每个导电通孔上形成焊料凸点，并且与其电连接和机械连接。 焊料凸块在焊料不可润湿的表面上延伸以产生大于导电通孔的横截面面积的焊料凸块横截面积。 微电子器件放置在临时衬底附近，每个输入/输出焊盘与相应的焊料凸块相邻。 在焊料凸块和输入/输出焊盘之间形成电气和机械连接，并且微电子器件与临时衬底分离，焊料凸块保持连接到输入/输出焊盘。 临时衬底还可用于微电子器件的老化和测试以及多芯片模块上的返工。

公开(公告)号：US5325265A

公开(公告)日：1994-06-28

申请号：US819571

申请日：1992-01-07

申请人： Iwona Turlik ,  Arnold Reisman ,  Deepak Nayak ,  Lih-Tyng Hwang ,  Giora Dishon ,  Scott L. Jacobs ,  Robert F. Darveaux ,  Neil M. Poley

发明人： Iwona Turlik ,  Arnold Reisman ,  Deepak Nayak ,  Lih-Tyng Hwang ,  Giora Dishon ,  Scott L. Jacobs ,  Robert F. Darveaux ,  Neil M. Poley

IPC分类号： H01L23/373 ,  H01L23/473 ,  H01L23/538 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L24/32 ,  H01L23/3736 ,  H01L23/473 ,  H01L23/5383 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/83051 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351

摘要： A high performance integrated circuit chip package includes a support substrate having conductors extending from one face to the opposite face thereof and a multilayer wiring substrate on the opposite face of the support substrate for connecting chips mounted thereon to one another and to the conductors. A heat sink includes microchannels at one face thereof, with thermally conductive cushions connecting the one face of the heat sink with the exposed back sides of the chips, to provide a high density chip package with high heat dissipation. The support substrate and heat sink may be formed of blocks of material having thermal expansion matching silicon. The cushions are a low melting point solder, preferably pure indium, and are sufficiently thick to absorb thermal stresses, but sufficiently thin to efficiently conduct heat from the chips to the heat sink.

摘要翻译： 高性能集成电路芯片封装包括：支撑基板，其具有从一个面向其相对面延伸的导体，以及在该支撑基板的相对面上的多层布线基板，用于将安装在其上的芯片彼此连接并连接至导体。 散热器包括在其一个面上的微通道，其中导热垫将散热片的一个面与芯片的暴露的背面连接起来，以提供具有高散热性的高密度芯片封装。 支撑衬底和散热器可以由具有热膨胀匹配硅的材料块形成。 垫子是低熔点焊料，优选纯铟，并且足够厚以吸收热应力，但是足够薄以有效地将热量从芯片传导到散热器。

公开(公告)号：US5025304A

公开(公告)日：1991-06-18

申请号：US277607

申请日：1988-11-29

申请人： Arnold Reisman ,  Iwona Turlik

发明人： Arnold Reisman ,  Iwona Turlik

IPC分类号： H01L21/768 ,  G01N21/01 ,  G01N21/27 ,  H01L23/48 ,  H01L23/535 ,  H01L27/00

CPC分类号： H01L23/535 ,  H01L23/481 ,  H01L2924/0002

摘要： A method of forming a high density semiconductor structure including one or more buried metal layers. One or more metal layers may be formed on a first semiconductor substrate, with the metal layer or layers being insulated from one another and from the substrate. One or more metal layers may be formed on the surface of a second substrate which may or may not be a semiconductor substrate. The topmost metal layers, either or both of which may have an insulating layer thereon, are placed in contact and heated in an oxidizing ambient atmosphere to form a bond therebetween. One or more vias connect the buried metal layers to the active devices in the substrates. The buried metal layers may form buried power and ground planes and buried metallization patterns for device interconnection.