公开(公告)号：US06524888B2

公开(公告)日：2003-02-25

申请号：US10037536

申请日：2002-01-04

Applicant: David N. Cokely ,  Thomas M. Culnane ,  Lisa J. Jimarez ,  Miguel A. Jimarez ,  Li Li ,  Donald I. Mead

Inventor： David N. Cokely ,  Thomas M. Culnane ,  Lisa J. Jimarez ,  Miguel A. Jimarez ,  Li Li ,  Donald I. Mead

IPC: H01L2144

CPC classification number: H01L24/81 ,  H01L21/6835 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014

Abstract: Mixtures for attaching a semiconductor chip to a substrate. The semiconductor chip has an array of joining material bumps, such as C4 solder balls. The substrate has an array of conductive pads corresponding to the array of joining material bumps. In a first embodiment the fixture has a body having a first cavity containing the semiconductor chip and a second cavity for containing the substrate. The substrate is placed over the semiconductor chip with the conductive pads opposing and in contact with the joining material bumps, such that during reflow of the joining material bumps, the weight of the substrate acts against the joining material bumps and aids in the attachment of the semiconductor chip to the substrate to form electrical connections therebetween.

Abstract translation: 用于将半导体芯片附接到基板的混合物。 半导体芯片具有连接材料凸块的阵列，例如C4焊球。 衬底具有对应于接合材料凸块阵列的导电焊盘阵列。 在第一实施例中，固定装置具有主体，其具有包含半导体芯片的第一空腔和用于容纳基板的第二空腔。 衬底放置在半导体芯片上方，其中导电焊盘与接合材料凸块相对并接触，使得在接合材料凸块的回流期间，衬底的重量抵抗接合材料凸起作用，并有助于附接 半导体芯片到基板之间形成电连接。

公开(公告)号：US06486415B2

公开(公告)日：2002-11-26

申请号：US09761124

申请日：2001-01-16

Applicant: Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

Inventor： Lisa J. Jimarez ,  Miguel A. Jimarez ,  Voya R. Markovich ,  Cynthia S. Milkovich ,  Charles H. Perry ,  Brenda L. Peterson

IPC: H01P1204

CPC classification number: H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4605 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/061 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

Abstract translation: 提供电子封装和制造电子封装的方法。 电介质材料层位于包括多个导电触点的衬底的第一表面上。 至少一个通孔形成在电介质材料层中，与多个导电触点中的至少一个对准。 导电材料位于基本上填充通孔的至少一个通孔中。 至少一个导电构件定位在通孔中的导电材料上并与导电材料电接触。 该电子封装提高了组件的现场使用寿命，该组件包括附接到衬底的第二表面的半导体芯片和附着到导电构件的印刷线路板。

公开(公告)号：US06337509B2

公开(公告)日：2002-01-08

申请号：US09116368

申请日：1998-07-16

Applicant: David N. Cokely ,  Thomas M. Culnane ,  Lisa J. Jimarez ,  Miguel A. Jimarez ,  Li Li ,  Donald I. Mead

Inventor： David N. Cokely ,  Thomas M. Culnane ,  Lisa J. Jimarez ,  Miguel A. Jimarez ,  Li Li ,  Donald I. Mead

IPC: H01L23495

CPC classification number: H01L24/81 ,  H01L21/6835 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014

Abstract: Fixtures for attaching a semiconductor chip to a substrate. The semiconductor chip has an array of joining material bumps, such as C4 solder balls. The substrate has an array of conductive pads corresponding to the array of joining material bumps. In a first embodiment the fixture has a body having a first cavity for containing the semiconductor chip and a second cavity in communication with the first cavity for containing the substrate. Whereby the substrate is placed over the semiconductor chip with the conductive pads opposing and in contact with the joining material bumps, such that during reflow of the joining material bumps, the weight of the substrate acts against the joining material bumps and aids in the attachment of the semiconductor chip to the substrate to form electrical connections therebetween. In a second embodiment the fixture has a first plate having a first opening for disposal of the semiconductor chip therein, a second plate stacked below the first plate and having a thickness substantially equal to the thickness of the substrate, the second plate further having a second opening opposing the first opening for disposal of the substrate therein, and a third plate stacked below the second plate such that the substrate is flattened in the second opening under the weight of the first plate thereby aiding in the attachment of the joining material bumps to their corresponding conductive pads during solder reflow to form electrical connections therebetween. Methods for use of the fixtures is also provided.

Abstract translation: 用于将半导体芯片附接到基板的夹具。 半导体芯片具有连接材料凸块的阵列，例如C4焊球。 衬底具有对应于接合材料凸块阵列的导电焊盘阵列。 在第一实施例中，固定装置具有主体，该主体具有用于容纳半导体芯片的第一空腔和与第一空腔连通以容纳基板的第二空腔。 由此将衬底放置在半导体芯片上，其中导电焊盘与接合材料凸块相对并接触，使得在接合材料凸块的回流期间，衬底的重量抵抗接合材料凸起并且有助于附接 半导体芯片到基板以在它们之间形成电连接。 在第二实施例中，固定装置具有第一板，其具有用于在其中处理半导体芯片的第一开口，堆叠在第一板下方并且具有基本上等于衬底厚度的厚度的第二板，第二板还具有第二板 与第一开口相对地打开以处理其中的基板;以及第三板，堆叠在第二板下方，使得基板在第一板的重量下在第二开口中变平，由此辅助将接合材料凸块附接到它们 焊料回流期间相应的导电焊盘在其间形成电连接。 还提供了使用固定装置的方法。

公开(公告)号：US06246124B1

公开(公告)日：2001-06-12

申请号：US09154618

申请日：1998-09-16

Applicant: Miguel A. Jimarez ,  Marybeth Perrino ,  Son K. Tran ,  Tien Y. Wu

Inventor： Miguel A. Jimarez ,  Marybeth Perrino ,  Son K. Tran ,  Tien Y. Wu

IPC: H01L2329

CPC classification number: H01L21/563 ,  H01L23/13 ,  H01L23/3121 ,  H01L2224/73203 ,  H01L2924/3025

Abstract: An encapsulated semiconductor chip module. The chip module has the overlying encapsulant adhered directly and integrally to bare portions of the substrate to which the chip is mounted. This configuration enhances the adhesion and inhibits unintended delamination of the encapsulant from the balance of the module. The module is made by patterning anchor openings into the solder mask. The anchor openings expose corresponding portions of the substrate. It is important to locate the anchor openings over parts of the substrate that do not have circuitry on them, that is, on bare portions, so as to avoid corrosion or contamination of the circuit connections.

Abstract translation: 封装的半导体芯片模块。 芯片模块具有直接并整体地粘附到芯片所安装的基板的裸露部分的上覆密封剂。 这种构造增强了粘附性，并且阻止了封装材料与模块平衡的意外分层。 该模块通过将锚定开口图案图案化成焊接掩模。 锚定开口露出衬底的相应部分。 重要的是将锚定开口定位在其上没有电路的基板的部分上，即在裸露的部分上，以避免腐蚀或电路连接的污染。