公开(公告)号：US08953320B2

公开(公告)日：2015-02-10

申请号：US13613873

申请日：2012-09-13

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  H01L23/427

CPC分类号： H05K7/20809 ,  F28D15/02 ,  F28D15/046 ,  F28F3/048 ,  H05K7/203

摘要： Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.

摘要翻译： 提供冷却装置和方法用于多个电子部件的部分浸没冷却。 冷却装置包括至少部分围绕部件周围并形成隔室的壳体以及设置在隔间内的流体。 第一和第二电子部件至少部分地不浸在流体内，其中第一部件是与第二部件不同的构造的不同类型的电子部件。 蒸汽冷凝器设置有设置在隔间内的蒸汽冷凝表面，用于冷凝流体蒸气，并且冷凝物重新导向结构设置在蒸气冷凝器和第一和第二部件之间的隔间内。 与第二电子部件相比，重定向结构在第一电子部件上被不同地配置，并且与第二部件相比，在第一部件上提供了不同的冷凝物滴落模式。

公开(公告)号：US08925333B2

公开(公告)日：2015-01-06

申请号：US13613832

申请日：2012-09-13

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F25B21/02

CPC分类号： B21D53/02 ,  F25B21/02 ,  F25B2321/0252 ,  H05K7/2079 ,  Y10T29/49359

摘要： Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.

摘要翻译： 电子系统的热电增强空气和液体冷却由包括与电子部件热连通的液冷结构的冷却装置提供，液 - 液和空 - 液热交换器 经由冷却剂回路串联流体连通，其包括并联连接的第一和第二回路部分。 液冷结构经由第一回路部分供应冷却剂，热电阵列设置有第一和第二回路部分与阵列的第一和第二侧热接触。 热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。 通过第一和第二回路部分的冷却剂通过串联耦合的热交换器，其中一个用作散热器。

公开(公告)号：US08919143B2

公开(公告)日：2014-12-30

申请号：US13115390

申请日：2011-05-25

申请人： Eric A. Eckberg ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Howard V. Mahaney, Jr. ,  Roger R. Schmidt ,  Kenneth R. Schneebeli

发明人： Eric A. Eckberg ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Howard V. Mahaney, Jr. ,  Roger R. Schmidt ,  Kenneth R. Schneebeli

IPC分类号： F28D11/00 ,  F25D23/12 ,  H05K7/20

CPC分类号： H05K7/2079

摘要： An air-cooling apparatus is provided which includes an air-cooling wall cooling airflow passing through an electronics rack(s) of a data center. The air-cooling wall is disposed separate from and in spaced relation to the air inlet or air outlet side(s) of the electronics rack(s), and includes a wall panel support structure disposed separate from the electronics rack(s), which supports one or more slidable wall panels. The slidable wall panel(s) includes an air-to-liquid heat exchanger slidably supported and disposed in spaced relation to the air outlet or air inlet side of the electronics rack(s). The heat exchanger extracts heat from air passing across the heat exchanger and is slidable within the support structure in a direction transverse to the direction of airflow through the rack(s). Slidable support of the heat exchanger by the support structure facilitates access to the air outlet or air inlet sides of the electronics rack(s).

摘要翻译： 提供了一种空气冷却装置，其包括通过数据中心的电子机架的冷却空气的冷却壁。 空气冷却壁与电子机架的空气入口侧或空气出口侧分开设置并且与空气出口侧分开设置，并且包括与电子机架分离设置的壁板支撑结构， 支撑一个或多个可滑动的墙板。 可滑动壁板包括可滑动地支撑并设置成与电子机架的空气出口或空气入口侧间隔开的空气 - 液体热交换器。 热交换器从穿过热交换器的空气中提取热量，并且可以在支撑结构内沿横向于穿过机架的气流方向的方向滑动。 通过支撑结构的热交换器的可滑动支撑件便于进入电子​​机架的空气出口或空气入口侧。

公开(公告)号：US20110056675A1

公开(公告)日：2011-03-10

申请号：US12556040

申请日：2009-09-09

申请人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, JR.

发明人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, JR.

IPC分类号： G05D23/00 ,  F28F13/00

CPC分类号： H05K7/20709 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20736 ,  H05K7/20763 ,  H05K7/2079

摘要： Apparatuses and methods are presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies.

摘要翻译： 提出了通过一个或多个液冷电子机架来调节冷却剂流动阻力的装置和方法。 流量限制器与热交换组件的多个热交换管部分相关联地使用，或者与供给多个热交换组件的多个冷却剂供应管线或冷却剂返回管路相关联地使用。 与相应的热交换管部分（或相应的热交换组件）相关联的流量限制器设置在管部分（或热交换组件）的冷却剂通道入口或冷却剂通道出口处。 这些流量限制器通过热交换管部分或通过热交换组件来调节冷却剂流动阻力，以通过调整冷却剂流量来增强管部分内部或通过热交换组件的整体热传递。 在一个实施例中，流量限制器定制跨越多个热交换管部分或跨多个热交换组件的冷却剂流量分配差。

公开(公告)号：US09480186B2

公开(公告)日：2016-10-25

申请号：US11958528

申请日：2007-12-18

申请人： Steven J. Ahladas ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Prabjit Singh ,  Gerard V. Weber, Jr.

发明人： Steven J. Ahladas ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Prabjit Singh ,  Gerard V. Weber, Jr.

IPC分类号： H05K5/00 ,  H05K7/20

CPC分类号： H05K7/20745 ,  H05K7/20736

摘要： Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly.

摘要翻译： 提供了用于促进电子机架的空气冷却的装置和方法。 该装置包括瓦片组件，温度传感器和控制器。 瓦片组件邻近电子机架布置，并且包括穿孔瓦片和与穿孔瓦片相关联的一个或多个可控空气移动装置，用于使空气移动穿过穿孔瓦片。 温度传感器被定位成用于感测电子机架附近或外部的空气温度，并且控制器耦合到瓦片组件和温度传感器，以控制空气移动装置的操作。 基于感测的空气温度调节通过瓦片组件的气流，从而有助于电子机架的空气冷却。 在一个实施例中，瓦片组件是地板砖组件，其中空气 - 液体热交换器设置在穿孔瓦片和空气移动装置之间，用于冷却通过地板瓦片组件的空气。

公开(公告)号：US09045995B2

公开(公告)日：2015-06-02

申请号：US13103233

申请日：2011-05-09

申请人： David P. Graybill ,  Allan R. Hoeft ,  Madhusudan K. Iyengar ,  Donald W. Porter ,  Enrico A. Romano ,  Roger R. Schmidt ,  Gerard V. Weber, Jr.

发明人： David P. Graybill ,  Allan R. Hoeft ,  Madhusudan K. Iyengar ,  Donald W. Porter ,  Enrico A. Romano ,  Roger R. Schmidt ,  Gerard V. Weber, Jr.

IPC分类号： F01D15/10 ,  F02C6/00 ,  H02K7/18 ,  H02P9/04 ,  F02B63/04 ,  F03G7/08 ,  F03B13/00 ,  F03B13/10 ,  F01D15/08

CPC分类号： F01D15/10 ,  F01D15/08 ,  F03B13/00

摘要： An electronics rack with a cooling apparatus and a liquid-coolant-driven, electricity-generating system. The generating system includes a housing coupled in fluid communication with a fluid transport pipe of the cooling apparatus, an impeller disposed within the housing and positioned to turn with flow of fluid across the impeller, one or more magnetic structures disposed to turn with turning of the impeller, and an electrical circuit. Electricity is generated for the electrical circuit with turning of the one or more magnetic structures, and is supplied to an electrical load disposed within or associated with the electronics rack.

摘要翻译： 具有冷却装置和液体冷却剂驱动的发电系统的电子机架。 所述发电系统包括与所述冷却装置的流体输送管道流体连通的壳体，设置在所述壳体内并且被定位成随着流过所述叶轮的流体而转动的叶轮，一个或多个磁性结构， 叶轮和电路。 通过一个或多个磁性结构的转动为电路产生电，并且被提供给设置在电子机架中或与电子机架相关联的电负载。

公开(公告)号：US08077462B2

公开(公告)日：2011-12-13

申请号：US12552479

申请日：2009-09-02

申请人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, Jr.

发明人： Wayne A. Barringer ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  James J. Steffes ,  Gerard V. Weber, Jr.

IPC分类号： H05K7/20

CPC分类号： H05K7/20781 ,  H05K7/2079 ,  H05K7/20818 ,  Y10T29/4935

摘要： A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door.

摘要翻译： 提供了一种冷却装置和方法，其包括空气 - 液体热交换器和系统冷却剂入口和出口集气室，其沿着门的边缘安装到电子机架门，远离铰接安装到机架的边缘。 增压室与热交换器流体连通，分别包括入口和出口。 冷却剂供应和返回软管设置在电子机架上方，并将进气室连接到冷却剂供应集管，并将出口压力室连接到冷却剂返回集管。 软管足够长且灵活以打开或关闭门。 应力消除结构连接到门的顶部，并且固定地夹紧供应和返回软管，以在门的打开或关闭期间将软管端部处的连接联接器上的压力释放到通风口入口和出口。

公开(公告)号：US08804334B2

公开(公告)日：2014-08-12

申请号：US13115404

申请日：2011-05-25

申请人： Eric A. Eckberg ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Howard V. Mahaney, Jr. ,  Roger R. Schmidt ,  Kenneth R. Schneebeli

发明人： Eric A. Eckberg ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Howard V. Mahaney, Jr. ,  Roger R. Schmidt ,  Kenneth R. Schneebeli

IPC分类号： H05K7/20 ,  B23P15/26

CPC分类号： B23P15/26 ,  H05K7/20718 ,  H05K7/2079 ,  H05K7/20818 ,  Y10T29/4935

摘要： An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

摘要翻译： 提供了一种空气冷却装置，其包括用于保持两个或更多个彼此相邻的固定关系的独立电子机架的固定机构，以及尺寸设计成跨越机架的空气入口侧或空气出口侧的多齿条门。 固定机构使电子机架与其空气入口侧面对第一方向固定，并且空气出口侧面向第二方向。 门包括具有气流开口的门框。 气流开口有助于通过电子机架进入或流出气流，并且门还包括由门框架支撑的空气对液体热交换器，并且设置成使流过气流开口的空气穿过热交换器。 在操作中，热交换器从通过分离的电子机架的空气中提取热量。

公开(公告)号：US07639499B1

公开(公告)日：2009-12-29

申请号：US12168259

申请日：2008-07-07

申请人： Levi A. Campbell ,  Richard C. Chu ,  Martin J. Crippen ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Martin J. Crippen ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772

摘要： Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.

摘要翻译： 提供了设备和方法，以便于液体冷却设置在电子机架内的电子子系统机架的一个或多个部件。 该设备包括机架级冷却剂歧管组件和至少一个可移动底盘级歧管组件。 机架级冷却剂歧管组件包括机架级入口歧管和机架级出口歧管，并且每个可移动底盘级歧管组件包括与机架级入口歧管流体连通地联接的底盘级冷却剂入口歧管， 以及与所述齿条级出口歧管流体连通地联接的底盘级冷却剂出口歧管。 底盘级歧管子组件可滑动地联接到电子机架，以便于接近电子子系统底盘的一个或多个可拆卸部件。 在一个实施例中，电子系统底盘是具有多个可移除刀片的多刀片中心系统，每个刀片是电子子系统。

公开(公告)号：US20120254400A1

公开(公告)日：2012-10-04

申请号：US13077578

申请日：2011-03-31

申请人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Eren Kursun ,  Roger R. Schmidt

发明人： Madhusudan K. Iyengar ,  Vinod Kamath ,  Eren Kursun ,  Roger R. Schmidt

IPC分类号： G06F15/173

CPC分类号： G06F9/5094 ,  Y02D10/22

摘要： A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.

摘要翻译： 改进具有异构计算云的数据中心运行的系统可能包括监视组件以跟踪数据中心气候控制和数据中心内的个别异构计算云运行参数。 该系统还可以包括控制器，其基于由监视组件生成的数据来调节各个异构计算云和数据中心气候控制，以改善各个异构计算云的操作性能以及数据中心的操作性能。 该系统可以进一步包括溢出计算云以接收单个异构计算云的额外的工作量，而不违反个别的异构计算云合同。