公开(公告)号：US20160351766A1

公开(公告)日：2016-12-01

申请号：US15170411

申请日：2016-06-01

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI ,  Teruhito AZUMA

IPC: H01L33/60 ,  H01L33/58

Abstract: A light emitting device includes a light transmissive member; a first reflector covering outer peripheral faces of the light transmissive member; a light emitting element disposed under the light transmissive member; a light guiding member covering at least a portion of the light transmissive member, a portion of a lower face of the first reflector, and at least some portions of lateral faces of the light emitting element; and a second reflector covering a portion of the lower face of the first reflector that is exposed from the light guiding member and is located outward of the light guiding member.

Abstract translation: 发光装置包括透光构件; 覆盖所述透光构件的外周面的第一反射器; 设置在所述透光构件下方的发光元件; 覆盖所述透光构件的至少一部分的导光构件，所述第一反射器的下表面的一部分和所述发光元件的侧面的至少一些部分; 以及第二反射器，其覆盖从所述导光部件露出并位于所述导光部件的外侧的所述第一反射体的下表面的一部分。

公开(公告)号：US20150207046A1

公开(公告)日：2015-07-23

申请号：US14561626

申请日：2014-12-05

Applicant: NICHIA CORPORATION

Inventor： Takeshi IKEGAMI ,  Tadao HAYASHI ,  Hiroto TAMAKI

IPC: H01L33/50 ,  H01L33/38 ,  H01L27/15 ,  H01L33/56

CPC classification number: H01L33/502 ,  H01L33/486 ,  H01L33/501 ,  H01L33/505 ,  H01L33/508 ,  H01L2224/16225 ,  H01L2933/0033 ,  H01L2933/0041

Abstract: Provided is a light emitting device having a phosphor layer on a surface of a semiconductor light emitting element and reducing unevenness in light distribution color, and a method of manufacturing the same. A light emitting device 100 includes a light emitting element 20 with a supporting body which is composed of a semiconductor light emitting element 1 and a supporting body 10, and a phosphor layer 7 which continuously covers an upper surface and side surfaces of the semiconductor light emitting element 1, and side surfaces of the supporting body 10. The phosphor layer 7 is configured such that at least a lower portion of the side surface of the supporting body 10 is thinner than the upper surface and the side surface of the semiconductor light emitting element 1. Such a configuration of the phosphor layer can be formed by applying a spray-coating of a slurry containing phosphor particles and a thermosetting resin in a solvent on the semiconductor light emitting element 1 side of the light emitting element 20 which has the supporting body.

Abstract translation: 提供一种在半导体发光元件的表面上具有荧光体层并减少分布颜色不均匀的发光器件及其制造方法。 发光器件100包括具有由半导体发光元件1和支撑体10构成的支撑体的发光元件20和连续地覆盖半导体发光元件1和支撑体10的上表面的发光元件20和发射 元件1和支撑体10的侧表面。荧光体层7被构造成使得支撑体10的侧表面的至少下部比半导体发光元件的上表面和侧表面更薄 荧光体层的这种构造可以通过在具有支撑体的发光元件20的半导体发光元件1侧上施加含有荧光体颗粒和热固性树脂的浆料的喷涂而形成 。

公开(公告)号：US20210202808A1

公开(公告)日：2021-07-01

申请号：US17200227

申请日：2021-03-12

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI

IPC: H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54

Abstract: A method of manufacturing a light emitting device includes: providing two light emitting elements disposed on a first surface of a light transmissive member; disposing a light guide member covering a part of the first surface of the light transmissive member, and lateral surfaces of the two light emitting elements; disposing a light reflective member covering the two light emitting elements, a second surface of the light transmissive member, and the light guide member, the second surface of the light transmissive member being opposite to the first surface; and cutting the light reflective member and/or the light transmissive member between the two light emitting elements.

公开(公告)号：US20210135065A1

公开(公告)日：2021-05-06

申请号：US17119570

申请日：2020-12-11

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/48 ,  H01L33/60

Abstract: A method of manufacturing a light emitting device includes: providing a light emitting element including a light extraction surface, an electrode-formed surface on a side opposite to the light extraction surface, lateral surfaces positioned between the light extraction surface and the electrode-formed surface, and a pair of electrodes on the electrode-formed surface; providing a covering member including a lens portion and a first recess on a side different from the lens portion; disposing the light emitting element on a bottom surface of the first recess, with the light extraction surface and the bottom surface of the first recess facing each other; and forming a reflective member in the first recess to cover the lateral surfaces of the light emitting element while at least a part of the pair of electrodes is exposed from the reflective member.

公开(公告)号：US20210080786A1

公开(公告)日：2021-03-18

申请号：US17091061

申请日：2020-11-06

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI

IPC: G02F1/13357 ,  H01L25/075 ,  F21V9/08 ,  G09G3/36 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting module with a reduced thickness is provided.
A method of manufacturing a light emitting module sequentially includes: providing a light guiding plate having a first main surface being a light emitting surface, and a second main surface on the side opposite to the first main surface; providing a plurality of light emitting elements on the light guiding plate; and forming a wiring electrically connecting the plurality of light emitting elements. A light emitting module includes: a light guiding plate having a first main surface and a second main surface; a plurality of wavelength conversion parts disposed at the second main surface of the light guiding plate so as to be spaced apart from each other; a plurality of light emitting elements respectively bonded to the plurality of wavelength conversion parts; and a wiring connected to the plurality of light emitting elements.

公开(公告)号：US20200379165A1

公开(公告)日：2020-12-03

申请号：US16885254

申请日：2020-05-27

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI

IPC: F21V8/00 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting module includes a light guide plate including a first face, a second face opposing the first face, and a through part penetrating between the first face and the second face, a light emitting device disposed in the through part on a second face side, a light transmissive member disposed on the light emitting device in the through hole on a first face side and between the light emitting device and a lateral wall of the through part, and a first light reflecting member disposed between an upper face of the light emitting device and the light transmissive member while being in contact with the upper face of the light emitting device.

公开(公告)号：US20200176651A1

公开(公告)日：2020-06-04

申请号：US16780021

申请日：2020-02-03

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI ,  Teruhito AZUMA

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/56 ,  H01L33/54

Abstract: A method for manufacturing a light emitting device includes: forming a first reflector that covers outer peripheral faces of a light transmissive member; forming a light guiding member covering at least a portion of the light transmissive member, a portion of a lower face of the first reflector, and at least some portions of lateral faces of a light emitting element disposed under the light transmissive member; and forming a second reflector covering a portion of the lower face of the first reflector that is exposed from the light guiding member and located outward of the light guiding member.

公开(公告)号：US20180175239A1

公开(公告)日：2018-06-21

申请号：US15849123

申请日：2017-12-20

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI

IPC: H01L33/00 ,  H01L33/32 ,  H01L33/60 ,  H01L33/50 ,  H01L33/46 ,  H01L33/38

Abstract: A method for manufacturing a light-emitting device includes: providing a light-transmissive member comprising: a base portion, and a projecting portion on a first surface side of the base portion; providing a light-emitting element that has a main emitting surface and an electrode formation surface opposite to the main emitting surface; disposing the light-emitting element on the projecting portion of the light-transmissive member such that the main emitting surface of the light-emitting element faces an upper surface of the projecting portion of the light-transmissive member; and forming a light-reflective member that covers at least one of (i) lateral surfaces of the light-emitting element, and/or (ii) lateral surfaces of the projecting portion of the light-transmissive member.

公开(公告)号：US20180145229A1

公开(公告)日：2018-05-24

申请号：US15875226

申请日：2018-01-19

Applicant: NICHIA CORPORATION

Inventor： Tadao HAYASHI

IPC: H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L33/54

Abstract: A composite board is provided with a board and a covering member. The board includes a base made of ceramics, first wiring provided on an upper surface of the base, and second wiring provided on a lower surface of the base and electrically connected to the first wiring. The covering member covers the base such that the first wiring and the second wiring are exposed.

公开(公告)号：US20170200868A1

公开(公告)日：2017-07-13

申请号：US15468540

申请日：2017-03-24

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Takeshi IKEGAMI ,  Tadaaki IKEDA ,  Tadao HAYASHI ,  Hiroto TAMAKI

IPC: H01L33/48 ,  H01L25/13 ,  H01L33/54 ,  H01L33/38 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L25/13 ,  H01L33/387 ,  H01L33/502 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A light emitting device includes a base body, a light emitting element and a sealing member. The base body includes a base material and a pair of connection terminals on at least a first main surface of the base material. The light emitting element is connected to the connection terminals. The sealing member seals the light emitting element. The sealing member includes a light transmissive member disposed on an upper surface of the light emitting element, and a light shielding member sealing an end surface of the light emitting element and an end surface of the light transmissive member. The base material has a linear expansion coefficient within ±10 ppm/° C. of a linear expansion coefficient of the light emitting element.