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公开(公告)号:US20210143045A1
公开(公告)日:2021-05-13
申请号:US16681215
申请日:2019-11-12
Applicant: Palo Alto Research Center Incorporated
Inventor: Yunda Wang , Jengping Lu , Qian Wang , Norine E. Chang
IPC: H01L21/683 , H01L33/32 , H01L33/62 , H01L25/075
Abstract: Transfer elements include an adhesion element having a higher Young's modulus at a lower temperature and a lower Young's modulus at a higher temperature. Heating elements are operable to change an operating temperature of each adhesion element in response to an input. A controller is coupled to provide the inputs to the heating elements to cause a change in temperature at least between the higher and lower temperature. The change in temperature causes the transfer elements to selectably hold objects to and release the objects in response to changes between the higher and lower Young's moduli of transfer elements
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公开(公告)号:US20200207015A1
公开(公告)日:2020-07-02
申请号:US16237464
申请日:2018-12-31
Applicant: Xerox Corporation , Palo Alto Research Center Incorporated
Inventor: Ashish V. Pattekar , Warren Jackson , Anne Plochowietz , Jengping Lu , Jamie Kalb , Christopher L. Chua , Carolyn Moorlag , Eugene Beh
IPC: B29C64/171 , B29C64/112 , B29C64/194 , B29C64/209 , B29C64/268 , B29C64/35
Abstract: A method for providing high-speed three dimensional (3D) printing is provided. The method includes producing at least one three dimensional (3D) printed part. Producing the 3D part includes continuously constructing to extend outwardly a diameter of a rotating cylindrical core via continuous deposition of a layer, and defining a first pattern in the continuously deposited layer corresponding to a cross-section of the at least one 3D printed part.
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公开(公告)号:US11848371B2
公开(公告)日:2023-12-19
申请号:US16920249
申请日:2020-07-02
Applicant: Palo Alto Research Center Incorporated
Inventor: Thomas Wunderer , Jengping Lu , Noble M. Johnson
IPC: H01L29/778 , H01L29/66 , H01L29/20
CPC classification number: H01L29/66462 , H01L29/2003 , H01L29/7786 , H01L29/7787 , H01L29/7788
Abstract: A transistor includes a first layer comprising a group III-nitride semiconductor. A second layer comprising a group III-nitride semiconductor is disposed over the first layer. A third layer comprising a group III-nitride semiconductor is disposed over the second layer. An interface between the second layer and the third layer form a polarization heterojunction. A fourth layer comprising a group III-nitride semiconductor is disposed over the third layer. An interface between the third layer and the fourth layer forms a pn junction. A first electrical contact pad is disposed on the fourth layer. A second electrical contact pad is disposed on the third layer. A third electrical contact pad is electronically coupled to bias the polarization heterojunction.
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公开(公告)号:US11820121B2
公开(公告)日:2023-11-21
申请号:US17462043
申请日:2021-08-31
Applicant: Palo Alto Research Center Incorporated
Inventor: Robert A. Street , Jengping Lu
IPC: B41F13/08 , B41J2/34 , B41J2/335 , B41C1/10 , B41F7/08 , B41F7/26 , B41M1/06 , B41F7/02 , B41F31/00 , B41F31/13 , B41F31/08 , B41N3/03
CPC classification number: B41F13/08 , B41C1/1041 , B41F7/02 , B41F7/08 , B41F7/26 , B41F31/002 , B41F31/08 , B41F31/13 , B41J2/33535 , B41J2/34 , B41M1/06 , B41N3/03 , B41C1/1033 , B41P2227/70
Abstract: A heating circuit having an array of switching heating elements (e.g., field effect transistors, thin film transistors) provides a transient heat pattern over a surface (e.g., substrate, imaging member surface, transfer roll surface) moving relative to the heating circuit, to produce a pixelated heat image and heat a target pattern on the surface. Heat is generated by current flow in the heating elements, and the power developed by the heating circuit is the product of source-drain voltage and current in the channel. Digital addressing may accomplished by matrix addressing the array. Current may be supplied along data address lines by an external voltage controlled by digital electronics understood by a skilled artisan to provide the desired heat at a respective heating element pixels addressed by a specific gate line. The circuit may include a current return line that may be low resistance, for example, by using a 2-dimensional mesh.
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公开(公告)号:US11787167B2
公开(公告)日:2023-10-17
申请号:US17579381
申请日:2022-01-19
Applicant: Palo Alto Research Center Incorporated , Xerox Corporation
Inventor: David K. Biegelsen , Joerg Martini , Gregory B. Anderson , Jengping Lu , Palghat S. Ramesh , Anne Plochowietz
IPC: B41M1/06 , B41F7/02 , B41F13/08 , B41J2/34 , B41J2/335 , B41C1/10 , B41F7/08 , B41F7/26 , B41F31/00 , B41F31/13 , B41F31/08 , B41N3/03
CPC classification number: B41F13/08 , B41C1/1041 , B41F7/02 , B41F7/08 , B41F7/26 , B41F31/002 , B41F31/08 , B41F31/13 , B41J2/33535 , B41J2/34 , B41M1/06 , B41N3/03 , B41C1/1033 , B41P2227/70
Abstract: Ink-based digital printing systems useful for ink printing include a secondary roller having a rotatable reimageable surface layer configured to receive fountain solution. The fountain solution layer is patterned on the secondary roller and then partially transferred to an imaging blanket, where the fountain solution image is inked. The resulting ink image may be transferred to a print substrate. To achieve a very high-resolution (e.g., 1200-dpi, over 900-dpi) print with these secondary roller configurations, an equivalent very high-resolution fountain solution image needs to be transferred from the secondary roller onto the imaging blanket. To increase the resolution of the image on the secondary roller, examples include a textured surface layer added to the secondary roller for contact angle pinning the fountain solution on the roll. Approaches to introduce a micro-structure onto the surface layer of the secondary roller, and also superoleophobic surface coatings are described.
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公开(公告)号:US11667074B2
公开(公告)日:2023-06-06
申请号:US16236172
申请日:2018-12-28
Applicant: Palo Alto Research Center Incorporated , Xerox Corporation
Inventor: Anne Plochowietz , Ashish V. Pattekar , Jengping Lu , Nan-Xing Hu
IPC: B29C64/147 , B29C64/321 , B29C64/205 , G03G15/22
CPC classification number: B29C64/147 , B29C64/205 , B29C64/321 , G03G15/224
Abstract: Systems and methods for constructing 3-dimensional (3D) parts are disclosed. A printing system may include a deposition system configured to print a plurality of 2-dimensional (2D) layers onto a plurality of carrier sheets. The printing system also includes a transferring system configured to transfer a 2D layer from a carrier sheet of the plurality of carrier sheets, onto the 3D part. The 3D part may be located on a base substrate. The printing system further includes a feed system configured to provide the plurality of carrier sheets from the deposition system to the transfer system in a successive fashion while maintaining the directionality of printing in the deposition and transferring systems.
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公开(公告)号:US20220289561A1
公开(公告)日:2022-09-15
申请号:US17196329
申请日:2021-03-09
Applicant: PALO ALTO RESEARCH CENTER INCORPORATED
Inventor: Jengping Lu
IPC: B81B7/00 , H01L31/0376 , H01L31/108 , H01L29/40 , H01L29/786
Abstract: A device includes a first stage having a first optical switch, a first transistor connected to the first optical switch, and a second transistor connected to the first optical switch and the first transistor. The device also includes a second stage having a second optical switch, a third transistor connected to the second transistor and the second optical switch, and a fourth transistor connected to the second transistor, the second optical switch, and the third transistor.
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公开(公告)号:US20220153576A1
公开(公告)日:2022-05-19
申请号:US17665305
申请日:2022-02-04
Applicant: Palo Alto Research Center Incorporated
Inventor: Anne Plochowietz , Bradley Rupp , Jengping Lu , Julie A. Bert , Lara S. Crawford , Sourobh Raychaudhuri , Eugene M. Chow , Matthew Shreve , Sergey Butylkov
Abstract: Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.
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公开(公告)号:US20220126509A1
公开(公告)日:2022-04-28
申请号:US17568641
申请日:2022-01-04
Applicant: Xerox Corporation , Palo Alto Research Center Incorporated
Inventor: Ashish V. Pattekar , Warren Jackson , Anne Plochowietz , Jengping Lu , Jamie Kalb , Christopher L. Chua , Carolyn Moorlag , Eugene Beh
IPC: B29C64/171 , B29C64/194 , B29C64/112 , B29C64/209 , B29C64/35 , B29C64/268 , B29C64/241 , B29C64/386 , B29C64/393 , B29C64/40 , B29C64/245
Abstract: A printing system for producing at least one three dimensional (3D) printed part is described. The printing system includes a deposition system configured to continuously deposit a layer onto a cylinder to outwardly extend a diameter of the cylinder, wherein the layer comprises a first pattern. The printing system also includes a rotating system configured to rotate the cylinder, and a control system configured to synchronize the deposition system with the cylinder.
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公开(公告)号:US20220097295A1
公开(公告)日:2022-03-31
申请号:US17532817
申请日:2021-11-22
Applicant: Palo Alto Research Center Incorporated , Xerox Corporation
Inventor: Anne Plochowietz , Ashish V. Pattekar , Jengping Lu , Nan-Xing Hu
IPC: B29C64/147 , B29C64/321 , B29C64/205 , G03G15/22
Abstract: Systems and methods for constructing 3-dimensional (3D) parts are disclosed. A printing system may include a deposition system configured to print a plurality of 2-dimensional (2D) layers onto a plurality of carrier sheets. The printing system also includes a transferring system configured to transfer a 2D layer from a carrier sheet of the plurality of carrier sheets, onto the 3D part. The 3D part may be located on a base substrate. The printing system further includes a feed system configured to provide the plurality of carrier sheets from the deposition system to the transfer system in a successive fashion while maintaining the directionality of printing in the deposition and transferring systems.
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