公开(公告)号：US20240014107A1

公开(公告)日：2024-01-11

申请号：US18470083

申请日：2023-09-19

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Hiroaki MATSUBARA ,  Tomohira KIKUCHI ,  Taro NISHIOKA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/64

CPC classification number: H01L23/49562 ,  H01L23/49503 ,  H01L23/49537 ,  H01L24/32 ,  H01L24/48 ,  H01L23/645 ,  H01L2224/48247 ,  H01L2224/32245 ,  H01L2924/13091 ,  H01L2924/19042

Abstract: A semiconductor device includes a plurality of conductive members including a die pad, a first semiconductor element and a second semiconductor element each located on the die pad, an insulating element electrically connected to the first semiconductor element and the second semiconductor element and insulating the first semiconductor element and the second semiconductor element from each other, and an insulating substrate interposed between the die pad and the insulating element and bonded to the die pad. The insulating element is bonded to the insulating substrate.

公开(公告)号：US20230402354A1

公开(公告)日：2023-12-14

申请号：US18249005

申请日：2021-10-01

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Shingo MATSUMARU

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/18 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L25/18 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48456 ,  H01L2224/48091 ,  H01L23/49555 ,  H01L2224/4846

Abstract: A semiconductor device includes a conductive support member with first and second die pads, a first semiconductor element on the first die pad, a second semiconductor element on the second die pad for forming a first output-side circuit, and a sealing resin. The first semiconductor element includes a circuit part forming an input-side circuit, and an insulating part that transmits a signal between the input-side and the first output-side circuits, while providing electrical insulation between the input-side and the first output-side circuits. The sealing resin includes first and second side faces spaced apart in an x direction and a third side face perpendicular to a y direction. The conductive support member includes input-side terminals protruding from the first side face and first output-side terminals protruding from the second side face. The conductive support member is not exposed on the third side face.

公开(公告)号：US20220077037A1

公开(公告)日：2022-03-10

申请号：US17465984

申请日：2021-09-03

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Hiroaki MATSUBARA ,  Tomohira KIKUCHI

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor device includes a conductive support member, a first semiconductor element, and a second semiconductor element. The conductive support member includes a first die pad and a second die pad separated from each other in a first direction. The first die pad and the second die pad overlap each other when viewed along the first direction. The first die pad has a first main surface mounting the first semiconductor element, and a first back surface opposing the first main surface. The second die pad has a second main surface mounting the second semiconductor element, and a second back surface opposing the second main surface. When viewed along a second direction, a distance in the first direction between the first back surface and the second back surface is larger than a distance in the first direction between the first main surface and the second main surface.

公开(公告)号：US20180026611A1

公开(公告)日：2018-01-25

申请号：US15652514

申请日：2017-07-18

Applicant: Rohm Co., Ltd.

Inventor： Toshiyuki ISHIKAWA ,  Daiki YANAGISHIMA ,  Yoshizo OSUMI

IPC: H03K3/037 ,  H03K19/20 ,  B60L11/18

CPC classification number: H03K3/037 ,  B60L50/51 ,  H03K17/61 ,  H03K17/687 ,  H03K17/691 ,  H03K19/20 ,  H04L25/0266 ,  H04L25/493

Abstract: A signal transmission circuit which transmits N (N is a natural number of 2 or more) input signals includes a transmission signal generation portion, 2N transmission portions and an output portion. The transmission signal generation portion generates 2N transmission signals according to the N input signals. The 2N transmission portions respectively transmit the 2N transmission signals output from the transmission signal generation portion while performing electrical insulation. The output portion generates and outputs, based on the 2N transmission signals transmitted by the 2N transmission portions, N output signals that respectively indicate the N input signals. The transmission signal generation portion generates a pulse according to the N input signals and incorporates the pulse in only one of the 2N transmission signals at the same time.