Abstract:
A high performance fluid heat exchanger for cooling an electronic component which includes a housing having a base, a plurality of parallel fins in the housing, a center fed inlet connected to the housing opposite the base for supplying cooling fluid towards the base and toward the ends of the fins. A plate is positioned between the tops and bottoms of the fins and extends generally parallel to the base and extends towards but is spaced from the ends of the fins for providing a double cooling pass against the fins.
Abstract:
A high performance fluid heat exchanger for cooling an electronic component which includes a housing having a base heat transfer member, a plurality of parallel fins in the housing and center fed concentric inlet and outlet tubes connected to the housing opposite the base for supplying cooling fluid towards the base and to the ends of the fins.
Abstract:
A body having a bottom and first and second ends and a cavity therein. A plurality of substantially parallel spaced fins are positioned in the cavity. A liquid inlet is centrally positioned in the first end of the body and a liquid outlet is centrally positioned in the second end of the body where flowing cooling liquid between the fins from the first end to the second end with higher fluid flow between the fins in the center for preferentially cooling the center of the heat exchanger. A cross-sectional area of the liquid path in the body minimizes pressure drops and avoids abrupt direction changes and cross-sectional changes. The width, height and spacing of the fins may be varied to control the temperature of the areas in the bottom.
Abstract:
A pin fin heat exchanger is made by wrapping a thermally conductive wire having a coating thereon around a mandrel thereby forming a multilayer coil. The coating is fused together for holding the wires together. The method includes cutting a section out of the coil providing a plurality of generally parallel wires having first and second ends and placing the cut section between an object and a wall for transferring heat therebetween with the first ends engaging the object and the second ends engaging the wall. Thereafter the coating is removed from the wires such as by solvents. The ends of the wires may be soldered or may be lapped to provide a convex surface to provide good heat transfer.
Abstract:
A lubricant free low cost overload release clutch having a spring housing with an integral hub, a detector ring containing fixed detent bullets for engagement with springs in the housing on one side, and a bullet detent housing on the other side, together with spider cushion and shaft housing engaged for rotary turning with the bullet detent housing in response to the rotation of a shaft in the shaft housing. The release clutch responds to preset torque limits determined by spring tension. After a disengagement caused by excess torque, the clutch will reset by further rotation of the detent housing.
Abstract:
A fluid conduit connector assembly includes a connector having a body with an inner surface defining a fluid channel. The connector also includes an inlet region for flow of fluid into the fluid channel, and an outlet region for flow of fluid from the fluid channel. The connector further includes an axial alignment member outward of the body, and a pair of flexible tabs arranged generally circumferentially of the alignment member and outward of the body. The connector can be configured as a day-side connector, transfer member with check valve, and/or patient-side connector. An implementation includes a day-side connector, a patient-side connector, and a transfer member, each of which has a pair of flexible tabs. The pairs of tabs are configured such that the transfer member releasably couples the day-side and patient-side connectors. A method for aseptically connecting a fluid conduit is also disclosed.
Abstract:
A fluid conduit connector assembly includes a connector having a body with an inner surface defining a fluid channel. The connector also includes an inlet region for flow of fluid into the fluid channel, and an outlet region for flow of fluid from the fluid channel. The connector further includes an axial alignment member outward of the body, and a pair of flexible tabs arranged generally circumferentially of the alignment member and outward of the body. The connector can be configured as a day-side connector, transfer member with check valve, and/or patient-side connector. An implementation includes a day-side connector, a patient-side connector, and a transfer member, each of which has a pair of flexible tabs. The pairs of tabs are configured such that the transfer member releasably couples the day-side and patient-side connectors. A method for aseptically connecting a fluid conduit is also disclosed.
Abstract:
A fluid conduit connector assembly includes a connector having a body with an inner surface defining a fluid channel. The connector also includes an inlet region for flow of fluid into the fluid channel, and an outlet region for flow of fluid from the fluid channel. The connector further includes an axial alignment member outward of the body, and a pair of flexible tabs arranged generally circumferentially of the alignment member and outward of the body. The connector can be configured as a day-side connector, transfer member with check valve, and/or patient-side connector. An implementation includes a day-side connector, a patient-side connector, and a transfer member, each of which has a pair of flexible tabs. The pairs of tabs are configured such that the transfer member releasably couples the day-side and patient-side connectors. A method for aseptically connecting a fluid conduit is also disclosed.
Abstract:
A microelectromechanical system (MEMS) switch is provided which includes a multiple of three support arms extending from the periphery of a moveable electrode. In addition, MEMS switch includes a plurality of contact structures having portions extending into a space between a fixed electrode and the moveable electrode. In some cases, the relative arrangement of the support arms and the contact structures are congruent among three regions of the MEMS switch which collectively comprise the entirety of the fixed electrode and the entirety of the moveable electrode. In other embodiments, the contact structures may not be arranged congruently within the MEMS switch.
Abstract:
Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.