公开(公告)号：US09725300B2

公开(公告)日：2017-08-08

申请号：US15059630

申请日：2016-03-03

Applicant: Robert Bosch GmbH

Inventor： Heiko Stahl ,  Arnim Hoechst ,  Bernhard Gehl ,  Rolf Scheben ,  Benedikt Stein

IPC: H01L29/84 ,  B81B3/00

CPC classification number: B81B3/0086 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/04

Abstract: Measures for reducing parasitic capacitances in the layer structure of capacitive MEMS sensor elements, in which parasitic capacitances between bond pads for electrically contacting measuring capacitor electrodes and an electrically conductive layer lying underneath are reduced by these measures. The sensor structure having the measuring capacitor electrodes and bond pads of such MEMS components are in a layer structure on a semiconductor substrate. The carrier layer directly underneath the bond pad structure is uninterrupted in the bond pad region, and the layer structure includes at least one insulation layer by which at least one of the bond pads is electrically insulated from an electrically conductive layer lying underneath. At least one layer under the carrier layer is structured in the region of this bond pad, so that hollow spaces are situated in the layer structure underneath this bond pad, by which the parasitic capacitance between this bond pad and the conductive layer lying underneath is reduced. Alternatively/additionally, the material of the conductive layer in the region underneath this bond pad is replaced by electrically conductive material at least in the upper layer region, so that the insulation layer in the region of this bond pad is considerably thicker than outside the bond pad region.

公开(公告)号：US09516423B2

公开(公告)日：2016-12-06

申请号：US14391139

申请日：2013-03-05

Applicant: Robert Bosch GmbH

Inventor： Mike Daley ,  Rolf Scheben ,  Christoph Schelling

IPC: H04R25/00 ,  H04R17/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: H04R17/005 ,  B81B3/007 ,  B81B3/0086 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158

Abstract: The disclosure relates to a micro-electromechanical membrane arrangement with a substrate, which has a multiplicity of recesses on a surface, a first electrically conductive electrode layer, which is arranged on the surface of the substrate and has a multiplicity of first depressions coinciding with the recesses, and an electrically conductive membrane layer, which can be deflected in a direction perpendicular to the active surface of the substrate, is arranged over the first electrode layer and is kept at a distance therefrom by a first distance value.

Abstract translation: 本公开涉及具有基板的微机电膜装置，该基板在表面上具有多个凹槽，第一导电电极层设置在基板的表面上，并且具有多个与该基板一致的第一凹陷 凹部和可以在垂直于衬底的有源表面的方向上偏转的导电膜层布置在第一电极层的上方，并且与其保持距离第一距离值。

公开(公告)号：US20160280534A1

公开(公告)日：2016-09-29

申请号：US15059630

申请日：2016-03-03

Applicant: Robert Bosch GmbH

Inventor： Heiko Stahl ,  Arnim Hoechst ,  Bernhard Gehl ,  Rolf Scheben ,  Benedikt Stein

IPC: B81B3/00

CPC classification number: B81B3/0086 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/04

Abstract: Measures for reducing parasitic capacitances in the layer structure of capacitive MEMS sensor elements, in which parasitic capacitances between bond pads for electrically contacting measuring capacitor electrodes and an electrically conductive layer lying underneath are reduced by these measures. The sensor structure having the measuring capacitor electrodes and bond pads of such MEMS components are in a layer structure on a semiconductor substrate. The carrier layer directly underneath the bond pad structure is uninterrupted in the bond pad region, and the layer structure includes at least one insulation layer by which at least one of the bond pads is electrically insulated from an electrically conductive layer lying underneath. At least one layer under the carrier layer is structured in the region of this bond pad, so that hollow spaces are situated in the layer structure underneath this bond pad, by which the parasitic capacitance between this bond pad and the conductive layer lying underneath is reduced. Alternatively/additionally, the material of the conductive layer in the region underneath this bond pad is replaced by electrically conductive material at least in the upper layer region, so that the insulation layer in the region of this bond pad is considerably thicker than outside the bond pad region.

Abstract translation: 通过这些措施，降低电容式MEMS传感器元件的层结构中的寄生电容的措施，其中用于电接触测量电容器电极的接合焊盘和位于其下的导电层的寄生电容被减小。 具有测量电容器电极和这些MEMS部件的接合焊盘的传感器结构在半导体衬底上具有层结构。 接合焊盘结构正下方的载体层在接合焊盘区域中不间断，并且层结构包括至少一个绝缘层，通过该绝缘层，至少一个接合焊盘与位于其下的导电层电绝缘。 载体层下面的至少一层被构造在该接合焊盘的区域中，使得中空空间位于该接合焊盘下方的层结构中，通过该空隙，该接合焊盘和位于其下的导电层之间的寄生电容减小 。 或者/另外，至少在上层区域中，导电层在该接合焊盘下面的区域中的材料被导电材料代替，使得在该焊盘区域内的绝缘层比粘合层外部显着地厚 垫区域。

公开(公告)号：US09369809B2

公开(公告)日：2016-06-14

申请号：US14133134

申请日：2013-12-18

Applicant: Robert Bosch GmbH

Inventor： Jochen Zoellin ,  Ricardo Ehrenpfordt ,  Rolf Scheben

IPC: H04R19/02 ,  H04R19/00 ,  B06B1/02 ,  H04R15/00 ,  H04R17/00 ,  B81B5/00 ,  H04R9/06 ,  H04R11/02

CPC classification number: H04R19/005 ,  B06B1/0292 ,  B81B5/00 ,  B81B2201/0264 ,  B81B2203/05 ,  H04R9/06 ,  H04R11/02 ,  H04R15/00 ,  H04R17/00 ,  H04R19/02 ,  H04R2201/003 ,  H04R2217/03 ,  H04R2460/03

Abstract: A MEMS component for generating pressure pulses is provided, its micromechanical structure including at least three function levels: a first function level in which at least one stationary trench structure is implemented, a second function level, which is implemented above the first function level and includes at least one triggerable displacement element as well as through-openings as pressure outlet openings, the displacement element protruding into the trench structure and being movable in parallel with the function levels, whereby positive and negative pressure pulses are generated, and a third function level, which is implemented above the second function level and includes at least one triggerable cover element for at least one part of the pressure outlet openings in the second function level.

Abstract translation: 提供了用于产生压力脉冲的MEMS部件，其微机械结构包括至少三个功能级别：实现至少一个固定沟槽结构的第一功能级别，其在第一功能级别上方实现的第二功能级别， 至少一个可触发位移元件以及作为压力出口开口的通孔，所述位移元件突出到所述沟槽结构中并且能够与所述功能水平平行地移动，由此产生正和负压脉冲，并且产生第三功能水平， 其实现在第二功能水平以上并且包括用于处于第二功能水平的压力出口开口的至少一部分的至少一个可触发盖元件。

公开(公告)号：US09112108B2

公开(公告)日：2015-08-18

申请号：US13872948

申请日：2013-04-29

Applicant: Robert Bosch GmbH

Inventor： Rolf Scheben ,  Mirko Hattass

IPC: H01L35/30 ,  H01L35/34

CPC classification number: H01L35/30

Abstract: An energy source for supplying an autonomous electrical load system with electrical energy includes a thermogenerator device configured to generate a thermoelectric voltage to be fed to the electrical load system. The thermogenerator device is under the influence of a temperature difference between a warmer first thermal coupling device and a colder second thermal coupling device. The energy source further includes a microfluidic cooling device having a heat-absorption region, a heat-emission region, and a closed microfluidic circulation system configured to circulate a fluid between the heat-absorption region and the heat-emission region. The heat-absorption region has a thermally conductive connection to the second thermal coupling device. The heat-emission region is configured to be coupled to an external heat sink using a thermally conductive connection such that the circulating fluid carries thermal energy away from the second thermal coupling device and transports the thermal energy to the external heat sink.

Abstract translation: 用于向自主电力负载系统提供电能的能源包括热发生器装置，其被配置为产生要馈送到电负载系统的热电电压。 热发生器装置受到较暖的第一热耦合装置和较冷的第二热耦合装置之间的温差的影响。 能量源还包括具有吸热区域，发热区域和被配置为在热吸收区域和发热区域之间循环流体的闭合微流体循环系统的微流体冷却装置。 吸热区域具有与第二热耦合装置的导热连接。 发热区域被配置为使用导热连接件耦合到外部散热器，使得循环流体将热能携带离开第二热耦合装置并将热能传送到外部散热器。

公开(公告)号：US20130284227A1

公开(公告)日：2013-10-31

申请号：US13872948

申请日：2013-04-29

Applicant: ROBERT BOSCH GMBH

Inventor： Rolf Scheben ,  Mirko Hattass

IPC: H01L35/30

CPC classification number: H01L35/30

Abstract: An energy source for supplying an autonomous electrical load system with electrical energy includes a thermogenerator device configured to generate a thermoelectric voltage to be fed to the electrical load system. The thermogenerator device is under the influence of a temperature difference between a warmer first thermal coupling device and a colder second thermal coupling device. The energy source further includes a microfluidic cooling device having a heat-absorption region, a heat-emission region, and a closed microfluidic circulation system configured to circulate a fluid between the heat-absorption region and the heat-emission region. The heat-absorption region has a thermally conductive connection to the second thermal coupling device. The heat-emission region is configured to be coupled to an external heat sink using a thermally conductive connection such that the circulating fluid carries thermal energy away from the second thermal coupling device and transports the thermal energy to the external heat sink.

Abstract translation: 用于向自主电力负载系统提供电能的能源包括热发生器装置，其被配置为产生要馈送到电负载系统的热电电压。 热发生器装置受到较暖的第一热耦合装置和较冷的第二热耦合装置之间的温差的影响。 能量源还包括具有吸热区域，发热区域和被配置为在热吸收区域和发热区域之间循环流体的闭合微流体循环系统的微流体冷却装置。 吸热区域具有与第二热耦合装置的导热连接。 发热区域被配置为使用导热连接件耦合到外部散热器，使得循环流体将热能携带离开第二热耦合装置并将热能传送到外部散热器。

公开(公告)号：US20250033952A1

公开(公告)日：2025-01-30

申请号：US18769480

申请日：2024-07-11

Applicant: Robert Bosch GmbH

Inventor： Daniel Baumgaertner ,  Sebastian Guenther ,  Amin Jemili ,  Cristian Nagel ,  Jochen Reinmuth ,  Rolf Scheben

IPC: B81B3/00 ,  G01P15/125

Abstract: A micromechanical inertial sensor and a method for its operation. The micromechanical inertial sensor includes: a sensor element; a substrate having a substrate plane; a detection device for detecting a mechanical deflection due to tilting or deformation of the sensor element about a rotation axis substantially parallel to the substrate plane, wherein the mechanical deflection due to the tilting or deformation takes place along a detection direction substantially perpendicular to the substrate plane, wherein the detection device includes a first electrode structure and a second electrode structure that are firmly anchored to the substrate, wherein the detection device generates a measurement signal from the detected mechanical tilting or deformation of the sensor element about the rotation axis.

公开(公告)号：US20230095336A1

公开(公告)日：2023-03-30

申请号：US17908081

申请日：2021-04-14

Applicant: Robert Bosch GmbH

Inventor： Matthias Kuehnel ,  Nils Felix Kuhlmann ,  Robert Maul ,  Rolf Scheben ,  Steffen Markisch ,  Thorsten Balslink ,  Wolfram Geiger

IPC: G01C19/5712 ,  G01C19/5684 ,  G01C25/00

Abstract: A micromechanical component for a rotation rate sensor. The micromechanical component includes two rotor masses, mirror symmetrical with respect to a first plane of symmetry aligned perpendicularly to a substrate surface and passing through the center of the two rotor masses, which may be set in rotational vibrating motion about rotational axes aligned perpendicularly to the substrate surface, and four seismic masses, mirror symmetrical with respect to the first plane of symmetry, deflectable in parallel to the first plane of symmetry using the two rotor masses set in their respective rotational vibrating motion. The first rotor mass and a first pair of the four seismic masses connected thereto are mirror symmetrical to the second rotor mass and to a second pair of the four seismic masses connected thereto with respect to a second plane of symmetry aligned perpendicularly to the substrate surface and to the first plane of symmetry.

公开(公告)号：US10753743B2

公开(公告)日：2020-08-25

申请号：US15775321

申请日：2016-11-10

Applicant: Robert Bosch GmbH

Inventor： Reinhard Neul ,  Torsten Ohms ,  Robert Maul ,  Mirko Hattass ,  Christian Hoeppner ,  Odd-Axel Pruetz ,  Benjamin Schmidt ,  Rolf Scheben ,  Friedjof Heuck

IPC: G01C19/5747 ,  G01C19/5712

Abstract: A micromechanical yaw rate sensor includes a substrate and a rotationally oscillating mass having a rotationally oscillating mass bearing. The rotationally oscillating mass bearing includes a rocker bar, a rocker spring rod which resiliently connects the rocker bar to the substrate, and two support spring rods which resiliently connect, on opposite sides of the rocker spring rod, the rocker bar to the rotationally oscillating mass.

公开(公告)号：US10260879B2

公开(公告)日：2019-04-16

申请号：US15116924

申请日：2015-01-21

Applicant: Robert Bosch GmbH

Inventor： Robert Maul ,  Mirko Hattass ,  Rolf Scheben

IPC: G01C19/574 ,  G01C19/56 ,  G01C19/5719 ,  G01C19/5747

Abstract: A sensor drive includes at least one first seismic mass and an operating apparatus. The operating apparatus is configured to put the first seismic mass into oscillatory motion such that (i) a projection of the oscillatory motion of the first seismic mass onto a first spatial direction is a first harmonic oscillation of the first seismic mass at a first frequency, and (ii) a projection of the oscillatory motion of the first seismic mass onto a second spatial direction oriented at an angle to the first spatial direction is a second harmonic oscillation of the first seismic mass at a second frequency not equal to the first frequency. A method includes operating such a sensor device having at least one seismic mass.