摘要:
An aspect of the semiconductor device comprising a package substrate which has a plurality of pads to which a power supply voltage is applied on an upper surface thereof, a first memory chip which is arranged on the package substrate and has a first power supply pad provided on a first side and a second power supply pad provided on a second side perpendicular to the first side, and a second memory chip which is translated in a direction along which the first and second power supply pads of the first memory chip are exposed, arranged on the first memory chip, and has the same structure as the first memory chip, wherein the first and second power supply pads are provided at diagonal corners of the first memory chip, respectively.
摘要:
An aspect of the semiconductor device comprising a package substrate which has a plurality of pads to which a power supply voltage is applied on an upper surface thereof, a first memory chip which is arranged on the package substrate and has a first power supply pad provided on a first side and a second power supply pad provided on a second side perpendicular to the first side, and a second memory chip which is translated in a direction along which the first and second power supply pads of the first memory chip are exposed, arranged on the first memory chip, and has the same structure as the first memory chip, wherein the first and second power supply pads are provided at diagonal corners of the first memory chip, respectively.
摘要:
A semiconductor memory includes a converter configured to convert each read-data of plural bits read from a memory core into serial data, respectively, in synchronization with a read clock to generate converted read-data. An output register holds the converted read-data in synchronization with the read clock. A selector selects one bit from each plural bits of the converted read-data, in accordance with a control data, and to supply the selected bit to the output register.
摘要:
An MOS-type semiconductor integrated circuit has two MOS transistors of the opposite conductivity channel types connected in series between a high-voltage potential terminal and a ground potential terminal. Those two MOS transistors constitute an inverter and their gates are connected together to an input node. As output nodes, first and second nodes are provided with a current path in between which includes transistors whose gates are connected to the high-voltage potential terminal. A current path including the first transistor which constitutes a switch is inserted between the first node and the output node, and a current path including the second transistor and a barrier transistor is inserted between the second node and the output node. The gates of the first and second transistors are respectively connected with complementary clock signals. The bate of the barrier transistor is connected to the high-voltage potential terminal.
摘要:
A semiconductor integrated circuit includes first and second MOS transistors and a capacitor. The first MOS transistor has a drain connected to an output terminal, a gate and a source. The second MOS transistor has a gate, a drain connected to the source of the first MOS transistor and a source and has the same conductivity type as the first MOS transistor. The capacitor has one electrode connected to the gate of the first MOS transistor and the other electrode connected to a node whose potential changes in a complementary fashion with respect to the drain potential of the first MOS transistor and functions to cancel out an influence, caused by the coupling of a mirror capacitor which exists between the gate and drain of the first MOS transistor, affecting the gate potential of the first MOS transistor.
摘要:
A semiconductor memory device comprises a memory cell array, a first latch circuit group, and a second latch circuit group. The first latch circuit group sequentially outputs n/2 bit read data of n-bit read data from the memory cell array in response to sequentially shifted read control signals. The second latch circuit group sequentially outputs the remaining n/2 bit read data in response to the sequentially shifted read control signal.
摘要:
A semiconductor memory device comprises a first core section including a plurality of memory cell arrays, a second core section including a plurality of memory cell arrays and provided below the first core section, a third core section including a plurality of memory cell arrays and provided in a right side of the first core section, and a fourth core section including a plurality of memory cell arrays and provided in a right side of the second core section, wherein at least a part of the memory cell arrays of the first core section and at least a part of the memory cell arrays of the fourth core section are simultaneously activated, and at least a part of the memory cell arrays of the second core section and at least a part of the memory cell arrays of the third core section are simultaneously activated.
摘要:
An semiconductor device includes an integrated circuit having first and second circuit sections formed on a semiconductor chip, at least one voltage stress testing pad formed on the semiconductor chip for supplying a voltage stress testing voltage or signal to the first circuit section, and a control circuit formed on the semiconductor chip for controlling and setting the second circuit section into a state corresponding to a voltage stress testing mode by using an input from the voltage stress testing pads.
摘要:
There is disclosed a substrate bias circuit including an oscillation circuit oscillating at a predetermined frequency; a control signal generation circuit operative to generate a control signal for changing, on the basis of an output from the oscillation circuit, a substrate potential in a direction to ensure a threshold level of a transistor so that it becomes greater; and a charge pump circuit including a capacitor and operative to control discharge of the capacitor by said control signal to thereby change the substrate potential.
摘要:
A method of boring a hole through a magnet made of an intermetallic compound, characterized in that the hole is formed by a laser machining. The magnet may be reinforced by impregnation with a nonmagnetic material such as a high polymeric substance or a metal having a low melting point before the hole is bored through the magnet by laser machining.