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    PRINTED CIRCUIT BOARD
    21.
    发明申请
    PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20250024601A1

    公开(公告)日：2025-01-16

    申请号：US18657425

    申请日：2024-05-07

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Uk Lee ,  Tae Kyung Lee ,  Kee Ju Um ,  Min Gyu Park ,  Young Hun You

    IPC: H05K1/11 ,  H05K1/18

    Abstract: A printed circuit board includes a substrate portion including a first insulating layer, and a first wiring layer disposed on or in the first insulating layer, and a connection structure disposed on or in the substrate portion, the connection structure including a plurality of first dielectric layers, first and second metal layers respectively disposed on the plurality of first dielectric layers, a second insulating layer disposed on the plurality of first dielectric layers, and a second wiring layer disposed on the second insulating layer. Each of the plurality of first dielectric layers includes an organic material. A distance between the first metal layer and the second metal layer is less than a distance between the first metal layer and the second wiring layer.

    Printed circuit board
    23.
    发明授权
    Printed circuit board 有权

    公开(公告)号：US11856701B2

    公开(公告)日：2023-12-26

    申请号：US17673405

    申请日：2022-02-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyun Woo Kwon ,  Ki Ran Park ,  Kyeong Yub Jung ,  Jin Uk Lee ,  Jae Heun Lee

    IPC: H05K1/18 ,  H05K3/46 ,  H05K1/11

    CPC classification number: H05K1/185 ,  H05K1/112 ,  H05K1/183 ,  H05K3/4697

    Abstract: A printed circuit board includes: a first insulating layer including a first cavity and a second cavity; a first electronic component disposed in the first cavity and including a first pad disposed in a first surface direction of the first insulating layer; a second electronic component disposed in the second cavity and including a second pad disposed in a second surface direction, facing the first surface direction, of the first insulating layer; a second insulating layer disposed on each of first and second surfaces of the first insulating layer and in the first cavity to cover the first electronic component; and a third insulating layer disposed on the first surface of the first insulating layer and in the second cavity to cover the second electronic component.

    Printed circuit board
    24.
    发明授权
    Printed circuit board 有权

    公开(公告)号：US11641715B2

    公开(公告)日：2023-05-02

    申请号：US17476980

    申请日：2021-09-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Eun Sun Kim ,  Jin Uk Lee ,  Young Hun You ,  Chi Seong Kim

    IPC: H05K1/18 ,  H05K1/11 ,  H05K3/46

    Abstract: A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.

    TOUCH SENSOR
    26.
    发明申请
    TOUCH SENSOR 有权
    触摸传感器

    公开(公告)号：US20140333855A1

    公开(公告)日：2014-11-13

    申请号：US14273459

    申请日：2014-05-08

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jang Ho Park ,  Woon Chun Kim ,  Jin Uk Lee ,  Nam Keun Oh

    IPC: G06F3/041

    CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04103 ,  G06F2203/04112

    Abstract: A touch sensor includes a transparent substrate, and an electrode pattern formed on the transparent substrate. The electrode pattern is formed by stacking at least two or more electrode layers, thereby enhancing the anti-corrosion and visibility of electrode patterns and ensuring the adhesive reliability of the transparent substrate and the electrode patterns.

    Abstract translation: 触摸传感器包括透明基板和形成在透明基板上的电极图案。 通过层叠至少两个以上的电极层来形成电极图案，从而提高电极图案的防腐蚀和可视性，并确保透明基板和电极图案的粘合可靠性。

    TOUCH MODULE
    28.
    发明申请
    TOUCH MODULE 审中-公开
    触控模块

    公开(公告)号：US20130162561A1

    公开(公告)日：2013-06-27

    申请号：US13710179

    申请日：2012-12-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun Kim ,  Seul Gi Kim ,  Sang Su Hong ,  Jin Uk Lee

    IPC: G06F3/041

    CPC classification number: G06F3/041 ,  G06F3/04883

    Abstract: Disclosed herein is a touch module including: a touch electrode formed on one surface or both surfaces of a transparent substrate; a connection part coupled to the touch electrode; and a coating layer coating the touch electrode and the connection part.

    Abstract translation: 这里公开了一种触摸模块，包括：形成在透明基板的一个表面或两个表面上的触摸电极; 耦合到所述触摸电极的连接部分; 以及涂覆有触摸电极和连接部的涂层。

    PRINTED CIRCUIT BOARD
    30.
    发明申请
    PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20220322525A1

    公开(公告)日：2022-10-06

    申请号：US17469147

    申请日：2021-09-08

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Uk Lee ,  Sangik Cho ,  Chi Won Hwang ,  Eun Sun Kim

    IPC: H05K1/02 ,  H05K1/05

    Abstract: A printed circuit board includes a first insulating layer, a first conductor-pattern layer disposed on one surface of the first insulating layer, a first recess formed in the other surface of the first insulating layer opposing one surface of the first insulating layer, a second conductor-pattern layer disposed in the first recess, and a first metal post penetrating the first insulating layer, connecting the first and second conductor-pattern layers to each other, and having one end exposed to a bottom surface of the first recess, wherein the second conductor-pattern layer includes a seed layer disposed on at least a portion of each of a surface of one end of the first metal post exposed to the bottom surface of the first recess and an internal surface of the first recess including the bottom surface of the first recess, and a plating layer disposed on the seed layer to fill at least a portion of the first recess.

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