公开(公告)号：USD777778S1

公开(公告)日：2017-01-31

申请号：US29552472

申请日：2016-01-22

Applicant: Samsung Electronics Co., Ltd.

Designer： Yongman Park ,  Soyoung Lee ,  Jakyoung Lee

公开(公告)号：US20160068874A1

公开(公告)日：2016-03-10

申请号：US14845009

申请日：2015-09-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wooyong Lee ,  Soyoung Lee ,  Jiyoon Song ,  Kwangmyung Cho

IPC: C12P7/56 ,  C07K14/395

CPC classification number: C12P7/56 ,  C07K14/395 ,  C12N15/52

Abstract: A genetically engineered yeast cell with enhanced activity of an EDC enzyme compared to that of a parent cell and capability of producing lactate, a method of producing the yeast cell, and a method of producing lactate by using the yeast cell.

Abstract translation: 与亲本细胞相比具有增强的EDC酶的活性和产生乳酸的能力的遗传工程酵母细胞，生产酵母细胞的方法，以及通过使用酵母细胞产生乳酸的方法。

公开(公告)号：US12256496B2

公开(公告)日：2025-03-18

申请号：US18502657

申请日：2023-11-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungsik Park ,  Soyoung Lee

IPC: H05K1/14 ,  G06F1/16 ,  G06F1/20 ,  G06F1/26 ,  H01Q1/52 ,  H01Q9/04 ,  H01R12/53 ,  H04B1/3883 ,  H04M1/02 ,  H05K1/11 ,  H01Q1/24 ,  H01Q9/42 ,  H01Q21/06 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.

公开(公告)号：US20230369039A1

公开(公告)日：2023-11-16

申请号：US18315322

申请日：2023-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunhyea KO ,  Daihyun Kim ,  Thanh Cuong Nguyen ,  Soyoung Lee ,  Jihyun Lee ,  Hoon Han ,  Byungkeun Hwang ,  Hiroyuki Uchiuzou ,  Kiyoshi Murata ,  Tomoharu Yoshino ,  Youjoung Cho

IPC: H01L21/02 ,  H01L21/311

CPC classification number: H01L21/0212 ,  H01L21/02307 ,  H01L21/02315 ,  H01L21/31133 ,  H01L21/31111

Abstract: A method of manufacturing a semiconductor device is provided. The method includes providing a first layer having a first surface and a second layer having a second surface orthogonal to the first surface in a vertical direction, forming an inhibitor layer conformally on the first surface and the second surface, exposing the second surface by selectively removing the inhibitor layer on the second surface among the first surface and the second surface, the exposing of the second surface may include selectively removing an edge portion of the inhibitor layer on the first surface, the edge portion contacting the second surface, and forming an interest layer on the exposed second surface.

公开(公告)号：US11818843B2

公开(公告)日：2023-11-14

申请号：US17971146

申请日：2022-10-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungsik Park ,  Soyoung Lee

IPC: H05K1/14 ,  G06F1/16 ,  H01Q1/52 ,  H04M1/02 ,  H04B1/3883 ,  G06F1/20 ,  G06F1/26 ,  H01Q9/04 ,  H01R12/53 ,  H05K1/11 ,  H01Q9/42 ,  H01Q1/24 ,  H01Q21/06 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/144 ,  G06F1/1626 ,  G06F1/1635 ,  G06F1/1656 ,  G06F1/1658 ,  G06F1/1698 ,  G06F1/203 ,  G06F1/263 ,  H01Q1/526 ,  H01Q9/0407 ,  H01R12/53 ,  H04B1/3883 ,  H04M1/026 ,  H04M1/0262 ,  H04M1/0277 ,  H05K1/116 ,  H01Q1/243 ,  H01Q9/42 ,  H01Q21/065 ,  H05K1/0216 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10378

Abstract: An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.

公开(公告)号：US11741869B2

公开(公告)日：2023-08-29

申请号：US17517122

申请日：2021-11-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongjin Kwon ,  Jookwan Lee ,  Soyoung Lee

IPC: G06F3/041 ,  G09G3/00 ,  G01J1/42 ,  G01B21/22 ,  G01S17/08 ,  G06V40/18 ,  G06V40/16

CPC classification number: G09G3/035 ,  G01B21/22 ,  G01J1/4204 ,  G01S17/08 ,  G06F3/041 ,  G06F2203/04108 ,  G06V40/161 ,  G06V40/18 ,  G09G2330/022 ,  G09G2340/0464 ,  G09G2354/00 ,  G09G2360/144

Abstract: An electronic device includes: a housing including a first side, a second side, a third side, and a fourth side, a variable display coupled to the housing and having a changeable position of a side area surrounding the first side, a sensor configured to detect a change in the position of the side area, and a processor electrically connected to the variable display and the sensor, wherein the processor may be configured to: obtain data on a state change of the variable display through the sensor, calculate an amount of change in the position of the side area based on the data on the state change, and change display coordinates of a soft key based on the calculated amount of change.

公开(公告)号：US11387229B2

公开(公告)日：2022-07-12

申请号：US16826756

申请日：2020-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeha Lee ,  Ha-Young Kim ,  Bonghyun Lee ,  Soyoung Lee ,  Yongeun Cho

IPC: H01L29/76 ,  H01L27/02 ,  G06F30/398 ,  G06F30/394 ,  G06F30/392

Abstract: Disclosed is a semiconductor device comprising a logic cell including first and second active regions spaced apart in a first direction on a substrate, first and second active patterns on the first and second active regions and extend in a second direction, first and second source/drain patterns on the first and second active patterns, gate electrodes extending in the first direction to run across the first and second active patterns and arranged in the second direction at a first pitch, first lines in a first interlayer dielectric layer on the gate electrodes and each electrically connected to the first source/drain pattern, the second source/drain pattern, or the gate electrode, and second lines in a second interlayer dielectric layer on the first interlayer dielectric layer and extending parallel to each other in the first direction.

公开(公告)号：US11348490B1

公开(公告)日：2022-05-31

申请号：US17326923

申请日：2021-05-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myunghoon Kwak ,  Sangeun Lee ,  Soyoung Lee

IPC: G09F9/30 ,  G06F1/16 ,  G06F3/041 ,  G06F3/0487 ,  G06F3/0488

Abstract: An electronic device and method are provided. The electronic device includes a flexible display including a first state in which a display area has a first size and a second state in which the display area is expanded in a first direction to have a second size larger than the first size, an actuator driven to change a state of the flexible display, and a processor configured to detect a touch input on a point of the display area, which is located adjacent to a side surface of the electronic device, and identify whether a touch point of the touch input is moved from the point of the display area by a specified distance or more in a same direction as a direction in which the state of the flexible display is changed in a state in which the touch input is maintained.

公开(公告)号：US10967835B2

公开(公告)日：2021-04-06

申请号：US16349705

申请日：2017-10-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeong Woo ,  Minyong Song ,  Soyoung Lee

IPC: B60R25/24 ,  G07C9/00 ,  H04B7/08 ,  H04W12/06

Abstract: The present invention relates to an electronic device and a method for controlling the electronic device, and the electronic device according to various embodiments of the present document comprises a processor, wherein the processor can: receive, via a communication circuit, at least one signal from an external electronic device having a smart key; perform verification with the external electronic device on the basis of the at least one signal; measure an angle at which the at least one signal has been received and/or a received signal strength indication (RSSI) thereof, on the basis of the result of the verification performed; identify the location of the external electronic device on the basis of the measured reception angle and/or RSSI of the at least one signal; and, based on the identified location of the external electronic device, control at least some components of the electronic device.

公开(公告)号：US10939552B2

公开(公告)日：2021-03-02

申请号：US16887585

申请日：2020-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungsik Park ,  Soyoung Lee

IPC: H05K1/11 ,  H05K1/14 ,  G06F1/16 ,  H01Q1/52 ,  H04M1/02 ,  H04B1/3883 ,  G06F1/20 ,  G06F1/26 ,  H01Q9/04 ,  H01R12/53 ,  H01Q9/42 ,  H01Q1/24 ,  H01Q21/06 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.