公开(公告)号：US20170263821A1

公开(公告)日：2017-09-14

申请号：US15329993

申请日：2015-07-30

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chi Hyun In ,  Sang Min Kim ,  Dae Seok Park ,  Eun Ji Park ,  Hong Suk Cho

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/14 ,  H01L33/40

CPC classification number: H01L33/46 ,  H01L33/14 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

Abstract: The present invention relates to a light-emitting diode having enhanced liability. More particularly, a light-emitting diode has enhanced liability in a high-temperature and/or high humidity environment as well as in a room-temperature environment and can have decrease in light-emitting characteristics prevented. In addition, the present invention relates to a light-emitting diode comprising a structure which enables enhancing of light reflection and having enhanced light extraction efficiency by means of light reflection through the structure.

公开(公告)号：US09164489B2

公开(公告)日：2015-10-20

申请号：US14514243

申请日：2014-10-14

Applicant: Seoul Viosys Co., Ltd.

Inventor： Chi Hyun In

IPC: G04B47/06 ,  G04B47/00 ,  G04B19/06 ,  G01N21/64

CPC classification number: G04B47/00 ,  G01N21/6447 ,  G04B19/06 ,  G04D7/00

Abstract: A wearable device such as a watch with a counterfeit detection function that include a display panel configured to display information (e.g., time); a UV LED unit arranged at an edge part of the display panel and configured to provide UV light which reacts with a fluorescent material; and a transparent cover positioned over the display panel so as to focus the UV light.

Abstract translation: 一种可穿戴装置，例如具有假冒检测功能的手表，其包括被配置为显示信息（例如，时间）的显示面板; UV LED单元，布置在所述显示面板的边缘部分并且被配置为提供与荧光材料反应的UV光; 以及位于显示面板上方以便聚焦UV光的透明盖。

公开(公告)号：US09048348B2

公开(公告)日：2015-06-02

申请号：US14138923

申请日：2013-12-23

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Min Jang ,  Hwa Mok Kim ,  Kyu Ho Lee ,  Chang Hoon Kim ,  Daewoong Suh ,  Chi Hyun In ,  Dae Seok Park ,  Jong Hyeon Chae

IPC: H01L21/30 ,  H01L33/00 ,  H01L33/22

CPC classification number: H01L33/0079 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/0095 ,  H01L33/22

Abstract: A method of fabricating a semiconductor device, the method including: forming a first mask pattern including a masking region and an open region on a substrate; forming a sacrificial layer to cover the substrate and the first mask pattern; patterning the sacrificial layer to form a seed layer and to expose the first mask pattern; forming a second mask pattern on the exposed first mask pattern; forming an epitaxial layer on the seed layer and the second mask pattern, and forming a void between the second mask pattern and the epitaxial layer; and separating the substrate from the epitaxial layer.

Abstract translation: 一种制造半导体器件的方法，所述方法包括：在衬底上形成包括掩模区域和开放区域的第一掩模图案; 形成覆盖衬底和第一掩模图案的牺牲层; 图案化所述牺牲层以形成种子层并暴露所述第一掩模图案; 在所述暴露的第一掩模图案上形成第二掩模图案; 在种子层和第二掩模图案上形成外延层，并在第二掩模图案和外延层之间形成空隙; 以及将衬底与外延层分离。

公开(公告)号：US20150103634A1

公开(公告)日：2015-04-16

申请号：US14514243

申请日：2014-10-14

Applicant: Seoul Viosys Co., Ltd.

Inventor： Chi Hyun In

IPC: G04B47/00 ,  G01N21/64 ,  G04B19/06

CPC classification number: G04B47/00 ,  G01N21/6447 ,  G04B19/06 ,  G04D7/00

Abstract: A wearable device such as a watch with a counterfeit detection function that include a display panel configured to display information (e.g., time); a UV LED unit arranged at an edge part of the display panel and configured to provide UV light which reacts with a fluorescent material; and a transparent cover positioned over the display panel so as to focus the UV light.

Abstract translation: 一种可穿戴装置，例如具有假冒检测功能的手表，其包括被配置为显示信息（例如，时间）的显示面板; UV LED单元，布置在所述显示面板的边缘部分并且被配置为提供与荧光材料反应的UV光; 以及位于显示面板上方以便聚焦UV光的透明盖。

公开(公告)号：US20150091042A1

公开(公告)日：2015-04-02

申请号：US14498910

申请日：2014-09-26

Applicant: Seoul Viosys Co., Ltd.

Inventor： Chang Hoon Kim ,  Sang Min Kim ,  Chi Hyun In ,  Hong Suk Cho ,  Dae Seok Park

IPC: H01L33/24 ,  H01L33/38

CPC classification number: H01L33/38 ,  H01L24/14 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A light emitting diode (LED) chip can include: a first pattern region having one or more curved parts; and a second pattern region at least partially surrounding the first pattern region. The first pattern region can include a first conductive type nitride-based semiconductor layer, an active layer, a second conductive type nitride-based semiconductor layer, a top electrode layer, and a top bump layer stacked over a substrate, the second pattern region can include a first conductive type nitride-based semiconductor layer, a bottom electrode layer, and a bottom bump layer stacked over the substrate, and the first pattern region can include one or more protrusion patterns formed in the one or more curved part.

Abstract translation: 发光二极管（LED）芯片可以包括：具有一个或多个弯曲部分的第一图案区域; 以及至少部分地围绕所述第一图案区域的第二图案区域。 第一图案区域可以包括堆叠在衬底上的第一导电氮化物基半导体层，有源层，第二导电氮化物基半导体层，顶电极层和顶部隆起层，第二图案区域可以 包括层叠在基板上的第一导电型氮化物系半导体层，底部电极层和底部隆起层，第一图案区域可以包括形成在一个以上的弯曲部中的一个以上突起图案。

公开(公告)号：US12107195B2

公开(公告)日：2024-10-01

申请号：US18098030

申请日：2023-01-17

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chi Hyun In ,  Jun Yong Park ,  Kyu Ho Lee ,  Dae Woong Suh ,  Jong Hyeon Chae ,  Chang Hoon Kim ,  Sung Hyun Lee

IPC: H01L33/48 ,  H01L33/20 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/20 ,  H01L33/44 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0033

Abstract: A light emitting diode, including a first type semiconductor layer, an active layer, and a second type semiconductor layer; an ohmic contact layer disposed on the second type semiconductor layer; a first insulating layer disposed on the semiconductor structure and including a first opening overlapping the first type semiconductor layer and a second opening overlapping the ohmic contact layer; a first connection wiring disposed on the first insulating layer, the first connection wiring having a first portion and a second portion; and a second connection wiring disposed on the first insulating layer and spaced apart from the first connection wiring, the second connection wiring electrically connected to the second type semiconductor layer through the second opening. The second connection wiring surrounds at least a portion of the first portion of the first connection wiring in a plan view.

公开(公告)号：US20200350469A1

公开(公告)日：2020-11-05

申请号：US16935030

申请日：2020-07-21

Applicant: Seoul Viosys Co., Ltd

Inventor： Chi Hyun In ,  Jun Yong Park ,  Kyu Ho Lee ,  Dae Woong Suh ,  Jong Hyeon Chae ,  Chang Hoon Kim ,  Sung Hyun Lee

IPC: H01L33/48

Abstract: Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.

公开(公告)号：US10573780B2

公开(公告)日：2020-02-25

申请号：US16069665

申请日：2017-01-11

Applicant: Seoul Viosys Co., Ltd.

Inventor： Seong Kyu Jang ,  Hong Suk Cho ,  Kyu Ho Lee ,  Chi Hyun In

IPC: H01L33/08 ,  H01L33/02 ,  H01L33/38 ,  H01L33/48 ,  H01L23/00 ,  H01L33/46

Abstract: An ultraviolet light-emitting device including a substrate, a first conductive type semiconductor layer disposed on the substrate, a mesa disposed on the first conductive type semiconductor layer and including a second conductive type semiconductor layer and an active layer disposed between the semiconductor layers, a first contact electrode contacting the exposed first conductive type semiconductor layer around the mesa, a second contact electrode contacting the second conductive type semiconductor layer on the mesa, a passivation layer covering the first contact electrode, the mesa, and the second contact electrode and having openings disposed above the first and second contact electrodes, and first and second bump electrodes electrically connected to the first and second contact electrodes through the openings of the passivation layer, in which the mesa has depressions in plan view, and the first and second bump electrodes cover the openings and a portion of the passivation layer.

公开(公告)号：US10177281B2

公开(公告)日：2019-01-08

申请号：US15722826

申请日：2017-10-02

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chi Hyun In ,  Sang Min Kim ,  Dae Seok Park ,  Eun Ji Park ,  Hong Suk Cho

IPC: H01L33/46 ,  H01L33/62 ,  H01L33/14 ,  H01L33/40 ,  H01L33/38 ,  H01L33/44

Abstract: A light emitting diode includes a substrate, a lower semiconductor layer disposed on the substrate, a light emitting unit comprising a first upper semiconductor layer disposed in one region of the lower semiconductor layer and an active layer interposed between the lower semiconductor layer and the first upper semiconductor layer, a second current spreading portion comprising a third upper semiconductor layer disposed in another region of the lower semiconductor layer and an active layer interposed between the lower semiconductor layer and the third upper semiconductor layer, a first electrode disposed on the light emitting cell and electrically connected to the first upper semiconductor layer, and a second electrode separated from the light emitting cell and electrically connected to the lower semiconductor layer.

公开(公告)号：US20180182925A1

公开(公告)日：2018-06-28

申请号：US15722826

申请日：2017-10-02

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chi Hyun In ,  Sang Min Kim ,  Dae Seok Park ,  Eun Ji Park ,  Hong Suk Cho

IPC: H01L33/46 ,  H01L33/14 ,  H01L33/62 ,  H01L33/40

CPC classification number: H01L33/46 ,  H01L33/14 ,  H01L33/38 ,  H01L33/405 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/13 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

Abstract: A light emitting diode includes a substrate, a lower semiconductor layer disposed on the substrate, a light emitting unit comprising a first upper semiconductor layer disposed in one region of the lower semiconductor layer and an active layer interposed between the lower semiconductor layer and the first upper semiconductor layer, a second current spreading portion comprising a third upper semiconductor layer disposed in another region of the lower semiconductor layer and an active layer interposed between the lower semiconductor layer and the third upper semiconductor layer, a first electrode disposed on the light emitting cell and electrically connected to the first upper semiconductor layer, and a second electrode separated from the light emitting cell and electrically connected to the lower semiconductor layer.