公开(公告)号：US11990421B2

公开(公告)日：2024-05-21

申请号：US17648365

申请日：2022-01-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongKook Shin ,  KyoWang Koo ,  HeeYoun Kim ,  SeongKuk Kim

IPC: H01L21/52 ,  H01L21/48 ,  H01L21/50 ,  H01L23/31 ,  H01L23/552

CPC classification number: H01L23/552 ,  H01L21/4871 ,  H01L21/50 ,  H01L23/3121

Abstract: A semiconductor device has a substrate and first and second electrical component disposed over the substrate. A first metal bar is disposed over the substrate between the first electrical component and second electrical component. The first metal bar is formed by disposing a mask over a carrier. An opening is formed in the mask and a metal layer is sputtered over the mask. The mask is removed to leave the metal layer within the opening as the first metal bar. The first metal bar can be stored in a tape-and-reel.

公开(公告)号：US20230230934A1

公开(公告)日：2023-07-20

申请号：US17648365

申请日：2022-01-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongKook Shin ,  KyoWang Koo ,  HeeYoun Kim ,  SeongKuk Kim

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/50 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L21/50 ,  H01L21/4871

Abstract: A semiconductor device has a substrate and first and second electrical component disposed over the substrate. A first metal bar is disposed over the substrate between the first electrical component and second electrical component. The first metal bar is formed by disposing a mask over a carrier. An opening is formed in the mask and a metal layer is sputtered over the mask. The mask is removed to leave the metal layer within the opening as the first metal bar. The first metal bar can be stored in a tape-and-reel.

公开(公告)号：US20220384360A1

公开(公告)日：2022-12-01

申请号：US17817461

申请日：2022-08-04

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/28 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.

公开(公告)号：US20210118810A1

公开(公告)日：2021-04-22

申请号：US17136197

申请日：2020-12-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L23/552 ,  H01L21/311 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/66

Abstract: A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.

公开(公告)号：US10985109B2

公开(公告)日：2021-04-20

申请号：US16234233

申请日：2018-12-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/552 ,  H01L23/31 ,  H01R43/20 ,  H01R43/26 ,  H01R12/79 ,  H01R12/52

Abstract: A semiconductor device has a substrate including a terminal and an insulating layer formed over the terminal. An electrical component is disposed over the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the insulating layer over the terminal is exposed from the encapsulant. A shielding layer is formed over the encapsulant and terminal. A portion of the shielding layer is removed to expose the portion of the insulating layer. The portion of the insulating layer is removed to expose the terminal. The portion of the shielding layer and the portion of the insulating layer can be removed by laser ablation.

公开(公告)号：US20180294236A1

公开(公告)日：2018-10-11

申请号：US16005387

申请日：2018-06-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Byung Joon Han ,  Il Kwon Shim ,  KyoungHee Park ,  Yaojian Lin ,  KyoWang Koo ,  In Sang Yoon ,  SeungYong Chai ,  SungWon Cho ,  SungSoo Kim ,  Hun Teak Lee ,  DeokKyung Yang

IPC: H01L23/552 ,  H01L23/498 ,  H01L21/683 ,  H01L21/48 ,  H01L23/00 ,  H01L25/16 ,  H01L23/31 ,  H01L21/56

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

公开(公告)号：US20180294235A1

公开(公告)日：2018-10-11

申请号：US16005348

申请日：2018-06-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Byung Joon Han ,  Il Kwon Shim ,  KyoungHee Park ,  Yaojian Lin ,  KyoWang Koo ,  In Sang Yoon ,  SeungYong Chai ,  SungWon Cho ,  SungSoo Kim ,  Hun Teak Lee ,  DeokKyung Yang

IPC: H01L23/552 ,  H01L23/498 ,  H01L21/683 ,  H01L21/48 ,  H01L23/00 ,  H01L25/16 ,  H01L23/31 ,  H01L21/56

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.

公开(公告)号：US09997468B2

公开(公告)日：2018-06-12

申请号：US15091049

申请日：2016-04-05

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： Byung Joon Han ,  Il Kwon Shim ,  KyoungHee Park ,  Yaojian Lin ,  KyoWang Koo ,  In Sang Yoon ,  SeungYong Chai ,  SungWon Cho ,  SungSoo Kim ,  Hun Teak Lee ,  DeokKyung Yang

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/683 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/16 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/486 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/97 ,  H01L25/16 ,  H01L2221/68327 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/141 ,  H01L2924/143 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/01029 ,  H01L2224/81

Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.