公开(公告)号：US20180058920A1

公开(公告)日：2018-03-01

申请号：US15611266

申请日：2017-06-01

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Jean-Michel Riviere

IPC: G01J1/02 ,  H05K1/18 ,  H05K3/28 ,  G01J1/04 ,  G01V8/10

CPC classification number: G01J1/0271 ,  G01J1/0403 ,  G01V8/10 ,  H01L25/167 ,  H01L31/0203 ,  H01L31/167 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/10151 ,  H05K2201/10378

Abstract: A microchip has a rear face attached to a front mounting face of a support plate. An encapsulation cover for the microchip is mounted to the support plate. The encapsulation cover includes a front wall, a peripheral wall extending from the front wall and an inside partition extending from the front wall and between opposite sides of the peripheral wall. The inside partition passes locally above the microchip to delimit two cavities. A bonding material is interposed between encapsulation cover and the support plate and microchip. An end part of the inside partition of the cover, adjacent to the front face of the microchip, include an accumulation and containment recess that is configured to at least partly receive the bonding material.

公开(公告)号：US09773740B2

公开(公告)日：2017-09-26

申请号：US14821902

申请日：2015-08-10

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Marika Sorrieul

IPC: H01L23/00 ,  H01L27/146 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/3171 ,  H01L24/17 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/1876 ,  H01L2224/1329 ,  H01L2224/13291 ,  H01L2224/14179 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/30135 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A method for fabricating an electronic device, and an electronic device in a stacked configuration, includes a rear face of an integrated-circuit chip that is fixed to a front face of a support wafer. A protective wafer is located facing and at a distance from the front face of the chip, and an infused adhesive is interposed between the chip and the protective wafer and located on a zone of the front face of the chip outside a central region of this front face. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. An obstruction barrier is arranged between the chip and the protective wafer and is disposed outside the central region of the front face of the chip. An encapsulation ring surrounds the chip, the protective wafer and the obstruction barrier.

公开(公告)号：US20170133520A1

公开(公告)日：2017-05-11

申请号：US15410230

申请日：2017-01-19

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Marika Sorrieul

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/02

CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/3171 ,  H01L23/481 ,  H01L24/13 ,  H01L24/17 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/1876 ,  H01L2224/1329 ,  H01L2224/13291 ,  H01L2224/14179 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/30135 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73257 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/13099

Abstract: A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

公开(公告)号：US20160163884A1

公开(公告)日：2016-06-09

申请号：US14834923

申请日：2015-08-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Marika Sorrieul ,  Karine Saxod

IPC: H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/0203 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L31/186 ,  H01L31/1876 ,  H01L2224/16225 ,  H01L2224/29011 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit chip is mounted on top of a base wafer, and a protection wafer is mounted on top of the integrated circuit chip. An encapsulation block is formed around the integrated circuit chip and the protection wafer and on a peripheral part of the front face of the base wafer. The encapsulation block includes a first encapsulation ring arranged around the integrated circuit chip and the protection wafer, having an annular beading protruding with respect to the front face of the protection wafer and forming a peripheral groove (24) recessed with respect to this protruding annular beading. A second encapsulation ring of the encapsulation block fills the peripheral groove of the first encapsulation ring.

Abstract translation: 集成电路芯片安装在基底晶片的顶部，保护晶片安装在集成电路芯片的顶部。 封装块形成在集成电路芯片和保护晶片周围以及基底晶片正面的周边部分周围。 封装块包括布置在集成电路芯片和保护晶片周围的第一封装环，其具有相对于保护晶片的前表面突出的环形凸缘，并且形成相对于该突出的环形珠形凹陷的周边凹槽（24） 。 封装块的第二封装环填充第一封装环的外围沟槽。

公开(公告)号：US12288835B2

公开(公告)日：2025-04-29

申请号：US17145929

申请日：2021-01-11

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Nicolas Mastromauro ,  Karine Saxod

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62

Abstract: An electronic device includes a carrier substrate having a front face and an electronic chip mounted on the front face. An encapsulation cover is mounted above the front face and bounds a chamber in which the chip is situated. A front opening is provided in front of an optical component of the chip. An optical element, designed to allow light to pass, is mounted on the cover in a position which covers the front opening of the cover. The optical element includes a central region designed to deviate light and a positioning pattern that is visible through the front opening. An additional mask is mounted on the encapsulation cover in a position which extends in front of the optical element. A local opening of the additional mask is situated in front of the optical component.

公开(公告)号：US11609402B2

公开(公告)日：2023-03-21

申请号：US16573023

申请日：2019-09-17

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Research & Development) Limited

Inventor： Nicolas Mastromauro ,  Roy Duffy ,  Karine Saxod

IPC: H01L31/0232 ,  H01L31/0203 ,  G02B7/00 ,  G02B13/00

Abstract: An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.

公开(公告)号：US11244910B2

公开(公告)日：2022-02-08

申请号：US16862002

申请日：2020-04-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Marika Sorrieul

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203 ,  H01L23/48

Abstract: A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

公开(公告)号：US10833208B2

公开(公告)日：2020-11-10

申请号：US16581978

申请日：2019-09-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Alexandre Mas ,  Eric Saugier ,  Gaetan Lobascio ,  Benoit Besancon

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L31/02 ,  H01L31/12 ,  B29C45/14 ,  H01L33/48 ,  B29L31/34

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US10672721B2

公开(公告)日：2020-06-02

申请号：US16208038

申请日：2018-12-03

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Marika Sorrieul

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203

Abstract: A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

公开(公告)号：US10325784B2

公开(公告)日：2019-06-18

申请号：US15685552

申请日：2017-08-24

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Alexandre Mas ,  Karine Saxod

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/552 ,  H01L23/053 ,  H01L23/06 ,  H01L23/10 ,  H01L23/24 ,  H01L23/42 ,  H01L23/433 ,  H01L21/52 ,  H01L23/04 ,  H01L21/48

Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.