Microelectromechanical sensing structure for a capacitive acoustic transducer including an element limiting the oscillations of a membrane, and manufacturing method thereof
    25.
    发明授权
    Microelectromechanical sensing structure for a capacitive acoustic transducer including an element limiting the oscillations of a membrane, and manufacturing method thereof 有权
    一种用于电容式声换能器的微机电感测结构,包括限制膜的振荡的元件及其制造方法

    公开(公告)号:US09226079B2

    公开(公告)日:2015-12-29

    申请号:US14220985

    申请日:2014-03-20

    Abstract: A microelectromechanical sensing structure for a capacitive acoustic transducer, including: a semiconductor substrate; a rigid electrode; and a membrane set between the substrate and the rigid electrode, the membrane having a first surface and a second surface, which are in fluid communication, respectively, with a first chamber and a second chamber, respectively, the first chamber being delimited at least in part by a first wall portion and a second wall portion formed at least in part by the substrate, the second chamber being delimited at least in part by the rigid electrode, the membrane being moreover designed to undergo deformation following upon incidence of pressure waves and facing the rigid electrode so as to form a sensing capacitor having a capacitance that varies as a function of the deformation of the membrane. The structure moreover includes a beam, which is connected to the first and second wall portions and is designed to limit the oscillations of the membrane.

    Abstract translation: 一种用于电容式声换能器的微机电感测结构,包括:半导体衬底; 刚性电极; 以及膜,其设置在所述基底和所述刚性电极之间,所述膜具有第一表面和第二表面,所述第一表面和第二表面分别与第一腔室和第二腔室流体连通,所述第一腔室至少在 部分由第一壁部分和至少部分地由基底形成的第二壁部分,第二室至少部分地由刚性电极限定,该膜还被设计成在压力波入射之后经历变形,并且面向 刚性电极,以形成感测电容器,该感测电容器具有作为膜的变形的函数而变化的电容。 该结构还包括梁,其连接到第一和第二壁部分并被设计成限制膜的振荡。

    WAFER LEVEL ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATED MEMS SENSOR DEVICE
    26.
    发明申请
    WAFER LEVEL ASSEMBLY OF A MEMS SENSOR DEVICE AND RELATED MEMS SENSOR DEVICE 有权
    MEMS传感器装置和相关MEMS传感器装置的水平方向组装

    公开(公告)号:US20140319630A1

    公开(公告)日:2014-10-30

    申请号:US14265053

    申请日:2014-04-29

    CPC classification number: H04R19/005 H01L29/84 H04R1/04 H04R19/04

    Abstract: An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.

    Abstract translation: MEMS传感器装置的组件设想:第一管芯,集成微机械检测结构并具有外部主面; 集成了可操作地耦合到微机械检测结构的电子电路,电和机械耦合到第一管芯并且具有相应的外部主面。 第一模具和第二模具的外部主面都被设置成与组件外部的环境直接接触,而不插入封装件。

    Microelectromechanical device having a structure tiltable by piezoelectric actuation about two rotation axes

    公开(公告)号:US12222492B2

    公开(公告)日:2025-02-11

    申请号:US17487166

    申请日:2021-09-28

    Abstract: A microelectromechanical device includes a fixed structure having a frame defining a cavity, a tiltable structure elastically suspended above the cavity with main extension in a horizontal plane, a piezoelectrically driven actuation structure which can be biased to cause a desired rotation of the tiltable structure about a first and second rotation axes, and a supporting structure integral with the fixed structure and extending in the cavity starting from the frame. Lever elements are elastically coupled to the tiltable structure at a first end by elastic suspension elements and to the supporting structure at a second end by elastic connecting elements which define a lever rotation axis. The lever elements are elastically coupled to the actuation structure so that their biasing causes the desired rotation of the tiltable structure about the first and second rotation axes.

    MEMS actuator for in-plane movement of a mobile mass and optical module comprising the MEMS actuator

    公开(公告)号:US12209008B2

    公开(公告)日:2025-01-28

    申请号:US17752016

    申请日:2022-05-24

    Abstract: A MEMS actuator includes a mobile mass suspended over a substrate in a first direction and extending in a plane that defines a second direction and a third direction perpendicular thereto. Elastic elements arranged between the substrate and the mobile mass have a first compliance in a direction parallel to the first direction that is lower than a second compliance in a direction parallel to the second direction. Piezoelectric actuation structures have a portion fixed with respect to the substrate and a portion that deforms in the first direction in response to an actuation voltage. Movement-transformation structures coupled to the piezoelectric actuation structures include an elastic movement-conversion structure arranged between the piezoelectric actuation structures and the mobile mass. The elastic movement-conversion structure is compliant in a plane formed by the first and second directions and has first and second principal axes of inertia transverse to the first and second directions.

    Resonant MEMS device having a tiltable, piezoelectrically controlled micromirror

    公开(公告)号:US11933966B2

    公开(公告)日:2024-03-19

    申请号:US17715639

    申请日:2022-04-07

    CPC classification number: G02B26/0858 B81B3/0021 B81B2201/042

    Abstract: Disclosed herein is a method of making a microelectromechanical (MEMS) device. The method includes, in a single structural layer, affixing a tiltable structure to an anchorage portion with first and second supporting arms extending between the anchorage portion and opposite sides of the tiltable structure, and forming first and second resonant piezoelectric actuation structures extending between a constraint portion of the first supporting arm and the anchorage portion, on opposite sides of the first supporting arm. The method further includes coupling a handling wafer underneath the structural layer to define a cavity therebetween, and forming a passivation layer over the structural layer, the passivation layer having contact openings defined therein for routing metal regions for electrical coupling to respective electrical contact pads, the electrical contact pads being electrically connected to the first and second resonant piezoelectric actuation structures.

    Micro-machined ultrasonic transducer including a tunable helmoltz resonator

    公开(公告)号:US11872591B2

    公开(公告)日:2024-01-16

    申请号:US17118443

    申请日:2020-12-10

    CPC classification number: B06B1/0292 B06B1/06 B06B1/0666 G10K9/122

    Abstract: A micro-machined ultrasonic transducer is proposed. The micro-machined ultrasonic transducer includes a membrane element for transmitting/receiving ultrasonic waves, during the transmission/reception of ultrasonic waves the membrane element oscillating, about an equilibrium position, at a respective resonance frequency. The equilibrium position of the membrane element is variable according to a biasing electric signal applied to the membrane element. The micro-machined ultrasonic transducer further comprises a cap structure extending above the membrane element; the cap structure identifies, between it and the membrane element, a cavity whose volume is variable according to the equilibrium position of the membrane element. The cap structure comprises an opening for inputting/outputting the ultrasonic waves into/from the cavity. The cap structure and the membrane element act as tunable Helmholtz resonator, whereby the resonance frequency is variable according to the volume of the cavity.

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