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21.
公开(公告)号:US20240064985A1
公开(公告)日:2024-02-22
申请号:US18386456
申请日:2023-11-02
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Masanori Tsutsumi , Kazuki Isozumi , Peng Zhang
Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate. The electrically conductive layers include word-line-level electrically conductive layers and drain-select-level electrically conductive layers overlying the word-line-level electrically conductive layers. An array of memory opening fill structures is located within an array of memory openings vertically extending through the alternating stack. An encapsulated cavity vertically extends through the drain-select-level electrically conductive layers. The array of memory opening fill structures includes two rows of first memory opening fill structures that are arranged along a first horizontal direction. Each of the first memory opening fill structures includes a respective planar straight sidewall in contact with a respective portion of a pair of straight sidewalls of the encapsulated cavity.
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公开(公告)号:US20240029806A1
公开(公告)日:2024-01-25
申请号:US17872148
申请日:2022-07-25
Applicant: SanDisk Technologies LLC
Inventor: Jiacen Guo , Peng Zhang , Xiang Yang , Yanli Zhang
CPC classification number: G11C16/3459 , G11C16/102 , G11C16/08 , G11C16/24 , G11C16/0483
Abstract: In a non-volatile memory system that performs programming of selected memory cells (in coordination with pre-charging and boosting of channels for unselected memory cells) and program-verify to determine whether the programming was successful, the system transitions from program-verify to the next dose of programming by concurrently lowering a voltage applied to a selected word line and voltages applied to word lines on a first side of the selected word line at the conclusion of program-verify. Subsequent to lowering the voltage applied to the selected word line, the system successively lowers voltages applied to groups of one or more word lines on a second side of the selected word line at the conclusion of program-verify beginning with a group of one or more word lines immediately adjacent the selected word line and progressing to other groups of one or more word lines disposed increasingly remote from the selected word line.
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公开(公告)号:US11423993B2
公开(公告)日:2022-08-23
申请号:US16676023
申请日:2019-11-06
Applicant: SanDisk Technologies LLC
Inventor: Zhiping Zhang , Muhammad Masuduzzaman , Huai-Yuan Tseng , Peng Zhang , Dengtao Zhao , Deepanshu Dutta
Abstract: A method reading memory using bi-directional sensing, including programming first memory cells coupled to a first word-line using a normal programming order; programming second memory cells coupled to a second word-line using a normal programming order; reading data from the first memory cells by applying a normal sensing operation to the first word-line; and reading data from the second memory cells by applying a reverse sensing operation to the second word-line. Methods also include receiving an error associated with reading data from the first memory cells; and then reading the data from the first memory cells by applying a reverse sensing operation to the first word-line. Method also include receiving an error associated with reading the data from the second memory cells; and then reading the data from the second memory cells by applying a normal sensing operation to the second word-line.
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24.
公开(公告)号:US11063063B2
公开(公告)日:2021-07-13
申请号:US16710481
申请日:2019-12-11
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Yanli Zhang , Dong-il Moon , Raghuveer S. Makala , Peng Zhang , Wei Zhao , Ashish Baraskar
IPC: H01L29/76 , H01L27/11582 , H01L27/11556 , H01L23/532 , H01L21/311 , H01L27/11526 , H01L27/11565 , H01L27/11573 , H01L21/28 , H01L23/528 , H01L27/11519
Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, memory openings vertically extending through the alternating stack, and memory stack structures extending through the alternating stack. Each of the memory stack structures contains a memory film and a vertical semiconductor channel. At least one of the electrically conductive layers contains a first conductive material portion having a respective inner sidewall that contacts a respective one of the memory films at a vertical interface, and a second conductive material portion that has a different composition from the first conductive material portion, and contacting the first electrically conductive material portion. The first conductive material portion has a lower work function than the second conductive material portion.
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25.
公开(公告)号:US20190378581A1
公开(公告)日:2019-12-12
申请号:US16002836
申请日:2018-06-07
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Dengtao Zhao , Peng Zhang , Nan Lu , Deepanshu Dutta
IPC: G11C16/34 , G11C16/10 , G11C16/08 , G11C16/04 , H01L27/11582 , H01L27/1157
Abstract: Program disturb is a condition that includes the unintended programming of a memory cell while performing a programming process for other memory cells. Such unintended programming can cause an error in the data being stored. In some cases, program disturb can result from electrons trapped in the channel being accelerated from one side of a selected word line to another side of the selected word line and redirected into the selected word line. To prevent such program disturb, it is proposed to open the channel from one side of a selected word line to the other side of the selected word line after a sensing operation for program verify and prior to a subsequent programming voltage being applied.
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公开(公告)号:US10290643B1
公开(公告)日:2019-05-14
申请号:US15876884
申请日:2018-01-22
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: James Kai , Johann Alsmeier , Yanli Zhang , Peng Zhang
IPC: H01L27/11 , H01L29/78 , H01L27/11524 , H01L27/11556 , H01L21/28 , H01L27/11548 , H01L29/788 , H01L27/11529 , H01L27/11551 , H01L27/11582 , H01L27/11578
Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and control gate electrodes located over a substrate, a drain select gate device located above the alternating stack, and a vertical semiconductor channel extending through the alternating stack and through the drain select gate device. The drain select gate device contains a floating gate electrode located between the vertical semiconductor channel and a first drain select gate electrode.
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