Semiconductor device and manufacturing method thereof

    公开(公告)号:US10192995B2

    公开(公告)日:2019-01-29

    申请号:US15131298

    申请日:2016-04-18

    Abstract: A semiconductor device includes a semiconductor, a first conductor, a second conductor, a third conductor, a fourth conductor, a first insulator, a second insulator, a third insulator, and a fourth insulator. The first conductor and the semiconductor partly overlap with each other with the first insulator positioned therebetween. The second conductor and the third conductor have regions in contact with the semiconductor. The semiconductor has a region in contact with the second insulator. The fourth insulator has a first region and a second region. The first region is thicker than the second region. The first region has a region in contact with the second insulator. The second region has a region in contact with the third insulator. The fourth conductor and the second insulator partly overlap with each other with the fourth insulator positioned therebetween.

    Method for manufacturing semiconductor device
    24.
    发明授权
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号:US09496376B2

    公开(公告)日:2016-11-15

    申请号:US14854789

    申请日:2015-09-15

    Abstract: To provide a semiconductor device with improved reliability. To provide a semiconductor device with stable characteristics. To provide a transistor having a low off-state current. To provide a transistor having a high on-state current. To provide a novel semiconductor device, a novel electronic device, or the like. A method for manufacturing the semiconductor device includes the steps of forming a first semiconductor over a substrate; forming a second semiconductor over and in contact with the first semiconductor; forming a first layer over the second semiconductor; performing oxygen plasma treatment and then removing the first layer to expose at least part of a surface of the second semiconductor; forming a third semiconductor over and in contact with the second semiconductor; forming a first insulator over and in contact with the third semiconductor; and forming a first conductor over the first insulator.

    Abstract translation: 提供具有改善的可靠性的半导体器件。 提供具有稳定特性的半导体器件。 提供具有低截止电流的晶体管。 提供具有高导通电流的晶体管。 提供新颖的半导体器件,新颖的电子器件等。 一种制造半导体器件的方法包括以下步骤:在衬底上形成第一半导体; 在第一半导体之上形成第二半导体,并与第一半导体接触; 在所述第二半导体上形成第一层; 执行氧等离子体处理,然后去除第一层以暴露第二半导体的表面的至少一部分; 在所述第二半导体上形成第三半导体并与其接触; 在第三半导体上形成第一绝缘体并与第三半导体接触; 以及在所述第一绝缘体上形成第一导体。

    Semiconductor device
    28.
    发明授权

    公开(公告)号:US10141337B2

    公开(公告)日:2018-11-27

    申请号:US15723227

    申请日:2017-10-03

    Abstract: A nitride insulating film which prevents diffusion of hydrogen into an oxide semiconductor film in a transistor including an oxide semiconductor is provided. Further, a semiconductor device which has favorable electrical characteristics by using a transistor including a silicon semiconductor and a transistor including an oxide semiconductor is provided. Two nitride insulating films having different functions are provided between the transistor including a silicon semiconductor and the transistor including an oxide semiconductor. Specifically, a first nitride insulating film which contains hydrogen is provided over the transistor including a silicon semiconductor, and a second nitride insulating film which has a lower hydrogen content than the first nitride insulating film and functions as a barrier film against hydrogen is provided between the first nitride insulating film and the transistor including an oxide semiconductor.

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