公开(公告)号：US20090165860A1

公开(公告)日：2009-07-02

申请号：US12319013

申请日：2008-12-31

申请人： Hyun Kim ,  Sung Jin Eum ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

发明人： Hyun Kim ,  Sung Jin Eum ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

IPC分类号： H01L31/04 ,  H01J1/63

CPC分类号： H01L51/0084 ,  C09K11/06 ,  C09K2211/1003 ,  C09K2211/1007 ,  C09K2211/1011 ,  C09K2211/1029 ,  C09K2211/1033 ,  C09K2211/1044 ,  C09K2211/1048 ,  C09K2211/1051 ,  C09K2211/1059 ,  C09K2211/186 ,  C09K2211/188 ,  H01L51/0077 ,  H01L51/0085 ,  H01L51/5016 ,  H05B33/14 ,  Y02E10/549

摘要： The present invention relates to an electroluminescent device. More specifically, the electroluminescent device according to the present invention is comprised of a first electrode; a second electrode; and at least one organic layer(s) interposed between the first electrode and the second electrode; and the organic layer comprises one or more organic electroluminescent compound(s) represented by Chemical Formula (1) as host material: L1L2M(Q)y   Chemical Formula 1 wherein, the ligands, L1 and L2 are independently selected from the following structures: wherein, M represents a divalent or trivalent metal; y is 0 when M is a divalent metal, while y is 1 when M is a trivalent metal; Q represents (C6-C60)aryloxy or tri(C6-C60)arylsilyl, and the aryloxy or triarylsilyl of Q may be further substituted by (C1-C60)alkyl or (C6-C60)aryl. The electroluminescent devices according to the invention exhibit excellent color purity and luminous efficiency.

摘要翻译： 本发明涉及电致发光器件。 更具体地，根据本发明的电致发光器件包括第一电极; 第二电极; 以及介于所述第一电极和所述第二电极之间的至少一个有机层; 有机层包含一种或多种由化学式（1）表示的有机电致发光化合物作为主体材料：<？in-line-formula description =“In-line formula”end =“lead”？> L1L2M（Q ）y化学式1 <？in-line-formula description =“In-line Formula”end =“tail”？>其中，配体L1和L2独立地选自以下结构：其中，M表示二价或 三价金属 当M为二价金属时，y为0，而当M为三价金属时y为1; Q表示（C 6 -C 60）芳氧基或三（C 6 -C 60）芳基甲硅烷基，Q的芳氧基或三芳基甲硅烷基可以进一步被（C 1 -C 60）烷基或（C 6 -C 60）芳基取代。 根据本发明的电致发光器件表现出优异的色纯度和发光效率。

公开(公告)号：US20090158784A1

公开(公告)日：2009-06-25

申请号：US12252985

申请日：2008-10-16

申请人： Sung Ryong KIM ,  Ki Chul Woo ,  Dong Soo Lee ,  Dong Won Kim ,  Sung Min Kim ,  Na Eun Kim

发明人： Sung Ryong KIM ,  Ki Chul Woo ,  Dong Soo Lee ,  Dong Won Kim ,  Sung Min Kim ,  Na Eun Kim

IPC分类号： D06F39/08 ,  D06F31/00

CPC分类号： D06F31/00 ,  D06F39/083

摘要： A laundry machine includes a first laundry treating device, and a second laundry treating device arranged adjacent to the first laundry treating device. The second laundry treating device is operable independently of the first laundry treating device. A first draining pipe guides water discharged from the first laundry treating device, and a second draining pipe guides water discharged from the second laundry treating device. A joining pipe is connected to the first and second draining pipes at a joining point.

摘要翻译： 洗衣机包括第一衣物处理装置和邻近第一衣物处理装置布置的第二衣物处理装置。 第二衣物处理装置可独立于第一衣物处理装置操作。 第一排水管引导从第一衣物处理装置排出的水，第二排水管引导从第二衣物处理装置排出的水。 连接管在接合点与第一和第二排水管连接。

公开(公告)号：US20090153039A1

公开(公告)日：2009-06-18

申请号：US12313358

申请日：2008-11-19

申请人： Bo Ra Kim ,  Mi Ae Lee ,  Chi Sik Kim ,  Soo Yong Lee ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

发明人： Bo Ra Kim ,  Mi Ae Lee ,  Chi Sik Kim ,  Soo Yong Lee ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

IPC分类号： H01J1/63 ,  C07C211/57 ,  C07D265/30 ,  C07D277/62 ,  C07F7/00 ,  C07D215/12 ,  C07D235/04 ,  C07D213/00

CPC分类号： C07C211/61 ,  C07C2601/14 ,  C09B57/008 ,  C09K11/06 ,  C09K2211/1014 ,  C09K2211/1029 ,  C09K2211/1033 ,  C09K2211/1037 ,  C09K2211/1044 ,  C09K2211/1092 ,  H01L51/0058 ,  H01L51/006 ,  H01L51/0061 ,  H01L51/0077 ,  H01L51/0081 ,  H05B33/14 ,  Y02E10/549

摘要： The present invention relates to novel organic electroluminescent compounds, organic electroluminescent devices and organic solar cells comprising the same. Specifically, the organic electroluminescent compounds according to the invention are represented by Chemical Formula (1): wherein, R1 and R2 independently represent hydrogen, deuterium, linear or branched (C1-C20)alkyl, (C2-C20)alkenyl, (C2-C20)alkynyl, (C3-C15)cycloalkyl, tri(C1-C20)alkylsilyl, di(C1-C20)alkyl(C6-C20)arylsilyl, tri(C6-C20)arylsilyl, adamantyl, (C7-C15)bicycloalkyl or (C4-C20)heteroaryl, and the alkyl, alkenyl, alkynyl, cycloalkyl, trialkylsilyl, dialkylarylsilyl, triarylsilyl, adamantyl, bicycloalkyl or heteroaryl of R1 and R2 may be further substituted by one or more substituent(s) selected from deuterium, linear or branched (C1-C20)alkyl, (C1-C20)alkenyl, (C1-C20)alkynyl, halogen, phenyl, fluorenyl, naphthyl and anthryl. The electroluminescent compounds according to the present invention are green electroluminescent compounds, of which the luminous efficiency and device lifetime have been maximized.

摘要翻译： 本发明涉及新颖的有机电致发光化合物，有机电致发光器件和包含该有机电致发光器件的有机太阳能电池。 具体地说，根据本发明的有机电致发光化合物由化学式（1）表示：其中，R 1和R 2独立地表示氢，氘，直链或支链（C1-C20）烷基，（C2-C20）烯基，（C2- （C 1 -C 20）烷基甲硅烷基，二（C 1 -C 20）烷基（C 6 -C 20）芳基甲硅烷基，三（C 6 -C 20）芳基甲硅烷基，金刚烷基，（C 7 -C 15） （C 4 -C 20）杂芳基，并且R 1和R 2的烷基，烯基，炔基，环烷基，三烷基甲硅烷基，二烷基芳基甲硅烷基，三芳基甲硅烷基，金刚烷基，二环烷基或杂芳基可以进一步被一个或多个选自氘， 支链（C1-C20）烷基，（C1-C20）烯基，（C1-C20）炔基，卤素，苯基，芴基，萘基和蒽基。 根据本发明的电致发光化合物是绿色电致发光化合物，其发光效率和器件寿命已经最大化。

公开(公告)号：US20090132122A1

公开(公告)日：2009-05-21

申请号：US12276160

申请日：2008-11-21

申请人： Hong Sig Kim ,  Sung Min Kim

发明人： Hong Sig Kim ,  Sung Min Kim

IPC分类号： B60G17/018 ,  F16F9/50

CPC分类号： F16F9/5126 ,  B60G17/06 ,  F16F9/46

摘要： Disclosed herein is a shock absorber capable of controlling damping force characteristics. The shock absorber includes a cylinder filled with an operating fluid, a piston valve disposed inside the cylinder to divide an interior of the cylinder into a first chamber and a second chamber, a piston rod having one end extending outside the cylinder and the other end coupled to the piston valve inside the cylinder, a hollow chamber formed inside the piston rod to communicate with the first and second chambers, a free piston disposed within the hollow chamber to move up and down and to divide the hollow chamber into upper and lower chambers, and a variable part configured to control the damping force characteristics by adjusting a vertical displacement of the free piston.

摘要翻译： 本文公开了一种能够控制阻尼力特性的减震器。 该减震器包括一个填充有工作流体的气缸，一个活塞阀，设置在气缸内部，以将汽缸的内部分隔成第一腔室和第二腔室;活塞杆，其一端延伸到气缸外部，另一端连接 在缸体内的活塞阀，形成在活塞杆的内部以与第一和第二腔室连通的中空室，设置在中空室内的自由活塞，上下移动并将中空室分成上下腔室， 以及可变部件，其构造成通过调节自由活塞的垂直位移来控制阻尼力特性。

公开(公告)号：US07525186B2

公开(公告)日：2009-04-28

申请号：US11647704

申请日：2006-12-29

申请人： Sung Min Kim ,  Min Suk Suh

发明人： Sung Min Kim ,  Min Suk Suh

IPC分类号： H01L25/07 ,  H01L25/18 ,  H01L23/02 ,  H01L23/055 ,  H01L23/12 ,  H01L29/00

CPC分类号： H01L21/76898 ,  H01L23/585 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/0557 ,  H01L2224/056 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/05099

摘要： A stack package comprises a substrate having a circuit pattern; at least two semiconductor chips stacked on the substrate, having a plurality of through-via interconnection plugs and a plurality of guard rings which surround the respective through-via interconnection plugs, and connected with each other by the medium of the through-via interconnection plugs; a molding material for molding an upper surface of the substrate including the stacked semiconductor chips; and solder balls mounted to a lower surface of the substrate.

摘要翻译： 堆叠封装包括具有电路图案的衬底; 堆叠在基板上的至少两个半导体芯片，具有多个通孔互连插头和围绕相应通孔互连插头的多个保护环，并且通过通孔互连插头的介质彼此连接 ; 用于模制包括堆叠的半导体芯片的基板的上表面的模制材料; 以及安装到基板的下表面的焊球。

公开(公告)号：US20090062542A1

公开(公告)日：2009-03-05

申请号：US12220367

申请日：2008-07-24

申请人： Hyun Kim ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

发明人： Hyun Kim ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

IPC分类号： C07F15/00

CPC分类号： C09K11/06 ,  C07F15/0033 ,  C09K2211/1007 ,  C09K2211/1011 ,  C09K2211/1029 ,  C09K2211/185 ,  H01L51/006 ,  H01L51/0081 ,  H01L51/0085 ,  H01L51/5016 ,  Y10S428/917

摘要： The present invention relates to novel red phosphorescent compounds exhibiting high luminous efficiency, and organic electroluminescent devices comprising the same.

公开(公告)号：US20080157357A1

公开(公告)日：2008-07-03

申请号：US11754555

申请日：2007-05-29

申请人： Sung Min Kim ,  Min Suk Suh

发明人： Sung Min Kim ,  Min Suk Suh

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73203 ,  H01L2224/90 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2224/29075 ,  H01L2224/83851 ,  H01L2224/05099

摘要： A stack package includes an upper semiconductor chip having a plurality of first bonding pads which are formed on an upper surface of the upper semiconductor chip and via-holes which are defined in the upper semiconductor chip under the respective first bonding pads; and a lower semiconductor chip attached to a lower surface of the upper semiconductor chip and having a plurality of second bonding pads which are formed on an upper surface of the lower semiconductor chip and bumps which are formed on the respective second bonding pads and are inserted into the respective via-holes to be come into the respective first bonding pads.

摘要翻译： 堆叠封装包括上半导体芯片，其具有形成在上半导体芯片的上表面上的多个第一焊盘和在相应的第一焊盘下方的上半导体芯片中限定的通孔; 以及下半导体芯片，其安装在上半导体芯片的下表面，并且具有多个第二焊盘，其形成在下半导体芯片的上表面上，并且形成在各个第二焊盘上并被插入 各个通孔将进入相应的第一接合焊盘。

公开(公告)号：US07056838B2

公开(公告)日：2006-06-06

申请号：US11197090

申请日：2005-08-04

申请人： Jae Hoon Shim ,  Sung Min Kim ,  Bong Ok Kim ,  No Gil Park ,  Mi Young Kwak ,  Young Kwan Kim

发明人： Jae Hoon Shim ,  Sung Min Kim ,  Bong Ok Kim ,  No Gil Park ,  Mi Young Kwak ,  Young Kwan Kim

IPC分类号： H01L21/31

CPC分类号： H01L51/0516 ,  H01L51/0036 ,  H01L51/0052 ,  H01L51/0545

摘要： Provided is a method for fabricating an organic semiconductor transistor having an organic polymeric gate insulating layer. The method includes forming an organic gate insulating layer on a substrate by a vapor deposition method using organic monomer sources, and causing a polymerization reaction to occur in the organic gate insulating layer to complete an organic polymeric gate insulating layer. Since the vapor deposition method, which is a low-temperature dry-type technique, is employed, the organic polymeric gate insulating layer can be uniformly formed on a large-area substrate by a simplified in-situ process.

公开(公告)号：US09640285B2

公开(公告)日：2017-05-02

申请号：US13335197

申请日：2011-12-22

申请人： Jung Cheol Shin ,  Sang Kyun Woo ,  Yong Chan Kim ,  Sung Min Kim ,  Chae Joon Lim

发明人： Jung Cheol Shin ,  Sang Kyun Woo ,  Yong Chan Kim ,  Sung Min Kim ,  Chae Joon Lim

IPC分类号： G21C17/06

CPC分类号： G21C17/06

摘要： Provided are a probe and an apparatus for measuring a thickness of an oxide layer of a fuel rod, capable of testing claddings of inner and outer fuel rods of a nuclear fuel assembly without disassembling the nuclear fuel assembly. The probe includes a fuel rod transfer region on which an eddy current sensor capable of continuously testing claddings of outer fuel rods of a fixed nuclear fuel assembly is mounted. Further, the apparatus includes a frame in which a cylinder driven in upward and downward directions is mounted, a first probe connected to one side of the cylinder in order to test claddings of outer fuel rods of a nuclear fuel assembly, and a second probe connected to the other side of the cylinder in order to test claddings of inner fuel rods of the nuclear fuel assembly.

公开(公告)号：US09416953B2

公开(公告)日：2016-08-16

申请号：US14113126

申请日：2012-04-19

申请人： Sung Min Kim ,  Kwang Jae Lee

发明人： Sung Min Kim ,  Kwang Jae Lee

IPC分类号： F21V29/02 ,  F21V29/00 ,  F21K99/00 ,  F21V29/77 ,  F21Y101/02

CPC分类号： F21V29/773 ,  F21K9/23 ,  F21K9/232 ,  F21V29/004 ,  F21Y2101/00 ,  F21Y2115/10

摘要： Provided is an LED lighting apparatus. The LED lighting apparatus include an LED, a socket part supplying a power into the LED, a heat sink body having one side on which the LED is mounted and the other side to which the socket part is coupled, and a heat sink pin disposed along a circumference of the heat sink body, the heat sink pin having one side extending downward from the heat sink body. The heat sink body may be modified in shape to reduce a weight and improve heat dissipation performance.

摘要翻译： 提供了一种LED照明装置。 LED照明装置包括LED，向LED提供电力的插座部分，具有LED的一侧的散热体和与插座部分耦合的另一侧，以及沿着 所述散热体的周边，所述散热片的一侧从所述散热体本体向下延伸。 散热体的形状可以被改变以减轻重量并改善散热性能。