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公开(公告)号：US10381157B2
公开(公告)日：2019-08-13
申请号：US15928752
申请日：2018-03-22
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Katsumi Kobayashi , Sunao Masuda , Masahiro Mori , Kayou Matsunaga , Kosuke Yazawa
Abstract: A ceramic electronic device includes a chip component and a pair of metal terminals. The component includes a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes covering end surfaces of the body and a part of side surfaces of the body. The pair of metal terminals respectively has an engagement arm portion configured to hold the component. The terminal electrode includes first and second side surfaces. The first side surface has a predetermined side-surface electrode thickness. The second side surface is disposed farther from the end surface of the body than the first side surface and has the side-surface electrode thickness which is smaller than that of the first side surface. The arm portion contacts with the component at a position that is farther from the end surface of the body than the first side surface.
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公开(公告)号：US09892855B2
公开(公告)日：2018-02-13
申请号：US15275953
申请日：2016-09-26
Applicant: TDK CORPORATION
Inventor： Norihisa Ando , Atsushi Takeda , Hideki Kaneko , Yui Sugiura , Tatsuo Inagaki , Tomomichi Gunji , Kouhei Yamaguchi
Abstract: An external electrode includes a sintered metal layer disposed on at least an end surface and a conductive resin layer disposed on the sintered metal layer. The sintered metal layer includes a first portion, a second portion, and a third portion. The first portion is disposed at a central region of the end surface. The second portion is disposed at a part of a peripheral region of the end surface, and extends to an edge portion of the end surface from the first portion. The third portion is disposed at a remaining part of the peripheral region of the end surface. The thickness of the second portion is less than that of the first portion. The thickness of the third portion is less than that of the second portion. The first portion, the second portion, and the third portion are covered with the conductive resin layer.
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公开(公告)号：US20230268128A1
公开(公告)日：2023-08-24
申请号：US18154165
申请日：2023-01-13
Applicant: TDK CORPORATION
Inventor： Akihiro MASUDA , Shinya ITO , Norihisa Ando , Hideki Kaneko , Ken Aburakawa , Kenya Tamaki , Akitoshi Yoshii
Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.
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公开(公告)号：US11646163B2
公开(公告)日：2023-05-09
申请号：US17228822
申请日：2021-04-13
Applicant: TDK CORPORATION
Inventor： Akihiro Masuda , Shinya Ito , Norihisa Ando , Kosuke Yazawa , Yoshiki Satou , Katsumi Kobayashi , Toshihiro Iguchi , Kenya Tamaki , Shinya Saito
Abstract: An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.
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公开(公告)号：US11615920B2
公开(公告)日：2023-03-28
申请号：US17062736
申请日：2020-10-05
Applicant: TDK CORPORATION
Inventor： Akihiro Masuda , Norihisa Ando , Shinya Ito
Abstract: A ceramic electronic device includes a ceramic element body, a terminal electrode, and a lead terminal. The ceramic element body has an end surface and a lateral surface. The terminal electrode is formed on from the end surface to a part of the lateral surface of the ceramic element body. The lead terminal is connected to the terminal electrode by a connection member. The lead terminal includes an electrode facing portion disposed correspondingly to an end-surface electrode of the terminal electrode, an extension unit extending downward from a lower end of the electrode facing portion, and a step surface located between the electrode facing portion and the extension unit. The electrode facing portion has a recess dented in a direction away from the terminal electrode. A center of the recess is located below a center of the electrode facing portion in a height direction.
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Patent Agency Ranking
公开(公告)号：US11443897B2
公开(公告)日：2022-09-13
申请号：US17243961
申请日：2021-04-29
Applicant: TDK CORPORATION
Inventor： Toshihiro Iguchi , Norihisa Ando , Kenya Tamaki , Kayou Matsunaga
Abstract: An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.
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公开(公告)号：US11443896B2
公开(公告)日：2022-09-13
申请号：US17373672
申请日：2021-07-12
Applicant: TDK CORPORATION
Inventor： Toshihiro Iguchi , Norihisa Ando
Abstract: An electronic component includes an element body, a pair of external electrodes respectively disposed at both ends of the element body in a first direction, and a pair of metal terminals respectively connected to the pair of external electrodes with solder. Each metal terminal includes a connection opposing the corresponding external electrode in the first direction and formed with a plurality of grooves and includes a leg extending from the connection. The connection includes a pair of end edges separated from each other in a third direction intersecting with a second direction where the leg extends from the connection. The grooves extend in a direction different from the second direction and intersecting with the third direction so that the grooves are separated from one of the pair of end edges. A surface included in the connection and defining each of the grooves is in contact with the solder.
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公开(公告)号：US11367572B2
公开(公告)日：2022-06-21
申请号：US16988819
申请日：2020-08-10
Applicant: TDK CORPORATION
Inventor： Akihiro Masuda , Norihisa Ando , Shinya Ito , Kosuke Yazawa , Yoshiki Satou , Katsumi Kobayashi
Abstract: A conductive terminal includes an inner electrode part, an opening edge electrode part, and a lateral electrode part. The inner electrode part is connectable to a terminal electrode of a chip component by being inserted along an inner wall of an accommodation recess of a case. The opening edge electrode part is formed continuously to the inner electrode part. The lateral electrode part is formed continuously to the opening edge electrode part along an outer surface of the case. The inner electrode part includes a base part, a curved part, and a continuous boundary part. The base part continues to the opening edge electrode part. The curved part is formed near a tip of the base part and protrudes away from the lateral electrode part. The continuous boundary part is formed between the base part and the curved part and continuously connects them.
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公开(公告)号：US11158460B2
公开(公告)日：2021-10-26
申请号：US17006100
申请日：2020-08-28
Applicant: TDK CORPORATION
Inventor： Akihiro Masuda , Norihisa Ando , Shinya Ito
Abstract: A ceramic electronic component of the present invention includes: a ceramic element body; a terminal electrode formed on from an end surface to a side surface of the ceramic element body; and a lead terminal joined to the terminal electrode by a solder. A fillet of the solder is formed between the terminal electrode of a side surface at the ceramic element body and the lead terminal, and a coating layer is formed on a surface of the lead terminal that is in contact with the solder. The coating layer is formed of a metal component having a contact angle with the solder smaller than that of the lead terminal.
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公开(公告)号：US11140781B2
公开(公告)日：2021-10-05
申请号：US16659621
申请日：2019-10-22
Applicant: TDK CORPORATION
Inventor： Kosuke Yazawa , Norihisa Ando , Shinya Ito , Akihiro Masuda
Abstract: An electronic device includes chip components, a terminal connection body, conductive terminals, and a support member. Each of the chip components has a pair of end surfaces on which terminal electrodes are formed. The terminal connection body connects the terminal electrodes on one side of the chip components arranged next to each other in a parallel direction to the end surfaces. Each of the conductive terminals includes a connection part and a mount part. The connection part is connected with the terminal electrode of either of the chip components located on both ends of the chip components connected in series via the terminal connection body. The mount part faces the connection part and is connected with a mount board. The support member is disposed between the connection parts and the mount parts. The chip components are arranged so that the end surfaces face the mount board.
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