公开(公告)号：US20140016290A1

公开(公告)日：2014-01-16

申请号：US13615878

申请日：2012-09-14

Applicant: Seung Min LEE ,  Tae Hoon KIM ,  Ho Joon PARK ,  Wan Jae LEE

Inventor： Seung Min LEE ,  Tae Hoon KIM ,  Ho Joon PARK ,  Wan Jae LEE

IPC: H05K1/14 ,  H05K3/00

CPC classification number: H05K3/4638 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/144 ,  H05K2203/167 ,  Y10T29/49105

Abstract: Disclosed herein is a touch panel including: a first transparent substrate partitioned into an active area and a bezel area provided in edges of the active area; a mark formed so as to protrude on the bezel area; and a second transparent substrate coupled to the first transparent substrate so that at least one corner thereof corresponds to the mark.

Abstract translation: 这里公开了一种触摸面板，包括：被分割成有源区域的第一透明衬底和设置在有源区域的边缘中的边框区域; 形成为在所述边框区域突出的标记; 以及耦合到所述第一透明基板的第二透明基板，使得其至少一个角部对应于所述标记。

公开(公告)号：US20130269991A1

公开(公告)日：2013-10-17

申请号：US13549174

申请日：2012-07-13

Applicant: Youn Soo KIM ,  Jae Chan PARK ,  Young Jae KIM ,  Tae Hoon KIM

Inventor： Youn Soo KIM ,  Jae Chan PARK ,  Young Jae KIM ,  Tae Hoon KIM

IPC: H05K1/00 ,  H05K1/09

CPC classification number: G06F3/044 ,  G02B3/0056 ,  G02B3/0075 ,  G06F3/045

Abstract: Disclosed herein is a touch panel. A touch panel 100 according to a preferred embodiment of the present invention is configured to include a first transparent substrate 110, electrode patterns 120 formed on the first transparent substrate 110, a second transparent substrate 130 disposed more outwardly than the first transparent substrate 110, and micro lenses 140 formed on the second transparent substrate 130 to correspond to the electrode patterns 120 so as to focus an erected virtual image I of the electrode patterns 120 having magnification of 1 or less thereon. By this configuration, a user 150 recognizes the erected virtual images I of the electrode pattern 120 with the reduced magnification of 1 or less through the micro lenses 140, thereby improving the visibility of the touch panel 100.

Abstract translation: 这里公开了触摸面板。 根据本发明的优选实施例的触摸面板100被配置为包括第一透明基板110，形成在第一透明基板110上的电极图案120，比第一透明基板110更向外设置的第二透明基板130，以及 形成在第二透明基板130上以对应于电极图案120的微透镜140，以便聚焦其上具有1或更小的放大倍数的电极图案120的竖立虚像I。 通过这种配置，用户150通过微透镜140以缩小的1倍或更小的倍率来识别电极图案120的竖立虚像I，从而提高触摸面板100的可见度。

公开(公告)号：US20130037967A1

公开(公告)日：2013-02-14

申请号：US13308441

申请日：2011-11-30

Applicant: Jong Man KIM ,  Young Hoon KWAK ,  Kyu Hwan OH ,  Seog Moon CHOI ,  Tae Hoon KIM

Inventor： Jong Man KIM ,  Young Hoon KWAK ,  Kyu Hwan OH ,  Seog Moon CHOI ,  Tae Hoon KIM

IPC: H01L23/488

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83385 ,  H01L2224/834 ,  H01L2224/83411 ,  H01L2224/83418 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/83471 ,  H01L2224/8348 ,  H01L2224/83484 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00

Abstract: Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.

Abstract translation: 本发明公开了一种半导体封装基板，其包括基底基板，安装在基底基板的上部的安装部件和形成在基底基板与安装部件之间的粘合层，其中粘合层包括导热粘合剂和 在导热粘合剂的外周形成的韧性粘合剂。

公开(公告)号：US20120120707A1

公开(公告)日：2012-05-17

申请号：US13249524

申请日：2011-09-30

Applicant: Tae Hoon KIM

Inventor： Tae Hoon KIM

IPC: G11C17/12

CPC classification number: G11C17/12

Abstract: A semiconductor device with an OTP memory cell includes a first MOS transistor having a first gate terminal connected to a first line, and a first terminal connected to a first node, a second MOS transistor having a second gate terminal connected to a second line, and a first terminal connected to the first node, and a third MOS transistor having a gate terminal connected to a three line, and a first terminal of the third MOS transistor connected to the first node.

Abstract translation: 具有OTP存储单元的半导体器件包括具有连接到第一线的第一栅极端子和与第一节点连接的第一端子的第一MOS晶体管，具有与第二线路连接的第二栅极端子的第二MOS晶体管，以及 连接到第一节点的第一端子和连接到三线的栅极端子的第三MOS晶体管，以及连接到第一节点的第三MOS晶体管的第一端子。

公开(公告)号：US20160186053A1

公开(公告)日：2016-06-30

申请号：US14981887

申请日：2015-12-28

Applicant: Chan Suk MIN ,  Tae Hoon KIM ,  Jong Won PARK ,  Ji Ho YOU ,  Jeong Rok OH ,  Chul Soo YOON ,  In Hyung LEE ,  Chi Woo LEE

Inventor： Chan Suk MIN ,  Tae Hoon KIM ,  Jong Won PARK ,  Ji Ho YOU ,  Jeong Rok OH ,  Chul Soo YOON ,  In Hyung LEE ,  Chi Woo LEE

IPC: C09K11/61 ,  B08B3/12 ,  B05D1/18 ,  C09K11/02

CPC classification number: C09K11/617 ,  C09K11/025 ,  H01L33/00 ,  H01L33/502 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0041 ,  Y02B20/181 ,  H01L2924/00012

Abstract: A method of manufacturing a fluoride phosphor, the method comprising: preparing a hydrofluoric (HF) solution in which a first source material and a fluoride containing Mn4+ are dissolved; and forming fluoride particles by introducing a second source material to the HF solution in each of a plurality of instances.

Abstract translation: 一种制造氟化物荧光体的方法，所述方法包括：制备其中溶解有第一源材料和含有Mn4 +的氟化物的氢氟酸（HF）溶液; 并且在多种情况下，在HF溶液中引入第二源材料形成氟化物粒子。

公开(公告)号：US20160133799A1

公开(公告)日：2016-05-12

申请号：US14839798

申请日：2015-08-28

Applicant: Jong Won PARK ,  In Hyung LEE ,  Tae Hoon KIM ,  Ji Ho YOU ,  Chi Woo LEE ,  Chul Soo YOON

Inventor： Jong Won PARK ,  In Hyung LEE ,  Tae Hoon KIM ,  Ji Ho YOU ,  Chi Woo LEE ,  Chul Soo YOON

IPC: H01L33/50 ,  H01L33/52 ,  C09K11/61

CPC classification number: H01L33/502 ,  C09K11/617 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A fluoride phosphor may include: a fluoride represented by a composition formula: AxMFy:Mnz4+, where A is at least one selected from among Li, Na, K, Rb, and Cs, M is at least one selected from among Si, Ti, Zr, Hf, Ge and Sn, a composition ratio (x) of A satisfies 2≦x≦3, a composition ratio (y) of F satisfies 4≦y≦7, and a composition ratio (z) of Mn satisfies 0

Abstract translation: 氟化物荧光体可以包括：由组成式：AxMFy：Mnz4 +表示的氟化物，其中A为选自Li，Na，K，Rb和Cs中的至少一种，M为选自Si，Ti， Zr，Hf，Ge和Sn中，A的组成比（x）满足2＆nlE; x＆lt; ll; 3，F的组成比（y）满足4＆lt; nlE; y＆nlE; 7，Mn的组成比（z）满足0 < z＆nlE; 0.17。

公开(公告)号：US20130026616A1

公开(公告)日：2013-01-31

申请号：US13557834

申请日：2012-07-25

Applicant: Suk Ho LEE ,  Jae Cheon DOH ,  Young Hoon KWAK ,  Tae Hoon KIM ,  Tao Jyun KIM ,  Young Ki LEE

Inventor： Suk Ho LEE ,  Jae Cheon DOH ,  Young Hoon KWAK ,  Tae Hoon KIM ,  Tao Jyun KIM ,  Young Ki LEE

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/4334 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1017 ,  H01L2225/1047 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1515 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015

Abstract: The present invention relates to a power device package module and a manufacturing method thereof. In one aspect of the present invention, a power device package module includes: a control unit a first lead frame, a control chip and a first coupling portion that are mounted on a first substrate, wherein the first lead frame and the first coupling portion are electrically connected to the control chip, and individually molded; and a power unit including a second lead frame, a power chip and a second coupling portion that are mounted on a second substrate, wherein the second lead frame and the second coupling portion are electrically connected to the power chip, and individually molded, wherein the individually molded control unit and power unit are coupled by the first coupling portion and the second coupling portion.

Abstract translation: 功率器件封装模块及其制造方法技术领域本发明涉及功率器件封装模块及其制造方法。 在本发明的一个方面，功率器件封装模块包括：控制单元，安装在第一衬底上的第一引线框架，控制芯片和第一耦合部分，其中第一引线框架和第一耦合部分是 电连接到控制芯片，并单独模制; 以及功率单元，其包括安装在第二基板上的第二引线框架，功率芯片和第二耦合部分，其中所述第二引线框架和所述第二耦合部分电连接到所述功率芯片，并且分别模制，其中 单独模制的控制单元和动力单元通过第一联接部分和第二联接部分联接。