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21.发明申请ENDPOINT DETECTION IN CHEMICAL MECHANICAL POLISHING USING MULTIPLE SPECTRA 审中-公开使用多个光谱的化学机械抛光中的端点检测公开(公告)号：US20090275265A1
公开(公告)日：2009-11-05
申请号：US12431532
申请日：2009-04-28
申请人： Jun Qian , Sivakumar Dhandapani , Harry Q. Lee , Thomas H. Osterheld , Zhize Zhu
发明人： Jun Qian , Sivakumar Dhandapani , Harry Q. Lee , Thomas H. Osterheld , Zhize Zhu
CPC分类号： B24B37/013 , B24B49/12
摘要： A computer implemented method includes obtaining at least one current spectrum with an in-situ optical monitoring system, comparing the current spectrum to a plurality of different reference spectra, and determining based on the comparing whether a polishing endpoint has been achieved for the substrate having the outermost layer undergoing polishing. The current spectrum is a spectrum of light reflected from a substrate having an outermost layer undergoing polishing and at least one underlying layer. The plurality of reference spectra represent spectra of light reflected from substrates with outermost layers having the same thickness and underlying layers having different thicknesses.
摘要翻译： 计算机实现的方法包括：利用原位光学监测系统获得至少一个当前频谱，将当前频谱与多个不同的参考光谱进行比较，并且基于比较是否已经实现了具有 最外层进行抛光。 当前的光谱是从具有正在研磨的最外层的基底和至少一个下层反射的光的光谱。 多个参考光谱表示从具有相同厚度的最外层和具有不同厚度的下层的基底反射的光的光谱。
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22.发明授权Polishing pad having a grooved pattern for use in chemical mechanical polishing 有权具有用于化学机械抛光的带槽图案的抛光垫公开(公告)号：US06645061B1
公开(公告)日：2003-11-11
申请号：US09441633
申请日：1999-11-16
IPC分类号： B24D1100
CPC分类号： B24B37/26
摘要： A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
摘要翻译： 一种用于化学机械抛光装置的抛光垫。 抛光垫包括多个同心的圆形槽。 抛光垫可以包括具有不同宽度和间隔的凹槽的多个区域。
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23.发明申请公开(公告)号：US20200005140A1
公开(公告)日：2020-01-02
申请号：US16449183
申请日：2019-06-21
IPC分类号： G06N3/08 , G06N3/04 , G05B19/4063
摘要： A method of generating training spectra for training of a neural network includes generating a plurality of theoretically generated initial spectra from an optical model, sending the plurality of theoretically generated initial spectra to a feedforward neural network to generate a plurality of modified theoretically generated spectra, sending an output of the feedforward neural network and empirically collected spectra to a discriminatory convolutional neural network, determining that the discriminatory convolutional neural network does not discriminate between the modified theoretically generated spectra and empirically collected spectra, and thereafter, generating a plurality of training spectra from the feedforward neural network.
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公开(公告)号：US20130276979A1
公开(公告)日：2013-10-24
申请号：US13917250
申请日：2013-06-13
IPC分类号： B24B41/06
摘要： A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.
摘要翻译： 用于化学机械抛光装置的承载头包括具有柔性下部和刚性上部的保持环。
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公开(公告)号：US08562389B2
公开(公告)日：2013-10-22
申请号：US12130670
申请日：2008-05-30
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.
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公开(公告)号：US20130203321A1
公开(公告)日：2013-08-08
申请号：US13749554
申请日：2013-01-24
IPC分类号： B24B37/005 , B24B37/32 , B24B37/34
CPC分类号： B24B37/005 , B24B37/32 , B24B37/345
摘要： A load cup apparatus for transferring a substrate in a processing system includes a pedestal assembly having a substrate support, an actuator, and a controller. The actuator is configured to move the pedestal assembly into a loading position in contact with a retaining ring of a carrier head and to generate a retaining ring thickness signal based on a distance travelled by the pedestal assembly. The controller is configured to receive the retaining ring thickness signal from the actuator.
摘要翻译： 用于在处理系统中传送衬底的装载杯装置包括具有衬底支撑件，致动器和控制器的基座组件。 致动器构造成将基座组件移动到与承载头的保持环接触的装载位置，并且基于由基座组件行进的距离产生保持环厚度信号。 控制器被配置为从致动器接收保持环厚度信号。
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公开(公告)号：US20130189841A1
公开(公告)日：2013-07-25
申请号：US13354939
申请日：2012-01-20
申请人： Mihaela Balseanu , Li-Qun Xia , Derek R. Witty , Thomas H. Osterheld , Christopher Heung-Gyun Lee , William H. McClintock
发明人： Mihaela Balseanu , Li-Qun Xia , Derek R. Witty , Thomas H. Osterheld , Christopher Heung-Gyun Lee , William H. McClintock
IPC分类号： H01L21/306
CPC分类号： H01L21/02126 , H01L21/02167 , H01L21/02274 , H01L21/31053 , H01L21/823807 , H01L29/66545 , H01L29/7843
摘要： A method for forming an integrated circuit is provided. In one embodiment, the method includes forming a stop layer comprising carbon doped silicon nitride on a gate region on a substrate, the gate region having a poly gate and one or more spacers formed adjacent the poly gate, forming a dielectric layer on the stop layer, and removing a portion of the dielectric layer above the gate region using a CMP process, wherein the stop layer is a strain inducing layer having a CMP removal rate that is less than the CMP removal rate of the dielectric layer and equal to or less than the CMP removal rate of the one or more spacers.
摘要翻译： 提供一种用于形成集成电路的方法。 在一个实施例中，该方法包括在衬底上的栅极区域上形成包含碳掺杂氮化硅的阻挡层，栅极区域具有多晶硅栅极和与多晶硅栅极相邻形成的一个或多个间隔区，在阻挡层上形成电介质层 并且使用CMP工艺去除所述栅极区域上方的所述电介质层的一部分，其中所述阻挡层是具有小于所述介电层的CMP去除速率的CMP去除速率的应变诱导层，并且等于或小于 一个或多个间隔物的CMP去除速率。
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公开(公告)号：US20120021671A1
公开(公告)日：2012-01-26
申请号：US12843793
申请日：2010-07-26
申请人： Peter McReynolds , Eric S. Rondum , Garlen C. Leung , Adam H. Zhong , Gregory E. Menk , Gopalakrishna B. Prabhu , Thomas H. Osterheld
发明人： Peter McReynolds , Eric S. Rondum , Garlen C. Leung , Adam H. Zhong , Gregory E. Menk , Gopalakrishna B. Prabhu , Thomas H. Osterheld
IPC分类号： B24B49/12
CPC分类号： B24B37/005 , B24B37/042 , B24B37/32
摘要： A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, a method for monitoring at least one surface of a retaining ring coupled to a carrier head is provided. The method includes moving the carrier head adjacent a sensor device disposed in a polishing module, transmitting energy from the sensor device toward the retaining ring, receiving energy reflected from the retaining ring, and determining a condition of the retaining ring based on the received energy.
摘要翻译： 描述了一种用于监测设置在抛光模块中的载体头上的保持环的表面状况的方法和装置。 在一个实施例中，提供一种用于监测联接到承载头的保持环的至少一个表面的方法。 该方法包括使载体头靠近设置在抛光模块中的传感器装置移动，将能量从传感器装置传递到保持环，接收从保持环反射的能量，以及基于所接收的能量来确定保持环的状态。
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公开(公告)号：US20120018093A1
公开(公告)日：2012-01-26
申请号：US13246614
申请日：2011-09-27
IPC分类号： C23F1/08
摘要： A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.
摘要翻译： 用于化学机械抛光装置的承载头包括具有柔性下部和刚性上部的保持环。
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30.发明授权Chemical mechanical polishing a substrate having a filler layer and a stop layer 有权化学机械抛光具有填料层和停止层的基材公开(公告)号：US07201636B2
公开(公告)日：2007-04-10
申请号：US11075778
申请日：2005-03-08
CPC分类号： H01L21/76819 , B24B37/04 , B24B37/042 , H01L21/31053 , H01L21/3212 , H01L21/7684
摘要： A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.
摘要翻译： 将基材用高选择性浆料进行化学机械抛光，直至止挡层至少部分暴露，然后用低选择性浆料抛光基材直到停止层完全暴露。
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