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    Semiconductor encapsulating epoxy resin composition and semiconductor device
    22.
    发明申请
    Semiconductor encapsulating epoxy resin composition and semiconductor device 有权
    半导体封装环氧树脂组合物和半导体器件

    公开(公告)号：US20060216519A1

    公开(公告)日：2006-09-28

    申请号：US11386667

    申请日：2006-03-23

    申请人： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

    发明人： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

    IPC分类号： B32B27/38 ,  H01L21/56 ,  C08L63/00 ,  C08G59/00

    CPC分类号： H01L23/293 ,  C08G59/245 ,  C08G59/3218 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/16 ,  H01L2924/00

    摘要： An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

    摘要翻译： 一种环氧树脂组合物，其包含（A）至少一种环氧树脂，其包含（a）在分子中具有至少一个取代或未取代的萘环并且具有175至210的环氧当量的含萘环的环氧树脂，（B） 在分子中具有至少一个取代或未取代的萘环的酚醛树脂和（C）无机填料，所述环氧树脂（a）中的取代或未取代的萘环的含量为45〜60重量％ 环氧树脂（A）的总量最适合于半导体封装，因为它具有良好的流动性，低的线性膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

    Epoxy resin composition and semiconductor device
    25.
    发明申请
    Epoxy resin composition and semiconductor device 审中-公开
    环氧树脂组合物和半导体器件

    公开(公告)号：US20070029682A1

    公开(公告)日：2007-02-08

    申请号：US11498179

    申请日：2006-08-03

    申请人： Takayuki Aoki ,  Toshio Shiobara

    发明人： Takayuki Aoki ,  Toshio Shiobara

    IPC分类号： H01L23/29

    CPC分类号： H01L23/293 ,  C08G59/621 ,  C08K5/54 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a cure accelerator, (E) an adhesion promoter, and (F) a metal oxide. The metal oxide (F) is a combination of a magnesium/aluminum ion exchanger, a hydrotalcite ion exchanger, and a rare earth oxide in a ratio of 0.5-20:0.5-20:0.01-10 pbw, relative to 100 pbw of epoxy resin (A) and curing agent (B) combined.

    摘要翻译： 提供一种环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）无机填料，（D）固化促进剂，（E）粘合促进剂和（F）金属 氧化物。 金属氧化物（F）是镁/铝离子交换剂，水滑石离子交换剂和稀土氧化物的组合，相对于100pbw的环氧树脂，其比例为0.5-20:0.5-20:0.01-10pbw 树脂（A）和固化剂（B）组合。

    IMAGE PROCESSING APPARATUS, AND IMAGE FORMING APPARATUS
    28.
    发明申请
    IMAGE PROCESSING APPARATUS, AND IMAGE FORMING APPARATUS 有权
    图像处理装置和图像形成装置

    公开(公告)号：US20080278763A1

    公开(公告)日：2008-11-13

    申请号：US12108140

    申请日：2008-04-23

    申请人： Takayuki Aoki

    发明人： Takayuki Aoki

    IPC分类号： H04N1/405 ,  G06K15/02

    CPC分类号： H04N1/6072 ,  G03G15/0115 ,  G03G15/5025 ,  H04N1/4053

    摘要： When a second detector determines that a character image has a halftone (YES in #1) and a third detector (48) determines that a font size of the character image is equal to or greater than a threshold value β and equal to or smaller than a threshold value α (YES in step #4), a fourth detector determines whether a presently focused pixel constitutes a particular portion of a character (step #5). When the fourth detector determines that the pixel data of the presently focused pixel constitutes the particular portion of the character (YES in step #5), the image processing section sets the pixel data to be subjected to a second screen processing which is performed at a higher gradation level (step #6).

    摘要翻译： 当第二检测器确定字符图像具有半色调（＃1中为是），并且第三检测器（48）确定字符图像的字体大小等于或大于阈值β并等于或小于 阈值α（步骤＃4中为“是”），第四检测器确定当前聚焦像素是否构成字符的特定部分（步骤＃5）。 当第四检测器确定当前聚焦像素的像素数据构成字符的特定部分时（步骤＃5中为“是”），图像处理部分将要进行第二屏幕处理的像素数据设置为在 较高的灰度级（步骤＃6）。

    Method and apparatus for measuring angle of bend, method of bending, and apparatus for controlling angle of bend
    30.
    发明授权
    Method and apparatus for measuring angle of bend, method of bending, and apparatus for controlling angle of bend 失效
    用于测量弯曲角度的方法和装置，弯曲方法以及用于控制弯曲角度的装置

    公开(公告)号：US06708541B1

    公开(公告)日：2004-03-23

    申请号：US09744957

    申请日：2001-02-08

    申请人： Masateru Matsumoto ,  Kazuyuki Uchida ,  Kenichi Tsuchiura ,  Takayuki Aoki

    发明人： Masateru Matsumoto ,  Kazuyuki Uchida ,  Kenichi Tsuchiura ,  Takayuki Aoki

    IPC分类号： B21D714

    CPC分类号： G01B11/26 ,  B21D5/006 ,  B21D5/02 ,  G05B2219/37574 ,  G05B2219/45143 ,  Y10S72/702

    摘要： An angle detecting head provided with an emitter and a pair of receivers is rocked, and a bent surface of a workpiece bent by a punch and a die of a bending machine is irradiated with a measurement light from the emitter, a reflected light is received by the pair of receivers, and a bending angle of the workpiece is obtained from a peak value of the light received by the respective receivers. The angle detecting head is movable parallel to the die, is movable in a direction close to and away from the workpiece, and is movable in a direction in which the die is raised/lowered. The angle detecting head is positioned in an optimum angle measurement position of the workpiece and the bending angle is measured. Moreover, the bending machine presses the workpiece to the vicinity of a target angle, measures the bending angle of the workpiece during final pressing, removes pressure to bring the workpiece to an unloaded state, measures the bending angle of the workpiece, and obtains and stores a difference between the final pressing angle measured value and the unloaded angle measured value as a spring-back amount.

    摘要翻译： 设置有发射器和一对接收器的角度检测头被摇动，用来自发射器的测量光照射由冲头和弯曲机的模具弯曲的工件的弯曲表面，反射光被 一对接收器和工件的弯曲角度由各个接收器接收的光的峰值获得。 角度检测头可平行于模具移动，可在靠近和远离工件的方向上移动，并且可在模具升高/降低的方向上移动。 角度检测头位于工件的最佳角度测量位置，并测量弯曲角度。 此外，弯曲机将工件压在目标角附近，测量最终加压时工件的弯曲角度，去除压力以使工件处于无负载状态，测量工件的弯曲角度，并获得并存储 最终按压角度测量值与无负载角度测量值之间的差作为回弹量。