公开(公告)号：US07777310B2

公开(公告)日：2010-08-17

申请号：US11670862

申请日：2007-02-02

申请人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Trasporto

发明人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Trasporto

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/49503 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.

摘要翻译： 提供一种集成电路封装系统，包括在所述桨和所述外引线之间形成桨，外引线和内引线; 形成所述桨叶的非垂直桨叶边缘和所述内部导杆的面向所述非垂直桨叶边缘的非垂直前缘; 并将集成电路管芯封装在所述桨上。

公开(公告)号：US20080185693A1

公开(公告)日：2008-08-07

申请号：US11670862

申请日：2007-02-02

申请人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Trasporto

发明人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Trasporto

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01L23/49503 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.

摘要翻译： 提供一种集成电路封装系统，包括在所述桨和所述外引线之间形成桨，外引线和内引线; 形成所述桨叶的非垂直桨叶边缘和所述内部导杆的面向所述非垂直桨叶边缘的非垂直前缘; 并将集成电路管芯封装在所述桨上。

公开(公告)号：US20110079888A1

公开(公告)日：2011-04-07

申请号：US12889911

申请日：2010-09-24

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jeffrey D. Punzalan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jeffrey D. Punzalan

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/49582 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge.

摘要翻译： 一种制造集成电路封装系统的方法，包括：形成具有管芯连接板和通过连接件连接的接触焊盘的引线框架; 在芯片附接板上安装集成电路管芯; 在所述引线框架和所述集成电路管芯上形成封装主体，所述封装主体包括从所述封装主体露出的所述管芯附接焊盘，所述接触焊盘和所述连接部分的部分; 通过蚀刻掉接触垫和管芯附接板之间的连接来形成暴露的边缘; 以及在暴露的边缘上沉积耐焊层。

公开(公告)号：US07901996B2

公开(公告)日：2011-03-08

申请号：US12484131

申请日：2009-06-12

申请人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Jeffrey D. Punzalan ,  Zigmund Ramirez Camacho

发明人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Jeffrey D. Punzalan ,  Zigmund Ramirez Camacho

IPC分类号： H01L21/00 ,  H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/3841 ,  Y10T29/49121 ,  Y10T29/49169 ,  Y10T29/49181

摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.

摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路上的芯片支持。

公开(公告)号：US08039947B2

公开(公告)日：2011-10-18

申请号：US11749693

申请日：2007-05-16

申请人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

发明人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system is provided including forming a first inner lead having a first inner bottom side and a first outer lead, forming a first side lock of the first inner lead above the first inner bottom side, connecting an integrated circuit die with the first inner lead and the first outer lead, and encapsulating the integrated circuit die and the first side lock.

摘要翻译： 提供一种集成电路封装系统，包括形成具有第一内底侧和第一外引线的第一内引线，在第一内底侧上形成第一内引线的第一侧锁，将集成电路管芯与第一内引线 内引线和第一外引线，并封装集成电路管芯和第一侧锁。

公开(公告)号：US20080006929A1

公开(公告)日：2008-01-10

申请号：US11766785

申请日：2007-06-21

申请人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

发明人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/52

CPC分类号： H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system comprising: forming leads adjacent a die paddle having a die pad extension; forming a region having one of the leads depopulated for the die pad extension; and connecting an integrated circuit die to the die pad extension.

摘要翻译： 一种集成电路封装系统，包括：在具有管芯焊盘延伸部的管芯焊盘上形成引线; 形成具有用于芯片焊盘延伸的人造丝的一个引线的区域; 以及将集成电路管芯连接到管芯焊盘延伸部。

公开(公告)号：US08022514B2

公开(公告)日：2011-09-20

申请号：US12410463

申请日：2009-03-25

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Jeffrey D. Punzalan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Jeffrey D. Punzalan

IPC分类号： H01L23/48 ,  H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/49579 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/81141 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15151

摘要： An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support.

摘要翻译： 一种集成电路封装系统，包括形成具有预定高度的引线支架的引线的引线框架，并且以由引导板支撑件的预定高度确定的预定的折叠高度将集成电路管芯与电互连件连接。

公开(公告)号：US20070267731A1

公开(公告)日：2007-11-22

申请号：US11749693

申请日：2007-05-16

申请人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

发明人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

IPC分类号： H01L29/00 ,  H01L23/02 ,  H01L21/00

CPC分类号： H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system is provided including forming a first inner lead having a first inner bottom side and a first outer lead, forming a first side lock of the first inner lead above the first inner bottom side, connecting an integrated circuit die with the first inner lead and the first outer lead, and encapsulating the integrated circuit die and the first side lock.

摘要翻译： 提供一种集成电路封装系统，包括形成具有第一内底侧和第一外引线的第一内引线，在第一内底侧上形成第一内引线的第一侧锁，将集成电路管芯与第一内引线 内引线和第一外引线，并封装集成电路管芯和第一侧锁。

公开(公告)号：US08062934B2

公开(公告)日：2011-11-22

申请号：US11766785

申请日：2007-06-21

申请人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

发明人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

IPC分类号： H01L21/00

CPC分类号： H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system comprising: forming leads adjacent a die paddle having a die pad extension; forming a region having one of the leads depopulated for the die pad extension; and connecting an integrated circuit die to the die pad extension.

摘要翻译： 一种集成电路封装系统，包括：在具有管芯焊盘延伸部的管芯焊盘上形成引线; 形成具有用于芯片焊盘延伸的人造丝的一个引线的区域; 以及将集成电路管芯连接到管芯焊盘延伸部。

公开(公告)号：US20100264529A1

公开(公告)日：2010-10-21

申请号：US12823079

申请日：2010-06-24

申请人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Trasporto

发明人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Trasporto

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01L23/49503 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit package system includes: forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.

摘要翻译： 一种制造集成电路封装系统的方法包括：在所述板和所述外引线之间形成桨，外引线和内引线; 形成所述桨叶的非垂直桨叶边缘和所述内部导杆的面向所述非垂直桨叶边缘的非垂直前缘; 并将集成电路管芯封装在所述桨上。