公开(公告)号：US07901996B2

公开(公告)日：2011-03-08

申请号：US12484131

申请日：2009-06-12

申请人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Jeffrey D. Punzalan ,  Zigmund Ramirez Camacho

发明人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Jeffrey D. Punzalan ,  Zigmund Ramirez Camacho

IPC分类号： H01L21/00 ,  H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/3841 ,  Y10T29/49121 ,  Y10T29/49169 ,  Y10T29/49181

摘要： An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact pad having a chip support, and coupling the integrated circuit to the contact pad by the electrical interconnect, with the integrated circuit on the chip support.

摘要翻译： 提供具有互连支持的集成电路封装系统，包括提供集成电路，在集成电路上形成电互连，形成具有芯片支撑的接触焊盘，以及通过电互连将集成电路耦合到接触焊盘， 集成电路上的芯片支持。

公开(公告)号：US08569872B2

公开(公告)日：2013-10-29

申请号：US12166169

申请日：2008-07-01

申请人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Jose Alvin Caparas

发明人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Jose Alvin Caparas

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.

摘要翻译： 集成电路封装系统包括：提供具有预定义插槽的管芯焊盘和连接到管芯焊盘的集成电路; 使用接合线将集成电路连接到管芯焊盘; 用封装封装集成电路和接合线; 并且沿着单个轴将模具垫与部分锯隔离槽分隔开，并进入侧垫和模具附接垫。

公开(公告)号：US20100001384A1

公开(公告)日：2010-01-07

申请号：US12166169

申请日：2008-07-01

申请人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Jose Alvin Caparas

发明人： Henry Descalzo Bathan ,  Il Kwon Shim ,  Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Jose Alvin Caparas

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.

摘要翻译： 集成电路封装系统包括：提供具有预定义插槽的管芯焊盘和连接到管芯焊盘的集成电路; 使用接合线将集成电路连接到管芯焊盘; 用封装封装集成电路和接合线; 并且沿着单个轴将模具垫与部分锯隔离槽分隔开，并进入侧垫和模具附接垫。

公开(公告)号：US08803300B2

公开(公告)日：2014-08-12

申请号：US12889911

申请日：2010-09-24

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jeffrey D. Punzalan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jeffrey D. Punzalan

IPC分类号： H01L23/495

CPC分类号： H01L23/49582 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge.

摘要翻译： 一种制造集成电路封装系统的方法，包括：形成具有管芯连接板和通过连接件连接的接触焊盘的引线框架; 在芯片附接板上安装集成电路管芯; 在所述引线框架和所述集成电路管芯上形成封装主体，所述封装主体包括从所述封装主体露出的所述管芯附接板，所述接触焊盘和所述连接部分的部分; 通过蚀刻掉接触垫和管芯附接板之间的连接来形成暴露的边缘; 以及在暴露的边缘上沉积耐焊层。

公开(公告)号：US07777310B2

公开(公告)日：2010-08-17

申请号：US11670862

申请日：2007-02-02

申请人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Trasporto

发明人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Trasporto

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/49503 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.

摘要翻译： 提供一种集成电路封装系统，包括在所述桨和所述外引线之间形成桨，外引线和内引线; 形成所述桨叶的非垂直桨叶边缘和所述内部导杆的面向所述非垂直桨叶边缘的非垂直前缘; 并将集成电路管芯封装在所述桨上。

公开(公告)号：US20080185693A1

公开(公告)日：2008-08-07

申请号：US11670862

申请日：2007-02-02

申请人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Trasporto

发明人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Arnel Trasporto

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01L23/49503 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle.

摘要翻译： 提供一种集成电路封装系统，包括在所述桨和所述外引线之间形成桨，外引线和内引线; 形成所述桨叶的非垂直桨叶边缘和所述内部导杆的面向所述非垂直桨叶边缘的非垂直前缘; 并将集成电路管芯封装在所述桨上。

公开(公告)号：US08120150B2

公开(公告)日：2012-02-21

申请号：US11857402

申请日：2007-09-18

申请人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/44

CPC分类号： H01L23/49503 ,  H01L23/495 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system includes: forming a die-attach paddle, a terminal pad, and an external interconnect with the external interconnect below the terminal pad; connecting an integrated circuit die with the terminal pad and the external interconnect; and forming an encapsulation, having a first side and a second side at an opposing side to the first side, surrounding the integrated circuit die with the terminal pad exposed at the first side and the external interconnect extending below the second side.

摘要翻译： 集成电路封装系统包括：在端子焊盘下方形成管芯附接焊盘，端子焊盘和与外部互连的外部互连; 将集成电路管芯与端子焊盘和外部互连连接; 并且形成封装件，其具有与所述第一侧相对的一侧的第一侧和第二侧，围绕所述集成电路管芯，所述端子焊盘在所述第一侧暴露并且所述外部互连件延伸到所述第二侧的下方。

公开(公告)号：US08039947B2

公开(公告)日：2011-10-18

申请号：US11749693

申请日：2007-05-16

申请人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

发明人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system is provided including forming a first inner lead having a first inner bottom side and a first outer lead, forming a first side lock of the first inner lead above the first inner bottom side, connecting an integrated circuit die with the first inner lead and the first outer lead, and encapsulating the integrated circuit die and the first side lock.

摘要翻译： 提供一种集成电路封装系统，包括形成具有第一内底侧和第一外引线的第一内引线，在第一内底侧上形成第一内引线的第一侧锁，将集成电路管芯与第一内引线 内引线和第一外引线，并封装集成电路管芯和第一侧锁。

公开(公告)号：US20100140764A1

公开(公告)日：2010-06-10

申请号：US12328764

申请日：2008-12-04

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jeffrey D. Punzalan ,  Lionel Chien Hui Tay

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L23/4951 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83856 ,  H01L2224/85191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacture of a wire-on-lead package system includes: providing a die attach paddle with paddle extensions distributed along the periphery of the die attach paddle, providing leadfingers surrounding the die attach paddle, attaching a semiconductor die to the die attach paddle wherein the semiconductor die is larger than the die attach paddle, and connecting bond wires between the semiconductor die and the leadfingers and between the semiconductor die and the paddle extensions.

摘要翻译： 一种线引线封装系统的制造方法包括：提供具有沿芯片附接板周边分布的焊盘延伸部的管芯附接焊盘，提供围绕管芯附接焊盘的引线管，将半导体管芯附接到管芯附着焊盘 其中所述半导体管芯大于所述管芯附接焊盘，以及在所述半导体管芯和引线管之间以及所述半导体管芯和所述焊盘延伸部之间连接接合线。

公开(公告)号：US20080006929A1

公开(公告)日：2008-01-10

申请号：US11766785

申请日：2007-06-21

申请人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

发明人： Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/52

CPC分类号： H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system comprising: forming leads adjacent a die paddle having a die pad extension; forming a region having one of the leads depopulated for the die pad extension; and connecting an integrated circuit die to the die pad extension.

摘要翻译： 一种集成电路封装系统，包括：在具有管芯焊盘延伸部的管芯焊盘上形成引线; 形成具有用于芯片焊盘延伸的人造丝的一个引线的区域; 以及将集成电路管芯连接到管芯焊盘延伸部。